scholarly journals A High-Precision Adaptive Thermal Network Model for Monitoring of Temperature Variations in Insulated Gate Bipolar Transistor (IGBT) Modules

Energies ◽  
2018 ◽  
Vol 11 (3) ◽  
pp. 595 ◽  
Author(s):  
Ning An ◽  
Mingxing Du ◽  
Zhen Hu ◽  
Kexin Wei
Energies ◽  
2019 ◽  
Vol 12 (7) ◽  
pp. 1319 ◽  
Author(s):  
Yao Chang ◽  
Wuhua Li ◽  
Haoze Luo ◽  
Xiangning He ◽  
Francesco Iannuzzo ◽  
...  

In this paper, the impact of a double-sided press-pack insulated-gate-bipolar-transistor (PP IGBT) cooling structure on its thermal impedance distribution is studied and explored. A matrix thermal impedance network model is built by considering the multi-chip thermal coupling effect for the collector side of the PP IGBT. Moreover, a verification has been made by comparing the proposed matrix thermal network model and the conventional lumped RC network model provided by the manufacturer. It is concluded that the collector side has lower thermal resistance and dissipates about 88% of the heat generated by the IGBT chips inside the module. Then, a modular-multilevel-converter high-voltage-direct-current (MMC-HVDC)-based type test setup composed of the press-pack IGBT stacks is established and the junction temperature is calculated with the proposed thermal model and verified by temperature measurements.


Author(s):  
Amir Sajjad Bahman ◽  
Ke Ma ◽  
Pramod Ghimire ◽  
Francesco Iannuzzo ◽  
Frede Blaabjerg

2021 ◽  
Vol 2070 (1) ◽  
pp. 012245
Author(s):  
Pritam V. Mali ◽  
Harshvardhan H. Patil ◽  
Girish B. Pawar ◽  
Yuvaraj P. Ballal ◽  
Pradip B. Patil

Abstract An electric motor, a battery and an inverter are the key components of any hybrid vehicle. The most commonly used switching device in the electric power conversion system is Insulated Gate Bipolar Transistor (IGBT) modules. Heat sinks with their fins are optimized to provide the maximum heat flow to the surrounding and Pure copper is used as it has high thermal conductivity with reasonable heat resistance. This helps to decrease the temperature of the IGBT and heat will spread to the fins. Parallel forced air cooling is utilised to give maximum possible heat removal rate. Further experimentation was done on a IGBT using an Inverter circuit and it was analyzed on ANSYS software and it was observed that the results obtained by numerical method and experimental method are approximately same.


2021 ◽  
Author(s):  
Yanzhong Tian ◽  
Tong An ◽  
Fei Qin ◽  
Yanpeng Gong ◽  
Chen Liang

Author(s):  
Mingyao Ma ◽  
Weisheng Guo ◽  
Xuesong Yan ◽  
Shuying Yang ◽  
Xing Zhang ◽  
...  

Author(s):  
Ning An ◽  
Mingxing Du ◽  
Zhen Hu ◽  
Kexin Wei

This paper proposes a novel method for optimizing the Cauer-type thermal network model considering both the temperature influence on the extraction of parameters and the errors caused by the physical structure. In terms of prediction of the transient junction temperature and the steady-state junction temperature, the parameters of conventional Cauer-type are modified, and the general method for estimating junction temperature is studied by using the adaptive thermal network model. The results show that junction temperature estimated by adaptive Cauer-type thermal network model is more accurate than that of the conventional model.


2020 ◽  
Vol 140 (9) ◽  
pp. 625-632
Author(s):  
Yoshiaki Taguchi ◽  
Satoshi Kadowaki ◽  
Gaku Yoshikawa ◽  
Kenji Hatakeda ◽  
Takashi Kaneko

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