scholarly journals Data Mining for Material Feeding Optimization of Printed Circuit Board Template Production

2018 ◽  
Vol 2018 ◽  
pp. 1-17 ◽  
Author(s):  
Shengping Lv ◽  
Binbin Zheng ◽  
Hoyeol Kim ◽  
Qiangsheng Yue
Keyword(s):  
Data Mining ◽  
Structural Change ◽  
Printed Circuit Board ◽  
Prediction Models ◽  
Raw Material ◽  
Circuit Board ◽  
Production Logistics ◽  
Printed Circuit ◽  
Data Mining Approach ◽  
Scrap Rate

Improving the accuracy of material feeding for printed circuit board (PCB) template orders can reduce the overall cost for factories. In this paper, a data mining approach based on multivariate boxplot, multiple structural change model (MSCM), neighborhood component feature selection (NCFS), and artificial neural networks (ANN) was developed for the prediction of scrap rate and material feeding optimization. Scrap rate related variables were specified and 30,117 samples of the orders were exported from a PCB template production company. Multivariate boxplot was developed for outlier detection. MSCM was employed to explore the structural change of the samples that were finally partitioned into six groups. NCFS and ANN were utilized to select scrap rate related features and construct prediction models for each group of the samples, respectively. Performances of the proposed model were compared to manual feeding, ANN, and the results indicate that the approach exhibits obvious superiority to the other two methods by reducing surplus rate and supplemental feeding rate simultaneously and thereby reduces the comprehensive cost of raw material, production, logistics, inventory, disposal, and delivery tardiness compensation.

scholarly journals An FCM–GABPN Ensemble Approach for Material Feeding Prediction of Printed Circuit Board Template

2019 ◽  
Vol 9 (20) ◽  
pp. 4455 ◽  
Author(s):  
Shengping Lv ◽  
Rongheng Xian ◽  
Denghui Li ◽  
Binbin Zheng ◽  
Hong Jin
Keyword(s):  
Feature Selection ◽  
Printed Circuit Board ◽  
Hybrid Approach ◽  
Back Propagation ◽  
Circuit Board ◽  
Supplemental Feeding ◽  
Printed Circuit ◽  
Scrap Rate ◽  
Selection Mechanisms ◽  
Production Company

Accurate prediction of material feeding before production for a printed circuit board (PCB) template can reduce the comprehensive cost caused by surplus and supplemental feeding. In this study, a novel hybrid approach combining fuzzy c-means (FCM), feature selection algorithm, and genetic algorithm (GA) with back-propagation networks (BPN) was developed for the prediction of material feeding of a PCB template. In the proposed FCM–GABPN, input templates were firstly clustered by FCM, and seven feature selection mechanisms were utilized to select critical attributes related to scrap rate for each category of templates before they are fed into the GABPN. Then, templates belonging to different categories were trained with different GABPNs, in which the separately selected attributes were taken as their inputs and the initial parameter for BPNs were optimized by GA. After training, an ensemble predictor formed with all GABPNs can be taken to predict the scrap rate. Finally, another BPN was adopted to conduct nonlinear aggregation of the outputs from the component BPNs and determine the predicted feeding panel of the PCB template with a transformation. To validate the effectiveness and superiority of the proposed approach, the experiment and comparison with other approaches were conducted based on the actual records collected from a PCB template production company. The results indicated that the prediction accuracy of the proposed approach was better than those of the other methods. Besides, the proposed FCM–GABPN exhibited superiority to reduce the surplus and/or supplemental feeding in most of the case in simulation, as compared to other methods. Both contributed to the superiority of the proposed approach.

scholarly journals Remediation of Soil Containing Sludge Generated by Printed Circuit Board Production and Electroplating

2020 ◽  
Vol 76 (4) ◽  
pp. 68-75
Author(s):  
Anatolyi Nester ◽  
Larisa Tretyakova ◽  
Liudmyla Mitiuk ◽  
Natalya Prakhovnik ◽  
Arkadii Husev
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Salt Content ◽  
Test Method ◽  
Raw Material ◽  
Circuit Board ◽  
Copper Production ◽  
Printed Circuit ◽  
Before And After ◽  
Key Aspects

This paper examines the environmental conditions at the premises of printed circuit boards (PCBs) manufacturers, which have electroplating plants. It provides a brief overview of the key aspects of adverse environmental impacts of wastes generated by PCB manufacture and electroplating plants. The aim of this research was to improve the test method for evaluation of wastewater effect on the soil salinity at the premises of PCBs manufacturers. The object of research was the process of extraction and use of copper from wastewater generated by PCBs manufacture and electroplating. As an example, the process of sludge formation during PCBs etching has been reviewed. With the etching line capacity of 14 m2/h, one-shift manufacturing process will result in the production of up to 2,500 kg of sludge monthly. For enterprises with capacities of 2,000–4,000 m2 circuits, this means annual accumulation at their premises of up to 70 tons of wastes in the form of sludge. Estimates suggest that the upper half-meter layer of the aeration zone will be qualified as slightly saline in one year after accumulation of the sludge. In subsequent years, the salt content will increase and saline soil can be found at the depths of 1.5–2 m over ten years of storage. The authors of this paper propose to treat spent etching solutions applying regeneration technology in order to reduce the amount of sludge. With this technology, it is possible to use the extracted metal as a secondary raw material for copper production and re-use the regenerated solution in PCBs etching. This paper provides estimated hazard indices calculated for the storage of sludge at the manufacturer’s premises before and after the implementation of the proposed technology. With regards to findings of the study, it has been proposed to reuse copper recovered from wastes as a raw material for the industry.

scholarly journals Analysis of cyclic voltammetry in the recovery of copper from printed circuit board waste using diluted deep eutectic solvent

2021 ◽  
Vol 882 (1) ◽  
pp. 012023
Author(s):  
E Sugondo ◽  
S Harjanto ◽  
R M Ulum
Keyword(s):  
Cyclic Voltammetry ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Deep Eutectic Solvent ◽  
Mesh Size ◽  
Raw Material ◽  
Circuit Board ◽  
Temperature Variations ◽  
Printed Circuit ◽  
C 50

Abstract Cyclic voltammetry has been successfully analyzed from a diluted deep eutectic solvent (DDES) electrolyte for recovery printed circuit boards (PCB) containing 17.91% copper. The raw material sample is made through the dismantling stage until the grinding and then sieved to 80 mesh size for testing samples. Temperature variations are used to increase the surface area of the electrodes. The temperature variations used were 40⁰C, 50⁰C, and 60⁰C. The cyclic voltammetric measurement method was carried out using the potentiostat / galvanostat autolab PGSTAT302N connected to a computer with NOVA 1.11 software and a DC power source used for electrolysis with a scan rate of 10 mV / s. From the measurement results, it was found that the largest capacitance value was at 60⁰C with an oxidation peak of 1.15 A. with a current efficiency of 99.83%. Additional testing was also carried out using SEM-EDX to see the morphological surface of the cathode used.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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