Constitutive modeling of solder alloys for drop-impact applications

2016 ◽  
Vol 67 ◽  
pp. 135-142 ◽  
Author(s):  
E.H. Wong ◽  
J. Chrisp ◽  
C.S. Selvanayagam ◽  
S.K.W. Seah
Keyword(s):  
Constitutive Modeling ◽  
Drop Impact ◽  
Solder Alloys

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

2008 ◽  
Vol 37 (6) ◽  
pp. 829-836 ◽  
Author(s):  
E.H. Wong ◽  
C.S. Selvanayagam ◽  
S.K.W. Seah ◽  
W.D. van Driel ◽  
J.F.J.M. Caers ◽  
...  
Keyword(s):  
Drop Impact ◽  
Solder Alloys ◽  
Stress Strain

Impact Test and Simulation of Portable Electronic Devices: An Assessment

2004 ◽  
Author(s):  
Sheng Liu ◽  
Xin Wu ◽  
Ronald Gibson ◽  
Xuefang Wang ◽  
Hong Hai Zhang ◽  
...  
Keyword(s):  
Constitutive Modeling ◽  
Insulin Pump ◽  
Electronic Devices ◽  
Drop Impact ◽  
Impact Performance ◽  
Portable Electronics ◽  
Rate Dependent ◽  
Nonlinear Contact ◽  
Drop Tests ◽  
Testing Standards

Portable electronics devices are well known to be susceptible to drop impact which can cause various damage modes such as interconnect breakage, battery separation, possible cracking/debonding along interfaces, display damage, leaking in insulin pump, etc., Drop/impact performance of these products is one of important concerns of product design. Because of the small size of this type of electronics products, it is very expensive, time-consuming and difficult to conduct drop tests to directly detect the failure mechanisms and identify their drop behaviors. A brief review is given in terms of the development in testing standards, material modeling and structure modeling. Barriers and needs are given for both the measurement and modeling, with particular attention to the material rate dependent constitutive modeling, testing facilities development, and nonlinear contact mechanics modeling.

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