scholarly journals Influence of the Curing and Annealing Temperatures on the Properties of Solution Processed Tin Oxide Thin Films

Crystals ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 851
Author(s):  
Christophe Avis ◽  
Jin Jang
Keyword(s):  
Grain Size ◽  
Carrier Concentration ◽  
Tin Oxide ◽  
Annealing Temperature ◽  
Optical Transmittance ◽  
Curing Temperature ◽  
Electrical And Optical Properties ◽  
Solution Processed ◽  
Annealing Temperatures ◽  
Grain Sizes

We report the effect of the curing (Tcuring) and annealing (Tanneal) temperatures on the structural, electrical, and optical properties of solution processed tin oxide. Tanneal was varied from 300 to 500 °C, and Tcuring from 200 °C to Tanneal. All Tanneal lead to a polycrystalline phase, but the amorphous phase was observed at Tanneal = 300 °C and Tcuring ranging from 250 to 300 °C. This could be explained by the melting point of the precursor (SnCl2), occurring at 250 °C. The crystallinity can be effectively controlled by the annealing temperature, but the curing temperature dramatically affects the grain size. We can reach grain sizes from 5–10 nm (Tcuring = 200 °C and Tanneal = 300 °C) to 30–50 nm (Tcuring = 500 °C and Tanneal = 500 °C). At a fixed Tanneal, Hall mobilities, carrier concentration, and conductivity increased with the curing temperature. The Hall mobility was in the range of 1 to 9.4 cm2/Vs, the carrier concentration was 1018 to 1019 cm−3, and the conductivity could reach ~20 S/cm when the grain size was 30–50 nm. The optical transmittance, the optical bandgap, the refractive index, and the extinction coefficient were also analyzed and they show a correlation with the annealing process.

scholarly journals Thermal effect of annealing-temperature on solution-processed high-k ZrO2 dielectrics

RSC Advances ◽  
2019 ◽  
Vol 9 (72) ◽  
pp. 42415-42422 ◽  
Author(s):  
Shangxiong Zhou ◽  
Jianhua Zhang ◽  
Zhiqiang Fang ◽  
Honglong Ning ◽  
Wei Cai ◽  
...  
Keyword(s):  
Thermal Effect ◽  
Spin Coating ◽  
Zirconium Oxide ◽  
Annealing Temperature ◽  
Solution Processed ◽  
Annealing Temperatures ◽  
Post Annealing ◽  
High K

In this paper, a solution-processed zirconium oxide (ZrO2) dielectric was deposited by spin coating with varying pre-annealing temperatures and post-annealing temperatures.

ZrN Diffusion Barrier in Aluminum Metallization Schemes

1982 ◽  
Vol 18 ◽  
Author(s):  
L. Krusin-Elbaum ◽  
M. Wittmer ◽  
C.-Y. Ting ◽  
J. J. Cuomo
Keyword(s):  
Grain Size ◽  
Diffusion Barrier ◽  
Annealing Temperature ◽  
Barrier Properties ◽  
Metal Nitrides ◽  
X Ray ◽  
Annealing Temperatures ◽  
Fine Grain ◽  
Transmission Electron ◽  
Aluminum Metallization

We have studied reactively sputtered ZrN, the most thermally stable of the refractory metal nitrides, for its diffusion barrier properties in aluminum metallization schemes with Rutherford backscattering spectroscopy and transmission electron microscopy (TEM). We find this compound to be very effective against aluminum diffusion up to 500 °C, independently of substrate temperature during sputtering. The useful temperature range can be extended by 50 °C with proper preannealing prior to aluminum deposition. The TEM study of the ZrN grain size as a function of annealing temperature revealed that the grain size does not change significantly upon annealing and that the grains are relatively small even at the highest annealing temperatures (about 300 Å at 900 °C). In addition, for annealing temperatures of and below 500 °C large portions of ZrN films were found to be of either amorphous or extremely fine–grain material, thus inhibiting the diffusion along grain boundaries. The presence of Zr3Al4Si5 ternary compound in samples annealed at 600 °C, as determined by X-ray analysis, may suggest that the ZrN barrier fails by decomposition of the film by aluminum.

Effects of Annealing Temperature on Electrical Characteristics of Solution-Processed Zinc Tin Oxide Thin-Film Transistors

2012 ◽  
Vol 51 (6R) ◽  
pp. 061101 ◽  
Author(s):  
Jeong-Soo Lee ◽  
Yong-Jin Kim ◽  
Yong-Uk Lee ◽  
Yong-Hoon Kim ◽  
Jang-Yeon Kwon ◽  
...  
Keyword(s):  
Thin Film ◽  
Tin Oxide ◽  
Thin Film Transistors ◽  
Annealing Temperature ◽  
Oxide Thin Film ◽  
Electrical Characteristics ◽  
Solution Processed ◽  
Zinc Tin Oxide

EFFECT OF ANNEALING TEMPERATURE ON THE STRUCTURE AND AC MAGNETIC PROPERTIES OF Fe73Cu1Nb3.5-xVxSi13.5B9 (x = 1.0, 1.5, 2.0) NANOCRYSTALLINE SOFT MAGNETIC ALLOYS

2013 ◽  
Vol 27 (19) ◽  
pp. 1341013
Author(s):  
WEI LU ◽  
PING HUANG ◽  
YUXIN WANG ◽  
BIAO YAN
Keyword(s):  
Magnetic Properties ◽  
Strong Influence ◽  
Annealing Temperature ◽  
Iron Loss ◽  
Soft Magnetic ◽  
Magnetic Alloys ◽  
Annealing Temperatures ◽  
Grain Sizes ◽  
Soft Magnetic Alloys ◽  
Nanocrystalline Soft Magnetic Alloys

In this paper, Nb element was partially replaced by V element in Finemet-type Fe 73 Cu 1 Nb 3.5-x V x Si 13.5 B 9 (x = 1, 1.5, 2) alloys and the effect of annealing temperatures on the microstructure and AC magnetic properties of the samples are studied. The annealing temperatures affect the grain sizes of the bcc α- Fe phase greatly. When the annealing temperature is between 540–560°C, the samples have better AC magnetic properties than the samples annealed at other temperatures. The optimized annealing temperature of the studied samples is around 560°C. The coercivity and iron loss of the V2 sample is a little bit higher than that of V1 and V1.5 alloys while the amplitude permeability of V2 alloy is larger than that of V1 and V1.5, which indicate that the content of V element has strong influence on the magnetic properties of nanocrystalline soft magnetic alloys.

Recrystallisation Behaviour of an Fe-Mn-C-Si-Al TWIP

2012 ◽  
Vol 715-716 ◽  
pp. 649-654 ◽  
Author(s):  
Lieven Bracke ◽  
Nieves Cabañas-Poy
Keyword(s):  
Grain Size ◽  
Cold Rolling ◽  
Annealing Temperature ◽  
Twip Steel ◽  
Rolling Texture ◽  
Annealing Temperatures ◽  
Twip Steels ◽  
Cold Rolled ◽  
Main Components ◽  
Cold Rolling Texture

The static recrystallisation behaviour of cold rolled and annealed TWinning Induced Plasticity (TWIP) steels is important for its industrial production. The recrystallisation kinetics have been determined for an Fe-Mn-C-Si-Al TWIP steel using hardness measurements and microstructure analysis: it has been shown that recrystallisation progresses rapidly with increased annealing temperature. Recrystallisation was faster at higher cold reductions, and a smaller final grain size was observed at lower annealing temperatures. This indicates that the mechanism is nucleation dominated at lower temperatures; grain growth at higher temperatures appears similar for all reductions. The recrystallisation results in a crystallographic texture where the main components of the cold rolling texture are preserved in the final texture after annealing, although some randomisation was observed.

Grain-Size Effects and the Physical Properties of La0.7Ca0.3MnO3-δ

2005 ◽  
Vol 277-279 ◽  
pp. 929-934 ◽  
Author(s):  
H.K. Lee ◽  
Horst Baier ◽  
J.S. Park ◽  
Y.P. Lee ◽  
Youn Seoung Lee
Keyword(s):  
Grain Size ◽  
Magnetic Properties ◽  
Transition Temperature ◽  
Physical Properties ◽  
Size Effects ◽  
Annealing Temperature ◽  
Oxygen Deficiency ◽  
Metal Insulator Transition ◽  
Metal Insulator ◽  
Grain Sizes

The effects of grain-size in La0.7Ca0.3MnO3-δ (LCMO) system have been studied in connection with the magnetic and electronic properties. LCMO system prepared by the solid-state reaction was annealed in air at 1200, 1300 and 1400°C. The grain sizes of LCMO samples become larger with increasing of annealing temperature (TA ). The magnetization in LCMO samples increased while the coercive field decreased with increasing TA. The conductivity increased and the metal-insulator transition temperature TM-I decreased with increasing of TA. These physical properties are due to the oxygen deficiency caused by the increase of grain size. Finally, it was found that the grain size and the mechanical connection between grains play an important role in determining the electronic and magnetic properties.

Thermal Stability and Mechanical Properties of Nanocrystalline L12 Al3Hf and (Al+12.5 at.%Zn)3Hf Prepared by MA and SPS

2004 ◽  
Vol 449-452 ◽  
pp. 809-812 ◽  
Author(s):  
Chang Won Kang ◽  
Hee Sup Jang ◽  
Seon Jin Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Fracture Toughness ◽  
Phase Transformation ◽  
Grain Growth ◽  
Annealing Temperature ◽  
Annealing Temperatures ◽  
Grain Sizes ◽  
Plasma Sintering ◽  
Spark Plasma

Thermal stability and mechanical properties of L12 Al3Hf and (Al+12.5 at.%Zn))3Hf synthesized by mechanical alloying(MA) and spark plasma sintering(SPS) were investigated. Nanocrystalline L12 phase was produced after MA for 8 and 10 hrs in Al3Hf and (Al+12.5 at.%Zn))3Hf powders, respectively. The grain sizes were reduced to about 10 nm in both systems after MA for 20 hrs. After SPS, L12 phase was maintained only in Zn added system. In (Al+12.5 at.%Zn))3Hf, L12 to D023 phase transformation was started at about 850°C and finished at about 1150°C Microhardness was decreased with increasing the annealing temperature while fracture toughness was increased due to the grain growth. Fracture toughness of (Al+12.5 at.%Zn))3Hf was greater than that of Al3Hf in all annealing temperatures. Fracture toughness of (Al+12.5 at.%Zn))3Hf after annealing at 1200°C was about 5.38 MPam1/2.

Effect of Si Content on Thermal Stability of CrAl(Si)N Coatings

2015 ◽  
Vol 799-800 ◽  
pp. 448-451 ◽  
Author(s):  
Zhi Tong Chen ◽  
Guang Jian Peng ◽  
Yuan Xia ◽  
Guang Li
Keyword(s):  
Thermal Stability ◽  
Annealing Temperature ◽  
Mechanical Behaviors ◽  
Annealing Temperatures ◽  
Grain Sizes ◽  
Si Content ◽  
Surface Morphologies ◽  
Thermal Stability Of

The effect of annealing temperatures on surface morphologies, microstructure, and mechanical behaviors of CrAlSiN coatings with different Si content was investigated. EDX, XRD and SEM were employed to reveal the compositions and microstructure of CrAlSiN coatings. For Si content ≤8.6%, grain sizes reduced with temperature increasing to 400°C and then increased with further increase in temperature. For Si content ≥10.7%, grain sizes gradually reduced with annealing temperature increasing. When the annealing temperature arrived at 400°C, the hardness of CrAlSiN coatings with different Si content was much higher than as deposited. While the annealing further increased to 800°C, the hardness of CrAlSiN coatings with Si content ≤8.6% reduced, but the hardness of CrAlSiN coatings with Si content ≥10.7% continued to increase.

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