scholarly journals An FCM–GABPN Ensemble Approach for Material Feeding Prediction of Printed Circuit Board Template

2019 ◽  
Vol 9 (20) ◽  
pp. 4455 ◽  
Author(s):  
Shengping Lv ◽  
Rongheng Xian ◽  
Denghui Li ◽  
Binbin Zheng ◽  
Hong Jin

Accurate prediction of material feeding before production for a printed circuit board (PCB) template can reduce the comprehensive cost caused by surplus and supplemental feeding. In this study, a novel hybrid approach combining fuzzy c-means (FCM), feature selection algorithm, and genetic algorithm (GA) with back-propagation networks (BPN) was developed for the prediction of material feeding of a PCB template. In the proposed FCM–GABPN, input templates were firstly clustered by FCM, and seven feature selection mechanisms were utilized to select critical attributes related to scrap rate for each category of templates before they are fed into the GABPN. Then, templates belonging to different categories were trained with different GABPNs, in which the separately selected attributes were taken as their inputs and the initial parameter for BPNs were optimized by GA. After training, an ensemble predictor formed with all GABPNs can be taken to predict the scrap rate. Finally, another BPN was adopted to conduct nonlinear aggregation of the outputs from the component BPNs and determine the predicted feeding panel of the PCB template with a transformation. To validate the effectiveness and superiority of the proposed approach, the experiment and comparison with other approaches were conducted based on the actual records collected from a PCB template production company. The results indicated that the prediction accuracy of the proposed approach was better than those of the other methods. Besides, the proposed FCM–GABPN exhibited superiority to reduce the surplus and/or supplemental feeding in most of the case in simulation, as compared to other methods. Both contributed to the superiority of the proposed approach.

2018 ◽  
Vol 2018 ◽  
pp. 1-17 ◽  
Author(s):  
Shengping Lv ◽  
Binbin Zheng ◽  
Hoyeol Kim ◽  
Qiangsheng Yue

Improving the accuracy of material feeding for printed circuit board (PCB) template orders can reduce the overall cost for factories. In this paper, a data mining approach based on multivariate boxplot, multiple structural change model (MSCM), neighborhood component feature selection (NCFS), and artificial neural networks (ANN) was developed for the prediction of scrap rate and material feeding optimization. Scrap rate related variables were specified and 30,117 samples of the orders were exported from a PCB template production company. Multivariate boxplot was developed for outlier detection. MSCM was employed to explore the structural change of the samples that were finally partitioned into six groups. NCFS and ANN were utilized to select scrap rate related features and construct prediction models for each group of the samples, respectively. Performances of the proposed model were compared to manual feeding, ANN, and the results indicate that the approach exhibits obvious superiority to the other two methods by reducing surplus rate and supplemental feeding rate simultaneously and thereby reduces the comprehensive cost of raw material, production, logistics, inventory, disposal, and delivery tardiness compensation.


2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.


Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.


Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.


Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.


Author(s):  
Norman J. Armendariz ◽  
Prawin Paulraj

Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI) to attach to a printed circuit board (PCB) and survive various assembly and reliability test conditions for end-use deployment. Intel is pro-actively preparing for this anticipated Pb ban, by evaluating a new lead free (LF) solder alloy in the ternary Tin- Silver-Copper (Sn4.0Ag0.5Cu) system and developing higher temperature board assembly processes. This will be pursued with a focus on achieving the lowest process temperature required to avoid deleterious higher temperature effects and still achieve a metallurgically compatible solder joint. One primary factor is the elevated peak reflow temperature required for surface mount technology (SMT) LF assembly, which is approximately 250 °C compared to present eutectic tin/lead (Sn37Pb) reflow temperatures of around 220 °C. In addition, extended SMT time-above-liquidus (TAL) and subsequent cooling rates are also a concern not only for the critical BGA chipsets and CPU BGA sockets but to other components similarly attached to the same PCB substrate. PCBs used were conventional FR-4 substrates with organic solder preservative on the copper pads and mechanical daisychanged FCBGA components with direct immersion gold surface finish on their copper pads. However, a materials analysis method and approach is also required to characterize and evaluate the effect of low peak temperature LF SMT processing on the PBA SLI to identify the absolute limits or “cliffs” and determine if the minimum processing temperature and TAL could be further lowered. The SLI system is characterized using various microanalytical techniques, such as, conventional optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and microhardness testing. In addition, the SLI is further characterized using macroanalytical techniques such as dye penetrant testing (DPT) with controlled tensile testing for mechanical strength in addition to disbond and crack area mapping to complete the analysis.


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