Dislocation Density Reduction in GaAs Epilayers on Si Using Strained Layer Superlattices

1989 ◽  
Vol 160 ◽  
Author(s):  
S. Sharan ◽  
J. Narayan ◽  
J. C. C. Fan

AbstractDefects such as dislocations and interfaces play a crucial role in the performance of heterostracture devices. The full potential of GaAs on Si heterostructures can only be realized by controlling the defect density. The reduction of threading dislocations by the use of strained layer superlattices has been studied in these heterostructures. Several superlattice structures have been used to reduce the density of threading dislocations in the GaAs epilayer. The use of strained layer superlattices in conjunction with rapid thermal annealing was most effective in reducing threading dislocation density. Transmission electron microscopy has been used to study the dislocation density reduction and the interaction of threading dislocations with the strained layers. A model has been developed based on energy considerations to determine the critical thickness required for the bending of threading dislocations.

2015 ◽  
Vol 44 (5) ◽  
pp. 1287-1292 ◽  
Author(s):  
Dmitry M. Artemiev ◽  
Tatiana S. Orlova ◽  
Vladislav E. Bougrov ◽  
Maxim A. Odnoblyudov ◽  
Alexei E. Romanov

2002 ◽  
Vol 743 ◽  
Author(s):  
D. M. Follstaedt ◽  
P. P. Provencio ◽  
D. D. Koleske ◽  
C. C. Mitchell ◽  
A. A. Allerman ◽  
...  

ABSTRACTThe density of vertical threading dislocations at the surface of GaN grown on sapphire by cantilever epitaxy has been reduced with two new approaches. First, narrow mesas (<1 μm wide) were used and {11–22} facets formed over them early in growth to redirect dislocations from vertical to horizontal. Cross-sectional transmission electron microscopy was used to demonstrate this redirection and to identify optimum growth and processing conditions. Second, a GaN nuc-leation layer with delayed 3D → 2D growth transition and inherently lower threading dislocation density was adapted to cantilever epitaxy. Several techniques show that a dislocation density of only 2–3×107/cm2 was achieved by combining these two approaches. We also suggest other developments of cantilever epitaxy for reducing dislocations in heteroepitaxial systems.


1997 ◽  
Vol 484 ◽  
Author(s):  
H.-Y. Wei ◽  
L. Salamanca-Riba ◽  
N. K. Dhar

CdTe epilayers were grown by molecular beam epitaxy on As-passivated nominal (211) Si substrates using thin interfacial ZnTe layers. By using thin recrystallized (initially amorphous) ZnTe buffei layers, we utilized migration enhanced epitaxy (MEE) in the ZnTe layer and overcome the tendency toward three dimensional nucleation. The threading dislocation densities in 8–9 tm thick CdTe films deposited on the recrystallized amorphous ZnTe films were in the range of 2 to 5 × 105 cm−2. In addition to the reduction of threading dislocation density, the interface between the ZnTe layers and the Si substrate is much smoother and the microtwin density is an order of magnitude lower than in regular MEE growth. In order to understand the initial nucleation mechanism of the ZnTe on the As precursor Si surface, we also grew ZnTe epilayers on Te precursor treated Si substrates. The growth mode, microtwin density, and threading dislocation density are compared for films grown on Si substrates with different surface precursors and grown by different growth methods.


2020 ◽  
Vol 1004 ◽  
pp. 445-450
Author(s):  
Kohei Adachi ◽  
Ryoji Kosugi ◽  
Shi Yang Ji ◽  
Yasuyuki Kawada ◽  
Hiroyuki Fujisawa ◽  
...  

We evaluated crystalline quality of SiC p/n column layers over 20 μm thickness formed by trench-filling-epitaxial growth. Although threading dislocation density of trench-filling-epitaxial layer is almost same as flat n-type epitaxial layer, threading dislocations are localized in only trench-filled p-columns. We consider that threading dislocations migrated toward p-columns around trench bottom during trench-filling-epitaxial growth.


1989 ◽  
Vol 145 ◽  
Author(s):  
P.N. Uppal ◽  
J.S. Ahearn ◽  
R. Herring

AbstractThe density and arrangement of dislocations in In0.15Ga0.85As grown on GaAs(100)) were determined by transmission electron microscopy as a function of misorientation toward (111)A, (111)B, and (110). Strained layer superlattices were used in all cases to reduce dislocation density. Layers grown on exact GaAs(100) exhibited a non-uniform threading dislocation dis- tribution whereby some areas had a high density (∼ 109cm-2or higher) of dislocation tangles and other areas that we in between had a more uniform density (∼ 2 x 107cm-2). The misorientated layers exhibited a uniform threading dislocation distribution with densities of ∼ 5 x 106 cm-2 for (100) misoriented towards (111)A, ∼ 1 x 107cm-2towards (111)B, and ∼ 3 x 107cm-2 towards (110). The misfit dislocation network (dislocations located at the GaAs-InO0.15Ga0.85 As interface) formed orthogonal dislocation arrays in the case of exact (100) substrates and slightly non-ortho- gonal arrays in the case of misoriented substrates. These results are explained with the help of a general glide model of strain relaxation in which the exact (100) orientation has eight equally stressed glide systems which presumably activate during strain relaxation. With misoriented substrates the stress symmetry is broken and fewer glide systems experience the maximum stress, thus reducing the number of active dislocation systems. A small asymmetry in interfacial dis- location density was observed in all the cases where the linear dislocation density along the two (011) and (011) orthogonal directions differed by about 20%. This is explained by the preferred activation of (x-dislocations (high dislocation mobility) over 13-dislocations (low dislocation mobility).


2006 ◽  
Vol 203 (10) ◽  
pp. R76-R78 ◽  
Author(s):  
T. Lang ◽  
M. A. Odnoblyudov ◽  
V. E. Bougrov ◽  
A. E. Romanov ◽  
S. Suihkonen ◽  
...  

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