scholarly journals Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

Crystals ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 173
Author(s):  
Panpan Zhang ◽  
Ke Zhang ◽  
Shuliang Dou ◽  
Jiupeng Zhao ◽  
Xiangqiao Yan ◽  
...  

Several kinds of polyimide (PI) films stemmed out of 4, 4’–diaminodiphenyl ether, as well as various structurally various aromatic dianhydride, were prepared. The films’ mechanical, dielectric, and dynamic mechanical attributes were put under investigation. According the findings, the PI films’ performance is significantly different as a result of their diverse structure. PI’s dielectric constant and dielectric loss tangent of abides by the increasing order below: PMDA-PI>BTDA-PI>BPDA-PI. Moreover, the electric breakdown strength of BTDA-PI (478.90 kV/mm) presents a lot higher value compared to the one PMDA-PI (326.80 kV/mm) and BPDA-PI (357.07 kV/mm). In particular, BTDA-PI film possesses high electric breakdown strength about 478.90 kV/mm. In addition, PI’s glass transition temperature (Tg) are, respectively, 276 °C (BTDA-PI), and 290 °C (BPDA-PI), as well as 302 °C (PMDA-PI). Therefore, in virtue of their various structures and performances, practical applications of PI films can exert significant role in the electronics and microelectronics industries.

1997 ◽  
Vol 476 ◽  
Author(s):  
P. H. Townsend ◽  
S. J. Martin ◽  
J. Godschalx ◽  
D. R. Romer ◽  
D. W. Smith ◽  
...  

AbstractA novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits. The coating is applied to the substrate as an oligomeric solution, SiLK*, using conventional spin coating equipment and produces highly uniform films after curing at 400 °C to 450 °C. The oligomeric solution, with a viscosity of ca. 30 cPs, is readily handled on standard thin film coating equipment. Polymerization does not require a catalyst. There is no water evolved during the polymerization. The resulting polymer network is an aromatic hydrocarbon with an isotropie structure and contains no fluorine.The properties of the cured films are designed to permit integration with current ILD processes. In particular, the rate of weight-loss during isothermal exposures at 450 °C is ca. 0.7 wt.%/hour. The dielectric constant of cured SiLK has been measured at 2.65. The refractive index in both the in-plane and out-of-plane directions is 1.63. The flow characteristics of SiLK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm. The glass transition temperature for the fully cured film is greater than 490 °C. The coefficient of thermal expansivity is 66 ppm/°C below the glass transition temperature. The stress in fully cured films on Si wafers is ca. 60 MPa at room temperature. The fracture toughness measured on thin films is 0.62 MPa m ½. Thin coatings absorb less than 0.25 wt.% water when exposed to 80% relative humidity at room temperature.


2016 ◽  
Vol 29 (2) ◽  
pp. 141-150 ◽  
Author(s):  
K Ilango ◽  
P Prabunathan ◽  
E Satheeshkumar ◽  
P Manohar

In this present work, porous mullites (PM0–5) were synthesized through a template-assisted method using various weight percentages of pluronic (P-123). PM5 obtained using 10 wt% of P-123 was found to show maximum porosity (3.8 Å) and low dielectric constant value (2.4). PM5 was functionalized using glycidyl-terminated silane and denoted as FPM and various weight percentages of FPM were reinforced with polybenzoxazine (PBZ) matrix in order to develop FPM/PBZ nanocomposites. The thermal studies indicate that 1.5 wt% of FPM/PBZ nanocomposite showed improved thermal stability with 34% char yield at 800°C and 162°C as glass transition temperature. It also exhibits low dielectric constant (2.6) than that of the neat PBZ matrix and other FPM/PBZ nanocomposites. The microscopic analysis confirms the homogenous dispersion of FPM into the PBZ polymer that has a porous morphology. The results suggest that the as-synthesized mesoporous mullite with low dielectric constant ( k), synthesized via template-assisted method can be used as a reinforcement to decrease the dielectric constant of polymeric material, which is of industrial significance.


1997 ◽  
Vol 476 ◽  
Author(s):  
N. R. Grove ◽  
P. A. Kohl ◽  
S. A. Bidstrup-Allen ◽  
R. A. Shick ◽  
B. L. Goodall ◽  
...  

AbstractWithin the microelectronics industry, there is an ongoing trend toward miniaturization coupled with higher performance. The scaling of transitors toward smaller dimensions, higher speeds, and lower power has resulted in an urgent need for low dielectric constant interlevel insulators. Low dielectric constant interlevel dielectrics have already been identified as being critical to the realization of high performance integrated circuits in the SLA Roadmap. Thus, there exists a need in the microelectronics industry for a thermally stable, noncorrosive low dielectric constant polymer with good solvent resistance, high glass transition temperature, good mechanical performance and good adhesive properties, particularly to copper. In addition, the desired dielectric material should be capable of being processed in environmentally friendly solvents, and the final thermal and electrical performance should not be affected by manufacturing or post environmental conditions. High glass transition temperature polynorbornenes are being developed which provide many of these desired features. This polymer family is produced via a new transition metal catalyzed polymerization. Attributes which make polynorbornene particularly attractive in microelectronics include: (i) excellent thermal performance, (ii) adhesion to conductors without the use of adhesion promoters or barrier layers, (iii) very low moisture absorption (< 0.1 wt %), and (iv) low dielectric constant (2.2 – 2.6). Side groups which have been added to the polynorbornene backbone improve adhesion, dielectric properties and mechanical properties.


2015 ◽  
Vol 1119 ◽  
pp. 292-295
Author(s):  
Vu Thanh Phuong ◽  
Maria Beatrice Coltelli ◽  
Irene Anguillesi ◽  
Patrizia Cinelli ◽  
Andrea Lazzeri

In order to improve the thermal stability of PLA based materials it was followed the strategy of blending it with a polymer having a higher glass transition temperature such as poly (carbonate) of bisphenol A (PC) . PLA/PC blends with different compositions were by melt extrusion produced also in the presence of an interchange reaction catalyst, tetrabutylammonium tetraphenylborate (TBATPB) and triacetin. The dynamical mechanical thermal characterization showed an interesting change of the storage modulus behavior in the PLA glass transition region, evident exclusively in the catalyzed blends. In particular, a new peak in the Tan δ trend at a temperature in between the one of PLA and the one of PC was observed only in the blends obtained in the presence of triacetin and TBATPB. The height and maximum temperature of the peak was different after the annealing of samples at 80°C. The data showed an interesting improvement of thermal stability above the PLA glass transition, this was explained keeping into account the formation of PLA-PC copolymer during the reactive extrusion. Furthermore, the glass transition temperature of the copolymer as a function of composition was studied and the obtained trend was discussed by comparing with literature models developed for copolymers.


2017 ◽  
Vol 19 (40) ◽  
pp. 27442-27451 ◽  
Author(s):  
Yao Fu ◽  
Vera Bocharova ◽  
Mengze Ma ◽  
Alexei P. Sokolov ◽  
Bobby G. Sumpter ◽  
...  

Backbone rigidity, counterion size and the static dielectric constant affect the glass transition temperature, segmental relaxation time and decoupling between counterion and segmental dynamics in significant manners.


2004 ◽  
Vol 851 ◽  
Author(s):  
Ramón Artiaga ◽  
Ricardo Cao ◽  
Salvador Naya ◽  
Ana García

ABSTRACTThis work applies different thermal analysis methods to polymer based materials degradation, studying the degradation process itself and evaluating the degree of material damage as a consequence of chemical degradation by thermal or radiation effects. On the one hand, thermal degradation in varied atmospheres is investigated by means of thermogravimetric analysis (TGA) in dynamic experiments. The authors find that the evolution of the sample mass follows a mixture of logistics models, and these can fit an overall TGA curve. The fitting parameters have important physical meaning related to the kinetics of the different processes involved and to the relative amount of each component in the sample. The method itself entails separating overlapping processes. Other improvements made by the authors are related to reducing the noise and smoothing the TGA and differential scanning calorimetry (DSC) data, particularly when estimating TGA derivatives through logistic regression.Analyzing many materials by means of TGA results in more or less complex traces that do not allow a simple parametric fit like the one described above. Although it reproduces asymptoticity at the beginning and end of the reaction, there are times when many processes overlap, resulting in a complex trace that would need a high number of logistic components to be adequately fitted. However, it is possible to use a local polynomial regression model instead. This is also applicable to DSC traces, whose shapes are totally different from those found in TGA. The authors propose a model based on a nonparametric estimation, where the fit's suitability very much depends on the bandwidth selection, especially where derivatives are concerned. The proposed model gives a satisfactory fitting. It smoothes noise and always provides reliable values, different from those obtained by other methods strongly dependent on user choice.On the other hand, to evaluate the degree of damage by thermal analysis methods, dynamic mechanical analysis (DMA) is applied to polyamides. The glass transition temperature is measured before and after exposure to varying doses of proton radiation, emulating the space environment. Other examples show how exposure over long periods at moderately elevated temperatures results in reduction of some mechanical properties. Additionally, the effect of different nanofillers on styrene-isoprene-styrene block copolymers is evaluated by DMA. A shift in the glass transition temperature seems to be dependent on nanofiller content. The degradation of some materials suitable for space applications, such as polyethylene and polyamide, are also briefly reviewed.


2019 ◽  
Vol 23 (Suppl. 1) ◽  
pp. 193-202
Author(s):  
Aysegul Adiguzel ◽  
Fatih Cakar ◽  
Bahire Senkal ◽  
Ozlem Cankurtaran ◽  
Yesim Gursel ◽  
...  

The novel chalcone modified poly (styrene) based polymer (PVBC-DMAC) has been prepared and characterized. By using the inverse gas chromatography method, we determined glass transition temperature and surface properties of PVBC-DMAC. The obtained glass transition temperature, Tg, is a good agree with the one obtained by differential scanning calorimetry. Also considering some isomeric alcohol and acetate solvents in the temperature range from 303.2 K to 353.2 K, we investigated the polymer selectivity. The parameters KA(acidic) and KD(basic) of the PVBC-DMAC surface were calculated. The obtained KA, KD values reflected that PVBC-DMAC surface has a basic character.


2021 ◽  
pp. 1002-1007
Author(s):  
Jennifer Imbrogno ◽  
Kazuya Maruyama ◽  
Frederick Rivers ◽  
Jacob R. Baltzegar ◽  
Zidan Zhang ◽  
...  

Polymers ◽  
2021 ◽  
Vol 13 (22) ◽  
pp. 4038
Author(s):  
Muhammad Usman Khan ◽  
Muhammad Abas ◽  
Sahar Noor ◽  
Bashir Salah ◽  
Waqas Saleem ◽  
...  

The utilization of composite materials is increasing at a growing rate in almost all types of products, due to their strength-to-stiffness ratio. From this perspective, natural waste composites, i.e., wood waste composites, have also been investigated for their effective and sustainable employment. This paper deals with the application of hard and soft wood waste (i.e., acacia and cedar wood) with epoxy resin polymer to develop high strength and thermally stable wood composites. Mechanical (tensile, flexural, impact, and hardness) and thermal properties of samples are studied using Differential Scanning Calorimeter (DSC) and Thermo Gravimetric Analysis (TGA), respectively. The properties are evaluated by varying the type of wood waste and its percentage by weight. Based on the Taguchi Orthogonal Array Mixture Design, eighteen experiments are investigated. Analysis of variance (ANOVA) results show that wood waste type and wood waste content have a significant effect on all mechanical properties. From the TGA analysis, it is predicted that both types of wood waste composites exhibit similar thermal-induced degradation profiles in terms of the initial and final degradation temperatures. From the DSC results, higher glass transition temperature Tg is detected in 10% of the hardwood waste composite, and a reducing tendency of glass transition temperature Tg is observed with exceeding wood waste content. Moreover, hardwood waste at 10% demonstrated improved decomposition temperature Td, due to strong adhesion between waste and matrix.


Catalysts ◽  
2018 ◽  
Vol 8 (9) ◽  
pp. 393 ◽  
Author(s):  
Sudakar Padmanaban ◽  
Sivanesan Dharmalingam ◽  
Sungho Yoon

The terpolymerization of propylene oxide (PO), CO2, and a lactone is one of the prominent sustainable procedures for synthesizing thermoplastic materials at an industrial scale. Herein, the one-pot terpolymerization of PO, CO2, and β-butyrolactone (BBL) was achieved for the first time using a heterogeneous nano-sized catalyst: zinc glutarate (ZnGA-20). The reactivity of both PO and BBL increased with the CO2 pressure, and the polyester content of the terpolymer poly (carbonate-co-ester) could be tuned by controlling the infeed ratio of PO to BBL. When the polyester content increased, the thermal stability of the polymers increased, whereas the glass transition temperature (Tg) decreased.


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