scholarly journals Development of Pb-Free Nanocomposite Solder Alloys

2018 ◽  
Vol 2 (2) ◽  
pp. 28 ◽  
Author(s):  
Animesh Basak ◽  
Alokesh Pramanik ◽  
Hamidreza Riazi ◽  
Mahyar Silakhori ◽  
Angus Netting
Keyword(s):  
Solder Alloys ◽  
Nanocomposite Solder

scholarly journals 40.1: Invited Paper: Use of flash lamps to achieve non‐equilibrium soldering and assembly using conventional solder alloys

2021 ◽  
Vol 52 (S1) ◽  
pp. 275-275
Author(s):  
Rudy Ghosh ◽  
Vahid Akhavan ◽  
Harry Chou ◽  
Vikram Turkani ◽  
Stan Farnsworth
Keyword(s):  
Solder Alloys ◽  
Non Equilibrium

Constitutive modeling of solder alloys for drop-impact applications

2016 ◽  
Vol 67 ◽  
pp. 135-142 ◽  
Author(s):  
E.H. Wong ◽  
J. Chrisp ◽  
C.S. Selvanayagam ◽  
S.K.W. Seah
Keyword(s):  
Constitutive Modeling ◽  
Drop Impact ◽  
Solder Alloys

Recrystallization and ${\rm Ag}_{3}{\rm Sn}$ Particle Redistribution During Thermomechanical Treatment of Bulk Sn–Ag–Cu Solder Alloys

2013 ◽  
Vol 3 (11) ◽  
pp. 1868-1875 ◽  
Author(s):  
Uttara Sahaym ◽  
Babak Talebanpour ◽  
Sean Seekins ◽  
Indranath Dutta ◽  
Praveen Kumar ◽  
...  
Keyword(s):  
Thermomechanical Treatment ◽  
Solder Alloys

Effect of magnetic field on microstructure and property of Ag-Sn solder alloys

2021 ◽  
pp. 130515
Author(s):  
Yu-qin Wu ◽  
Ze-an Tian ◽  
Fang Liu ◽  
Zi-Hou Yuan ◽  
Chen Wei ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Solder Alloys

scholarly journals Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1545
Author(s):  
Agata Skwarek ◽  
Olivér Krammer ◽  
Tamás Hurtony ◽  
Przemysław Ptak ◽  
Krzysztof Górecki ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Zno Nanoparticles ◽  
Composite Solder ◽  
Void Formation ◽  
Particle Sizes ◽  
Solder Paste ◽  
Solder Alloys ◽  
Ion Microscopy ◽  
Zno Ceramics ◽  
Thermoelectric Parameters

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag3Sn and Cu6Sn5 intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.

Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method

2011 ◽  
Vol 95 (11) ◽  
pp. 3001-3008 ◽  
Author(s):  
Matthias M. Koebel ◽  
Nancy El Hawi ◽  
Jia Lu ◽  
Felix Gattiker ◽  
Jürg Neuenschwander
Keyword(s):  
Liquid State ◽  
Anodic Bonding ◽  
Solder Alloys ◽  
Large Area

Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn–1Ag–0.5Cu solder alloys

2015 ◽  
Vol 622 ◽  
pp. 184-188 ◽  
Author(s):  
Dhafer Abdulameer Shnawah ◽  
Mohd Faizul Mohd Sabri ◽  
Irfan Anjum Badruddin ◽  
Suhana Binti Mohd Said ◽  
Mohamed Bashir Ali Bashir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Alloys

Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys

2008 ◽  
Vol 23 (12) ◽  
pp. 3303-3308 ◽  
Author(s):  
Chien-Neng Liao ◽  
Ching-Hua Lee
Keyword(s):  
Reaction Time ◽  
Layered Structure ◽  
Controlled Growth ◽  
Square Root ◽  
Solder Alloys ◽  
Cu Content ◽  
Cu Alloys ◽  
Diffusion Controlled ◽  
Morphology Changes

Reactions of molten Sn–xCu (x = 0.05 to 1.0) alloys with Te substrate at 250 °C were investigated. A dosage of 0.1 wt% Cu in Sn is found to be effective in suppressing the vigorous Sn/Te reaction by forming a thin CuTe at the solder/Te interface. The CuTe morphology changes from irregular clusters into a layered structure with increasing Cu content in Sn. With the same reaction time, the CuTe thickness increases proportionally to the square root of Cu content in Sn–Cu alloys, suggesting a diffusion-controlled growth for CuTe.

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