scholarly journals LT-AlSb Interlayer as a Filter of Threading Dislocations in GaSb Grown on (001) GaAs Substrate Using MBE

Crystals ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 628
Author(s):  
Agata Jasik ◽  
Jacek Ratajczak ◽  
Iwona Sankowska ◽  
Andrzej Wawro ◽  
Dariusz Smoczyński ◽  
...  
Keyword(s):  
Comparative Analysis ◽  
Low Temperature ◽  
Dislocation Density ◽  
Gaas Substrate ◽  
Periodic Array ◽  
Crystal Quality ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Threading Dislocation Density

We report on the role of AlSb material in the reduction of threading dislocation density (TDD) in the GaSb/AlSb/GaAs system. The AlSb layers were grown using low-temperature (LT) MBE, exploiting the interfacial misfit (IMF) dislocation array. AlSb layers with four different thicknesses in the range of 1–30 nm were investigated. The results showed the inhibiting role of LT-AlSb layers in the reduction of TDD. Values of TDD as low as 2.2 × 106 and 6.3 × 106 cm−2 for samples with thin and thick AlSb layers were obtained, respectively. The filtering role of AlSb material was proven despite the IMF-AlSb/GaAs interface’s imperfectness caused by the disturbance of a 90° dislocation periodic array by, most likely, 60° dislocations. The dislocation lines confined to the region of AlSb material were visible in HRTEM images. The highest crystal quality and smoother surface of 1.0 μm GaSb material were obtained using 9 nm thick AlSb interlayer. Unexpectedly, the comparative analysis of the results obtained for the GaSb/LT-AlSb/GaAs heterostructure and our best results for the GaSb/GaAs system showed that the latter can achieve both higher crystal quality and lower dislocation density.

Relaxed Si0.7Ge0.3 layers grown on low-temperature Si buffers with low threading dislocation density

1997 ◽  
Vol 71 (21) ◽  
pp. 3132-3134 ◽  
Author(s):  
J. H. Li ◽  
C. S. Peng ◽  
Y. Wu ◽  
D. Y. Dai ◽  
J. M. Zhou ◽  
...  
Keyword(s):  
Low Temperature ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Threading Dislocation Density

Role of substrate threading dislocation density in relaxation of highly strained InGaAs/GaAs quantum well structures

1990 ◽  
Vol 56 (14) ◽  
pp. 1350-1352 ◽  
Author(s):  
J. F. Klem ◽  
W. S. Fu ◽  
P. L. Gourley ◽  
E. D. Jones ◽  
T. M. Brennan ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Quantum Well ◽  
Threading Dislocation ◽  
Quantum Well Structures ◽  
Threading Dislocation Density ◽  
Highly Strained

Cantilever Epitaxy of GaN on Sapphire: Further Reductions in Dislocation Density

2002 ◽  
Vol 743 ◽  
Author(s):  
D. M. Follstaedt ◽  
P. P. Provencio ◽  
D. D. Koleske ◽  
C. C. Mitchell ◽  
A. A. Allerman ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Processing Conditions ◽  
Optimum Growth ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Threading Dislocation Density

ABSTRACTThe density of vertical threading dislocations at the surface of GaN grown on sapphire by cantilever epitaxy has been reduced with two new approaches. First, narrow mesas (<1 μm wide) were used and {11–22} facets formed over them early in growth to redirect dislocations from vertical to horizontal. Cross-sectional transmission electron microscopy was used to demonstrate this redirection and to identify optimum growth and processing conditions. Second, a GaN nuc-leation layer with delayed 3D → 2D growth transition and inherently lower threading dislocation density was adapted to cantilever epitaxy. Several techniques show that a dislocation density of only 2–3×107/cm2 was achieved by combining these two approaches. We also suggest other developments of cantilever epitaxy for reducing dislocations in heteroepitaxial systems.

Crystalline Quality Evaluation of SiC p/n Column Layers Formed by Trench-Filling-Epitaxial Growth

2020 ◽  
Vol 1004 ◽  
pp. 445-450
Author(s):  
Kohei Adachi ◽  
Ryoji Kosugi ◽  
Shi Yang Ji ◽  
Yasuyuki Kawada ◽  
Hiroyuki Fujisawa ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Epitaxial Growth ◽  
Epitaxial Layer ◽  
Quality Evaluation ◽  
Crystalline Quality ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Threading Dislocation Density

We evaluated crystalline quality of SiC p/n column layers over 20 μm thickness formed by trench-filling-epitaxial growth. Although threading dislocation density of trench-filling-epitaxial layer is almost same as flat n-type epitaxial layer, threading dislocations are localized in only trench-filled p-columns. We consider that threading dislocations migrated toward p-columns around trench bottom during trench-filling-epitaxial growth.

scholarly journals Single-Crystalline Si1−xGex (x = 0.5~1) Thin Films on Si (001) with Low Threading Dislocation Density Prepared by Low Temperature Molecular Beam Epitaxy

2019 ◽  
Vol 9 (9) ◽  
pp. 1772
Author(s):  
Gu ◽  
Zhao ◽  
Ye ◽  
Deng ◽  
Lu
Keyword(s):  
Thin Films ◽  
Molecular Beam Epitaxy ◽  
Low Temperature ◽  
Dislocation Density ◽  
Molecular Beam ◽  
Strain Relaxation ◽  
Relaxation Mechanism ◽  
Threading Dislocation ◽  
Threading Dislocation Density ◽  
Typical Strain

Single-crystalline Si1−xGex thin films on Si (100) with low threading dislocation density (TDD) are highly desired for semiconductor industrials. It is challenging to suppress the TDD since there is a large mismatch (4.2%) between Ge and Si—it typically needs 106–107/cm2 TDD for strain relaxation, which could, however, cause device leakage under high voltage. Here, we grew Si1−xGex (x = 0.5–1) films on Si (001) by low temperature molecular beam epitaxy (LT-MBE) at 200 °C, which is much lower than the typical temperature of 450–600 °C. Encouragingly, the Si1−xGex thin films grown by LT-MBE have shown a dramatically reduced TDD down to the 103–104/cm2 level. Using transmission electron microscopy (TEM) with atomic resolution, we discovered a non-typical strain relaxation mechanism for epitaxial films grown by LT-MBE. There are multiple-layered structures being introduced along out-of-plane-direction during film growth, effectively relaxing the large strain through local shearing and subsequently leading to an order of magnitude lower TDD. We presented a model for the non-typical strain relaxation mechanism for Si1−xGex films grown on Si (001) by LT-MBE.

Threading Dislocations in S-Graded ZnSxSe1-x/GaAs (001) Metamorphic Buffer Layers

2014 ◽  
Vol 23 (01n02) ◽  
pp. 1420005 ◽  
Author(s):  
Tedi Kujofsa ◽  
John E. Ayers
Keyword(s):  
Dislocation Density ◽  
Buffer Layer ◽  
Lattice Relaxation ◽  
Buffer Layers ◽  
Cumulative Distribution ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Modeling Studies ◽  
Threading Dislocation Density ◽  
Dislocation Behavior

Metamorphic semiconductor devices are commonly fabricated with linearly-graded buffer layers, but equilibrium modeling studies suggest that S-graded buffers, following a normal cumulative distribution function, may enable lower threading defect densities. The present work involves a study of threading dislocation density behavior in S-graded ZnS x Se 1-x buffer layers for metamorphic devices on mismatched GaAs (001) substrates using a kinetic model for lattice relaxation and misfit-threading dislocation interactions. The results indicate that optimization of an S-graded buffer layer to minimize the surface threading dislocation density requires adjustment of the standard deviation parameter and cannot be achieved by varying the buffer thickness alone. Furthermore, it is possible to tailor the design of the S-graded buffer layer in such a way that the density of mobile threading dislocations at the surface vanishes. Nonetheless, the threading dislocation behavior in these heterostructures is quite complex, and a full understanding of their behavior will require further experimental and modeling studies.

Dislocation Density Reduction in GaAs Epilayers on Si Using Strained Layer Superlattices

1989 ◽  
Vol 160 ◽  
Author(s):  
S. Sharan ◽  
J. Narayan ◽  
J. C. C. Fan
Keyword(s):  
Dislocation Density ◽  
Defect Density ◽  
Full Potential ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Strained Layer ◽  
Density Reduction ◽  
Threading Dislocation Density ◽  
Superlattice Structures ◽  
Strained Layer Superlattices

AbstractDefects such as dislocations and interfaces play a crucial role in the performance of heterostracture devices. The full potential of GaAs on Si heterostructures can only be realized by controlling the defect density. The reduction of threading dislocations by the use of strained layer superlattices has been studied in these heterostructures. Several superlattice structures have been used to reduce the density of threading dislocations in the GaAs epilayer. The use of strained layer superlattices in conjunction with rapid thermal annealing was most effective in reducing threading dislocation density. Transmission electron microscopy has been used to study the dislocation density reduction and the interaction of threading dislocations with the strained layers. A model has been developed based on energy considerations to determine the critical thickness required for the bending of threading dislocations.

Impact of Surface Morphology above Threading Dislocations on Leakage Current in 4H-SiC Diodes

2012 ◽  
Vol 717-720 ◽  
pp. 911-916 ◽  
Author(s):  
Fujiwara Hirokazu ◽  
T. Katsuno ◽  
Tsuyoshi Ishikawa ◽  
H. Naruoka ◽  
Masaki Konishi ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Leakage Current ◽  
Electric Fields ◽  
Schottky Diodes ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Nano Scale ◽  
Threading Dislocation Density ◽  
Positive Correlations ◽  
The Impact

The impact of threading dislocation density on the leakage current of reverse IV characteristics in 1.2 kV Schottky barrier diodes (SBDs), junction barrier Schottky diodes (JBSDs), and PN junction diodes (PNDs) was investigated. The leakage current density and threading dislocation density have different positive correlations in each type of diode. For example, the correlation in SBDs is strong, but weak in PNDs. The threading dislocations were found to be in the same location as the current leakage points in the SBDs, but not in the PNDs. Nano-scale inverted cone pits were observed at the Schottky junction interface in SBDs, and it was found that leakage current increases in these diodes due to the concentration of electric fields at the peaks of the pits. These nano-scale pits were also observed directly above threading dislocations. In addition, this study succeeded in reducing the leakage current variation of 200 A-class JBSDs and SBDs by eliminating the nano-scale pits above the threading dislocations. As a result, a theoretical straight-line waveform was achieved.

High-Irradiance Degradation Studies of Metamorphic 1eV GaInAs Solar Cells

2012 ◽  
Vol 1432 ◽  
Author(s):  
Ryan M. France ◽  
Myles A. Steiner
Keyword(s):  
Solar Cells ◽  
Active Region ◽  
Dislocation Density ◽  
Dark Current ◽  
Degradation Mechanism ◽  
Control Cell ◽  
High Irradiance ◽  
Threading Dislocation ◽  
Threading Dislocation Density ◽  
Degradation Studies

ABSTRACTInitial tests are performed regarding the degradation of lattice-mismatched GaInAs solar cells. 1eV metamorphic GaInAs solar cells with 1-2×106 cm-2 threading dislocation density in the active region are irradiated with an 808 nm laser for 2 weeks time under a variety of temperature and illumination conditions. All devices show a small degradation in Voc that is logarithmic with time. The absolute loss in performance after 2 weeks illuminated at 1300 suns equivalent and 125°C is 7 mV Voc and 0.2% efficiency, showing these devices to be relatively stable. The dark current increases with time and is analyzed with a two-diode model. A GaAs control cell degrades at the same rate, suggesting that the observed degradation mechanism is not related to the additional dislocations in the GaInAs devices.

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