scholarly journals RF Pogo-Pin Probe Card Design Aimed at Automated Millimeter-Wave Multi-Port Integrated-Circuit Testing

Electronics ◽  
2021 ◽  
Vol 10 (19) ◽  
pp. 2446
Author(s):  
K. M. Lee ◽  
J. H. Oh ◽  
M. S. Kim ◽  
T. S. Kim ◽  
M. Kim

A prototype RF probe card is assembled to test the feasibility of Pogo-pins as robust probe tips for the automized testing of multiple-port millimeter-wave circuits. A custom-made ceramic housing machined from a low-loss dielectric holds an array of 157 Pogo-pins, each with 2.9 mm-length in fixed positions. The ceramic housing is then mounted onto a probe-card PCB for power-loss measurements on two signal-ground Pogo-pin connections arbitrarily selected from the array. The probing results on a test circuit with a simple thru-line indicate a successful power transfer with a small insertion loss of less than 0.5 dB per single Pogo-pin connection up to 25 GHz. A new probe card design using shorter Pogo-pins is being prepared to extend the operation frequency to beyond 40 GHz.

2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.


1999 ◽  
Author(s):  
Theodore R. Hoelter ◽  
Blake A. Henry ◽  
John H. Graff ◽  
Naseem Y. Aziz

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