scholarly journals Integrated Building Cells for a Simple Modular Design of Electronic Circuits with Reduced External Complexity: Performance, Active Element Assembly, and an Application Example

Electronics ◽  
2019 ◽  
Vol 8 (5) ◽  
pp. 568 ◽  
Author(s):  
Roman Sotner ◽  
Jan Jerabek ◽  
Ladislav Polak ◽  
Roman Prokop ◽  
Vilem Kledrowetz

This paper introduces new integrated analog cells fabricated in a C035 I3T25 0.35-μm ON Semiconductor process suitable for a modular design of advanced active elements with multiple terminals and controllable features. We developed and realized five analog cells on a single integrated circuit (IC), namely a voltage differencing differential buffer, a voltage multiplier with current output in full complementary metal–oxide–semiconductor (CMOS) form, a voltage multiplier with current output with a bipolar core, a current-controlled current conveyor of the second generation with four current outputs, and a single-input and single-output adjustable current amplifier. These cells (sub-blocks of the manufactured IC device), designed to operate in a bandwidth of up to tens of MHz, can be used as a construction set for building a variety of advanced active elements, offering up to four independently adjustable internal parameters. The performances of all individual cells were verified by extensive laboratory measurements, and the obtained results were compared to simulations in the Cadence IC6 tool. The definition and assembly of a newly specified advanced active element, namely a current-controlled voltage differencing current conveyor transconductance amplifier (CC-VDCCTA), is shown as an example of modular interconnection of the selected cells. This device was implemented in a newly synthesized topology of an electronically linearly tunable quadrature oscillator. Features of this active element were verified by simulations and experimental measurements.

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 353
Author(s):  
Bin Zhang ◽  
Hongsheng Liu ◽  
Dezhi Li ◽  
Jinhui Liang ◽  
Jun Gao

Energy harvesting using piezoceramic has drawn a lot of attention in recent years. Its potential usage in microelectromechanical systems is starting to become a reality thanks to the development of an integrated circuit. An accurate equivalent circuit of piezoceramic is important in energy harvesting and the sensing system. A piezoceramic is always considered to be a current source according to empirical testing, instead of the derivation from its piezoelectric characteristics, which lacks accuracy under complicated mechanical excitation situations. In this study, a new current output model is developed to accurately estimate its value under various kinds of stimulation. Considering the frequency, amplitude and preload variation imposed on a piezoceramic, the multivariate model parameters are obtained in relation to piezo coefficients. Using this model, the current output could be easily calculated without experimental testing in order to quickly estimate the output power in energy harvesting whatever its geometric shape and the various excitations.


2021 ◽  
Vol 25 (2) ◽  
pp. 65-76
Author(s):  
Tajinder Singh Arora ◽  

This research article explores the possible applications of voltage differencing current conveyor (VDCC), as a current mode universal filter and a sinusoidal oscillator. Without the need for an additional active/passive element, a very simple hardware modification makes it a dual-mode quadrature oscillator from the filter configuration. Both the proposed circuit requires only two VDCC and all grounded passive elements, hence a preferable choice for integration. The filter has some desirable features such as availability of all five explicit outputs, independent tunability of filter parameters. Availability of explicit quadrature current outputs, independence in start and frequency of oscillations, makes it a better oscillator design. Apart from prevalent CMOS simulation results, VDCC is also realized and experimentally tested using the off-the-shelf integrated circuit. All the pen and paper analysis such as non-ideal, sensitivity and parasitic analysis supports the design.


Author(s):  
Widianto Widianto ◽  
Lailis Syafaah ◽  
Nurhadi Nurhadi

In this paper, effects of process variations in a HCMOS (High-Speed Complementary Metal Oxide Semiconductor) IC (Integrated Circuit) are examined using a Monte Carlo SPICE (Simulation Program with Integrated Circuit Emphasis) simulation. The variations of the IC are L and VTO variations. An evaluation method is used to evaluate the effects of the variations by modeling it using a normal (Gaussian) distribution. The simulation results show that the IC may be detected as a defective IC caused by the variations based on large supply currents flow to it. 


Sensors ◽  
2020 ◽  
Vol 20 (12) ◽  
pp. 3391
Author(s):  
Francelino Freitas Carvalho ◽  
Carlos Augusto de Moraes Cruz ◽  
Greicy Costa Marques ◽  
Kayque Martins Cruz Damasceno

Targeting 3D image reconstruction and depth sensing, a desirable feature for complementary metal oxide semiconductor (CMOS) image sensors is the ability to detect local light incident angle and the light polarization. In the last years, advances in the CMOS technologies have enabled dedicated circuits to determine these parameters in an image sensor. However, due to the great number of pixels required in a cluster to enable such functionality, implementing such features in regular CMOS imagers is still not viable. The current state-of-the-art solutions require eight pixels in a cluster to detect local light intensity, incident angle and polarization. The technique to detect local incident angle is widely exploited in the literature, and the authors have shown in previous works that it is possible to perform the job with a cluster of only four pixels. In this work, the authors explore three novelties: a mean to determine three of four Stokes parameters, the new paradigm in polarization cluster-pixel design, and the extended ability to detect both the local light angle and intensity. The features of the proposed pixel cluster are demonstrated through simulation program with integrated circuit emphasis (SPICE) of the regular Quadrature Pixel Cluster and Polarization Pixel Cluster models, the results of which are compliant with experimental results presented in the literature.


Micromachines ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 65
Author(s):  
Wenhao Zhi ◽  
Qingxiao Quan ◽  
Pingping Yu ◽  
Yanfeng Jiang

Photodiode is one of the key components in optoelectronic technology, which is used to convert optical signal into electrical ones in modern communication systems. In this paper, an avalanche photodiode (APD) is designed and fulfilled, which is compatible with Taiwan Semiconductor Manufacturing Company (TSMC) 45-nm standard complementary metal–oxide–semiconductor (CMOS) technology without any process modification. The APD based on 45 nm process is beneficial to realize a smaller and more complex monolithically integrated optoelectronic chip. The fabricated CMOS APD operates at 850 nm wavelength optical communication. Its bandwidth can be as high as 8.4 GHz with 0.56 A/W responsivity at reverse bias of 20.8 V. Its active area is designed to be 20 × 20 μm2. The Simulation Program with Integrated Circuit Emphasis (SPICE) model of the APD is also proposed and verified. The key parameters are extracted based on its electrical, optical and frequency responses by parameter fitting. The device has wide potential application for optical communication systems.


Nanophotonics ◽  
2017 ◽  
Vol 6 (6) ◽  
pp. 1343-1352 ◽  
Author(s):  
Chuantong Cheng ◽  
Beiju Huang ◽  
Xurui Mao ◽  
Zanyun Zhang ◽  
Zan Zhang ◽  
...  

AbstractOptical receivers with potentially high operation bandwidth and low cost have received considerable interest due to rapidly growing data traffic and potential Tb/s optical interconnect requirements. Experimental realization of 65 GHz optical signal detection and 262 GHz intrinsic operation speed reveals the significance role of graphene photodetectors (PDs) in optical interconnect domains. In this work, a novel complementary metal oxide semiconductor post-backend process has been developed for integrating graphene PDs onto silicon integrated circuit chips. A prototype monolithic optoelectronic integrated optical receiver has been successfully demonstrated for the first time. Moreover, this is a firstly reported broadband optical receiver benefiting from natural broadband light absorption features of graphene material. This work is a perfect exhibition of the concept of monolithic optoelectronic integration and will pave way to monolithically integrated graphene optoelectronic devices with silicon ICs for three-dimensional optoelectronic integrated circuit chips.


2019 ◽  
Vol 10 (1) ◽  
pp. 63 ◽  
Author(s):  
Yongsu Kwon ◽  
Hyungseup Kim ◽  
Jaesung Kim ◽  
Kwonsang Han ◽  
Donggeun You ◽  
...  

A fully differential multipath current-feedback instrumentation amplifier (CFIA) for a resistive bridge sensor readout integrated circuit (IC) is proposed. To reduce the CFIA’s own offset and 1/f noise, a chopper stabilization technique is implemented. To attenuate the output ripple caused by chopper up-modulation, a ripple reduction loop (RRL) is employed. A multipath architecture is implemented to compensate for the notch in the chopping frequency band of the transfer function. To prevent performance degradation resulting from external offset, a 12-bit R-2R digital-to-analog converter (DAC) is employed. The proposed CFIA has an adjustable gain of 16–44 dB with 5-bit programmable resistors. The proposed resistive sensor readout IC is implemented in a 0.18 μm complementary metal-oxide-semiconductor (CMOS) process. The CFIA draws 169 μA currents from a 3.3 V supply. The simulated input-referred noise and noise efficiency factor (NEF) are 28.3 nV/√Hz and 14.2, respectively. The simulated common-mode rejection ratio (CMRR) is 162 dB, and the power supply rejection ratio (PSRR) is 112 dB.


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