scholarly journals A Compact UWB Bandpass Chip Filter on a GaAs Substrate with Modified Chebyshev Structure

Electronics ◽  
2020 ◽  
Vol 9 (2) ◽  
pp. 313
Author(s):  
Shanwen Hu ◽  
Yunqing Hu ◽  
Yiting Gao ◽  
Xiaodong Zhang ◽  
Xinlei Zhang ◽  
...  
Keyword(s):  
Gaas Substrate ◽  
Communication Systems ◽  
High Speed ◽  
Cost Effective ◽  
Dielectric Materials ◽  
Ultra Wideband ◽  
Portable Devices ◽  
Chip Size ◽  
Uwb Applications ◽  
Better Than

Ultra-Wideband (UWB) systems are widely used in low-power, high-speed, high-security short-range wireless communication systems throughout digital homes and offices. In the RF front-end of a UWB system, bandpass filters (BPFs) are used to put through the passband signals and reject the stopband signals. Most UWB BPFs are designed with dielectric materials on circuit boards or LTCC technology. In this paper, a very compact fully integrated UWB chip filter is proposed and designed on a GaAs substrate with nitride as dielectric layers to meet the small size requirement of portable devices for next-generation UWB applications. The filter is constructed with a modified Chebyshev structure. The final filter circuit contains only four inductors instead of six for the conventional Chebyshev filter, which makes the chip more compact and cost effective. The filter is designed and fabricated on a 0.25 μm GaAs pHEMT technology with a chip size of only 0.73 mm × 0.51 mm including the chip edge and scribe line area, while the filter core area is only 0.61 mm × 0.39 mm, including bonding PADs. The measurement results illustrated that the proposed BPF shows a passband covering the frequency range of 3.1–9.0 GHz, the minimum passband insertion loss is only 1.5 dB, the stopband rejection is better than −30 dB throughout frequencies below 2 GHz and above 12 GHz, S11 is less than −16 dB, and S22 is better than −11 dB during the whole passband range. It demonstrated that the proposed filter can be considered as one of the most compact UWB filters.

300mm Large Scale eWLB(embedded Wafer Level BGA) : Cost Effective Solution with Performance

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001046-001070
Author(s):  
Seung Wook Yoon ◽  
Yaojian Lin ◽  
Pandi C. Marimuthu ◽  
Yeong J. Lee
Keyword(s):  
Large Scale ◽  
Low Cost ◽  
Cost Effective ◽  
Batch Process ◽  
Dielectric Materials ◽  
Design Parameters ◽  
Wafer Level ◽  
Molding Compound ◽  
Package Size ◽  
Chip Size

Demand for Wafer Level Package (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. The increasing demand for new and more advanced electronic products with smaller form factor, superior functionality and performance is driving the integration of functionality into the third dimension. There are some restrictions in possible applications for fan-in WLPs since global chip trends tend toward smaller chip areas with an increasing number of interconnects. The shrinkage of the pitches and pads at the chip to package interface is happening much faster than the shrinkage at the package to board interface. This interconnection gap requires fan-out packaging, where the package size is larger than the chip size in order to provide a sufficient area to accommodate the 2nd level interconnects. eWLB is a type of fan-out WLP that has the potential to realize any number of interconnects with standard pitches at any shrink stage of the wafer node technology. 200mm eWLB is in HVM from industry last three years and there was need to move 300mm for scaling-up and low-cost solutions. This paper will highlight some of the recent advancements in large scale 300mm eWLB development. Compared to 200mm case, 300mm has more warpage and process issues due to its area increase. Thermo-mechanical simulation shows 100~150% more warpage with 300mm compared to 200mm. So various design parameters were studied to optimized warpage, such as dielectric materials and thickness, molding compound thickness etc. This paper presents study of process optimization for 300mm eWLB and mechanical characterization, reliability data including component/board level, challenges encountered and overcome, and future steps of scalability for higher throughput and manufacturability.

Optoelectronic Packaging for Computer and Communication Systems

1993 ◽  
Vol 323 ◽  
Author(s):  
H. F. Lockwood ◽  
C. A. Armiento
Keyword(s):  
Communication Systems ◽  
High Performance ◽  
Cost Effective ◽  
Hybrid Integration ◽  
Printed Wiring Board ◽  
Single Chip ◽  
Chip Size ◽  
Wiring Board ◽  
On Chip ◽  
The Cost

AbstractThe principal driver behind advanced hardware development in the communications and computer industries can be reduced to an optimal set of parameters related to performance, cost and reliability. High performance systems typically have high functional density. For example, the continuing trend of VLSI is toward reduced feature size, increased wiring density and larger chip size to achieve increasingly higher levels of on-chip functionality. At some point in the cost structure, however, the single chip solution is no longer viable, and monolithic integration gives way to hybrid integration. In this respect, the multichip module fills a void in the packaging/ integration hierarchy between the ever-larger single chip and the printed wiring board.An analogous situation is emerging in optoelectronics. The single chip package with its relatively low system functionality and high cost is giving way to the multi-technology module that integrates optical and electronic functions within a single package. One of the most interesting approaches to the multi-technology module uses a silicon substrate as the platform for hybrid integration of electronics and optoelectronics. It will be argued that this “silicon waferboard” approach is the cost-effective route to manufacturability of high-performance modules for communications and computer systems. Enhanced reliability follows from applying standard IC processing technology at the platform level in the packaging hierarchy.

scholarly journals Simulation and manufacturing of modified circular monopole microstrip antenna for UWB applications

2021 ◽  
Vol 10 (1) ◽  
pp. 70
Author(s):  
Bilal S. Taha ◽  
Hamzah M. Marhoon
Keyword(s):  
Computer Simulation ◽  
Microstrip Antenna ◽  
High Speed ◽  
Reasonable Agreement ◽  
Ultra Wideband ◽  
Simulation Process ◽  
High Speed Data ◽  
Simulation Results ◽  
Compact Design ◽  
Uwb Applications

Ultra-wideband (UWB) technology is one of the most promising wireless communication solutions to be developed quickly because of the high-speed data, wide bandwidth and excellent immunity to multipath interference. In this work, the compact design of a modified circular monopole microstrip antenna is simulated and manufactured for the UWB applications. The simulation process of the proposed antenna was done based on the finite integration of the Computer Simulation Technology (CST) Microwave Studio (MWS). The proposed antenna comprises a copper radiating patch, Roger’s Kappa-438 substrate, and a single stub act as a reflector. The simulation results showed a reasonable agreement with the results of the measurement and good performance was achieved in the range from 1.8 to 10 GHz with VSWR less than 2.0.

scholarly journals Developing Cost-Effective and High-Speed 40 Gbps FSO Systems Incorporating Wavelength and Spatial Diversity Techniques

2021 ◽  
Vol 9 ◽  
Author(s):  
Satish Kumar Modalavalasa ◽  
Rajan Miglani ◽  
Sushank Chaudhary ◽  
Faisel Tubbal ◽  
Raad Raad
Keyword(s):  
Communication Systems ◽  
High Speed ◽  
Performance Metrics ◽  
Cost Effective ◽  
Data Access ◽  
Spatial Diversity ◽  
End Users ◽  
Atmospheric Effects ◽  
Free Space Optical ◽  
Optical Processing

Free-space optical (FSO) communication systems are being anticipated to offer promising alternatives to existing radio networks in delivering high-speed data access to end-users. Ease of installation, robust features, and cost-effective operation have been the hallmark of FSO systems, and these features will play an obvious role in deciding the ways in which futuristic smart communication models will operate. Despite these arrays of features, FSO links suffer severe performance degradation due to channel-induced impairments caused by atmospheric effects such as rain, haze, and fog. In this work, we have investigated and compared the performance of 40 Gbps FSO links for different channel conditions ranging from clear weather to severe attenuation by incorporating spatial and wavelength diversity as performance booster techniques. The use of an erbium-doped fiber amplifier (EDFA) with FSO links has also been proposed here. Using performance metrics like bit error rate (BER) and eye patterns, it has been found that the use of EDFA not only helps in compensating for the link losses but also aids in realizing an all-optical processing based last-mile access system. The proposed FSO system will be capable of bridging the existing backbone fiber networks with end-users with minimal changes to the existing hardware regime, thereby proving to be extremely cost-effective in sharp contrast to radio-frequency generations which require major infrastructure overhaul.

scholarly journals E-Commerce applications using Web-Services

2020 ◽  
Author(s):  
Sailesh Tirumala ◽  
Yatesh Laxman Kumar Gumma ◽  
Seethamraju Phaneendra, ◽  
Jinan Fiaidhi
Keyword(s):  
Web Services ◽  
Communication Systems ◽  
High Speed ◽  
Cost Effective ◽  
Application Development ◽  
Business Transactions ◽  
Time Space ◽  
Effective Manner ◽  
Business Application ◽  
Business Entities

Web-Services can be referred as a family of technologies that standardized the communication of applications through world wide web in a cost-effective manner. Few of the major software vendors like IBM, Microsoft, Oracle, SAP are all embracing the web service standards into the newer versions of their applications which are web services enabled. All the constrains like cost, time, space for discovering, and e-business transactions can be solved easily by using web-services. With the introduction of these Web services design of the business application to provide service, integrating with other business entities, and conducting business transactions completely changed the working of a business organization. These web-services became a viable component in distributed E-Commerce platforms. In determining server response time, high speed communication systems along with computing capacity and network latency have become important. In web technologies a new model of architecture for distributed E-Commerce applications has been proposed which aims at integration and inter-operation between different platforms. In this paper we have proposed a model for developing an E-Commerce application using the Spring framework which helps in easy integration with other frameworks and solves most difficulties in an enterprise application development.<br>

scholarly journals Marine Internet for Internetworking in Oceans: A Tutorial

2019 ◽  
Vol 11 (7) ◽  
pp. 146 ◽  
Author(s):  
Shengming Jiang
Keyword(s):  
Human Activities ◽  
Communication Systems ◽  
High Speed ◽  
Cost Effective ◽  
Weather Conditions ◽  
Internet Services ◽  
Network Access ◽  
Communication Quality ◽  
High Speed Network ◽  
Oceanic Environments

Ever-increasing human activities in oceans require handy, reliable and cost-effective high-speed network access similar to terrestrial Internet services to be available on and under water. However, terrestrial Internet cannot be extended to oceans seamlessly due to huge differences between terrestrial and oceanic environments, while satellite services are still very expensive especially for ordinary users with communication quality susceptible to weather conditions, and cannot cover underwater networks either. Therefore, marine Internet, proposed about six years ago, is the earliest scheme that tries to systematically address the internetworking issue in oceans and still in its infancy stage. This tutorial aims to introduce the principle, architecture and applications of marine Internet, along with discussion on oceanic environments for communication, currently available and under developing communication systems in oceans, as well as challenging issues necessary for further studies to foster the development of marine Internet.

scholarly journals E-Commerce applications using Web-Services

2020 ◽  
Author(s):  
Sailesh Tirumala ◽  
Yatesh Laxman Kumar Gumma ◽  
Seethamraju Phaneendra, ◽  
Jinan Fiaidhi
Keyword(s):  
Web Services ◽  
Communication Systems ◽  
High Speed ◽  
Cost Effective ◽  
Application Development ◽  
Business Transactions ◽  
Time Space ◽  
Effective Manner ◽  
Business Application ◽  
Business Entities

Web-Services can be referred as a family of technologies that standardized the communication of applications through world wide web in a cost-effective manner. Few of the major software vendors like IBM, Microsoft, Oracle, SAP are all embracing the web service standards into the newer versions of their applications which are web services enabled. All the constrains like cost, time, space for discovering, and e-business transactions can be solved easily by using web-services. With the introduction of these Web services design of the business application to provide service, integrating with other business entities, and conducting business transactions completely changed the working of a business organization. These web-services became a viable component in distributed E-Commerce platforms. In determining server response time, high speed communication systems along with computing capacity and network latency have become important. In web technologies a new model of architecture for distributed E-Commerce applications has been proposed which aims at integration and inter-operation between different platforms. In this paper we have proposed a model for developing an E-Commerce application using the Spring framework which helps in easy integration with other frameworks and solves most difficulties in an enterprise application development.<br>

scholarly journals A compact disc loaded curved elliptical shaped ultra-wideband MIMO antenna

2018 ◽  
Vol 7 (2.7) ◽  
pp. 597
Author(s):  
EVV Satyanarayana ◽  
Vivek Kumar ◽  
D Mallikarjun Reddy ◽  
T Siva Paravathi ◽  
J Chandrasekhar Rao
Keyword(s):  
Common Ground ◽  
Coplanar Waveguide ◽  
Impedance Matching ◽  
Ground Plane ◽  
Multiple Input Multiple Output ◽  
Wide Band ◽  
Ultra Wideband ◽  
Portable Devices ◽  
Mimo Antenna ◽  
Uwb Applications

The ultra wide band (UWB) Multiple-Input- Multiple-Output (MIMO) antenna with coplanar waveguide (CPW) having size of 18 x 23 x 0.8mm3 is designed for ultra-wideband (UWB) applications. The designed MIMO antenna contains two symmetrical circular disc loaded curved elliptical monopoles on top of the substrate and common ground plane with Y slot and extended T-shaped stub on bottom of substrate. The T- shape stub is placed on the ground plane to have the better antenna impedance matching and to enhance the isolation between the two antenna ports. To further improve the isolation in between the ports 1 and 2, and also on the ground plane a Y-shaped slot is fixed. Good impedance matching (|S11| < -10dB) in the range from 2.8GHz to 12 GHz is provided by the proposed antenna, and an enhanced isolation of -27dB, low ECC of below 0.002, an acceptable gain of about 7 dBi and an efficiency of above 90%. The obtained result proves that the designed antenna is more appropriate for the portable devices.  

Fractal-Inspired Ultra-Wideband Diversity Slot Antenna for Wireless Communication Systems

2019 ◽  
pp. 103-130
Author(s):  
Anirban Karmakar ◽  
Anuradha Saha
Keyword(s):  
Communication Systems ◽  
Multiple Input Multiple Output ◽  
Ultra Wideband ◽  
Slot Antenna ◽  
Wireless Communication Systems ◽  
Impedance Bandwidth ◽  
Input Multiple Output ◽  
Orthogonal Orientation ◽  
Uwb Applications ◽  
Minkowski Fractal

A novel compact ultra-wideband (UWB) multiple-input multiple-output (MIMO) slot antenna with band notch characteristics is presented for portable wireless UWB applications. The antenna comprises of co-planar waveguide feed (CPW) and two radiating monopoles oriented in orthogonal orientation for providing orthogonal radiation patterns. A Minkowski fractal parasitic stub along with a Minkowski fractal grounded stub has been placed at 45° between the monopoles to reduce the coupling between them, which in turn establishes high isolation between the radiators. An excellent band notch characteristic is obtained at 5.5 GHz by etching a modified E-shaped compact slot on the radiators. Results show that the designed antenna meets -10 dB impedance bandwidth and -17 dB isolation throughout the entire operating band (3.1 -12 GHz). Novelty of this design lies in improving isolation using fractal which occupies less space in compared to other isolation mechanisms in MIMO structures. The simulated and measured results depict that the proposed antenna is convenient for MIMO diversity systems.

Sign in / Sign up

Export Citation Format

Share Document