scholarly journals Biomechanical Performance of the Cemented Hip Stem with Different Surface Finish

2019 ◽  
Vol 9 (19) ◽  
pp. 4082 ◽  
Author(s):  
Jui-Pin Hung ◽  
Yu-Wei Bai ◽  
Chung-Qua Hung ◽  
Tsui-Er Lee
Keyword(s):  
Surface Finish ◽  
Cement Mantle ◽  
Mechanical Effect ◽  
Metal Interface ◽  
Hip Prostheses ◽  
Lower Survival Rate ◽  
Surface Finishes ◽  
Artificial Hip ◽  
Polished Metal

The integrity of the cemented fixation interface is responsible for the long-term longevity of artificial hip prostheses. Metallic stems with roughened surfaces are considered to provide stronger adhesion with cement. However, clinical studies have reported that roughened stems show a lower survival rate than polished stems. These studies clearly reveal that the causes of artificial stem loosening are very complicated and multifaceted. Therefore, this study was conducted to investigate the mechanical effect of stem surface finish in cemented hip replacement. To accomplish this, a series of cement–metal specimens were tested configurations to assess the mechanical characteristics of the cement–metal interface specimens. A finite elemental model of cemented femoral prostheses was then created, in which the cement–stem interface was assumed to be in different bonding states according to the experimentally measured interface properties. The failure probabilities of the cement mantle and cemented interface under physiological loadings were evaluated. Experimental results indicate that the polished metal produced higher interfacial tensile and lower shearing strengths than the roughened metal. The polished stems were predicted to induce a lower failure probability of cement mantle and higher integrity of the cement–stem interface when compared to the roughened stem. Overall, current results provide significant evidence to support the clinical outcomes of cemented hip prostheses with different stem surface finishes.

Colour stability of surface finishes on thermally modified beech wood

2021 ◽  
Vol 114 ◽  
pp. 116-124
Author(s):  
Gabriela Slabejová ◽  
MÁRIA ŠMIDRIAKOVÁ
Keyword(s):  
Surface Finish ◽  
Beech Wood ◽  
Surface Finishing ◽  
Colour Stability ◽  
Colour Difference ◽  
Surface Finishes ◽  
Before And After ◽  
Thermally Modified Wood ◽  
Wood Surfaces ◽  
Modified Wood

Colour stability of surface finishes on thermally modified beech wood. The paper deals with the influence of the type of transparent surface finish on the change of colour of the surfaces of native beech wood and thermally modified wood. At the same time, the colour stability of three surface finishes on the surfaces of native and thermally modified beech wood was monitored. Beech wood was thermally modified at temperature of 125 °C for 6 hours. The thermal treatment was performed in a pressure autoclave APDZ 240, by the company Sundermann s.r.o in Banská Štiavnica. Three various types of surface finishes (synthetic, wax-oil, water-based) were applied onto the wood surfaces. The colour of the surfaces of native wood and thermally modified wood was measured in the system CIELab before and after surface finishing; the coordinates L*, a*, b*, C*ab and h*ab were measured. From the coordinates measured before and after surface finishing, the differences were calculated and then the colour difference ∆E* was calculated. Subsequently, the test specimens with the surface finishes were exposed to natural sunlight, behind glass in the interior for 60 days. The surface colour was measured at specified time of the exposure (10, 20, 30, 60 days). The results showed that the colour of the wood surfaces changed after application of the individual surface finishes; and the colour difference reached a change visible with a medium quality filter up to a high colour difference. The wax-oil surface finish caused a high colour difference on native wood and on thermally modified wood as well. On native beech wood, the lowest colour difference after exposure to sunlight was noticeable on the synthetic surface finish. On the surface of wood thermally modified, after exposure to sunlight, the lowest colour difference was noticeable on the surface with no surface finish.

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001145-001184
Author(s):  
Mustafa Ozkok ◽  
Sven Lamprecht ◽  
Gustavo Ramos ◽  
Arnd Kilian
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Environmental Issues ◽  
Wire Bonding ◽  
Gold Layer ◽  
Test Results ◽  
Fine Line ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Bond Tests

A new surface finish is entering the market. The need for this finish comes from needs for new assembly technologies like copper wire bonding or chip assembly by thermo compression bond. Furthermore Nickel an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5 μm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with an optional gold layer. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.

Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

2010 ◽  
Vol 2010 (1) ◽  
pp. 000298-000305
Author(s):  
Tae-Kyu Lee ◽  
Weidong Xie ◽  
Thomas R. Bieler ◽  
Kuo-Chuan Liu ◽  
Jie Xue
Keyword(s):  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Substrate Surface ◽  
Solder Interconnects ◽  
Surface Finishes ◽  
Bga Packages ◽  
Fine Pitch ◽  
Solder Balls

The interaction between isothermal aging and long-term reliability of fine pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt%) solder ball interconnects are investigated. In this study, 0.4mm fine pitch packages with 0.3mm diameter Sn-Ag-Cu solder balls are used. Two different die sizes and two different package substrate surface finishes are selected to compare the internal strain impact and alloy effect, especially the Ni effect during thermal cycling. To see the thermal impact on the thermal performance and long-term reliability, the samples are isothermally aged and thermal cycled from 0 to 100°C with a 10minute dwell time. Based on weibull plots for each aging condition, the lifetime of the package reduced approximately 44% with 150°C aging precondition. The microstructure evolution is observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and OSP surface finishes, focusing on the microstructure evolution near the package side interface. Different mechanisms after aging at various conditions are observed, and their impacts on the fatigue life of solder joints are discussed.

A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors

2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack
Keyword(s):  
Surface Finish ◽  
Printed Circuit Board ◽  
Chemical Constituents ◽  
Low Cost ◽  
Circuit Board ◽  
Testing Environment ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Sensing Applications ◽  
Surface Finishes

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.

A STUDY OF SURFACE FINISHES FOR IC SUBSTRATES AND WIRE BOND APPLICATIONS

2011 ◽  
Vol 2011 (1) ◽  
pp. 000516-000520 ◽  
Author(s):  
John Ganjei ◽  
Ernest Long ◽  
Lenora Toscano
Keyword(s):  
Surface Finish ◽  
Printed Circuit Boards ◽  
Performance Enhancement ◽  
High Reliability ◽  
Cost Effective ◽  
Electroless Nickel ◽  
Gold Wire ◽  
Electronics Industry ◽  
Surface Finishes ◽  
And Performance

The continuing drive for ever increasing performance enhancement in the electronics industry, in combination with the recent, very significant increase in precious metal costs have left fabricators and OEMs questioning what the best, most cost effective, surface finish is for high reliability applications. Currently, the IC substrate market relies heavily on electrolytic nickel and gold as a solderable and superior wire bondable surface. The use of this finish has allowed manufacturers to avoid the reliability concerns However, this choice also results in significant design restraints being imposed. Many in the industry are now investigating the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) to achieve both high reliability and performance, without the negative design restraints imparted by the use of electrolytic processes. However, over the last year alone, the industry has watched the price of gold increase by 50% and that of palladium double [1]. With this in mind, and considering the historic precedent set in the mid 1990’s when ENEPIG was also evaluated as a surface finish for printed circuit boards, when coincidentally, the cost of palladium also reached an all time high, it should be remembered that the electronics industry quickly moved to evaluate alternate, more cost sustainable, surface finishes. This paper details the use of lower cost, alternate surface finishes for IC substrate applications, with particular experimental focus on gold wire bonding capabilities and BGA solderability of the finishes described. The paper also discusses related process cycle advantages and the significantly reduced operating costs associated with these new finishes.

Wear of Historical Polyethylenes in Hip Prostheses. Biomechanical Success and a Biological Failure

2003 ◽  
Vol 13 (2_suppl) ◽  
pp. 17-27 ◽  
Author(s):  
E. Ingham ◽  
J. Fisher ◽  
M.H. Stone
Keyword(s):  
Polyethylene Wear ◽  
Simulation Models ◽  
Hip Joints ◽  
Hip Prostheses ◽  
Artificial Hip ◽  
Cause Of Failure ◽  
Artificial Hip Joints ◽  
Gamma Irradiated ◽  
Biological Simulation

Polyethylene wear debris induced osteolysis is a major cause of failure in artificial hip joints. Sub micrometre size particles are taken up by macrophages which are stimulated to release osteolytic cytokines such as TNFα. This leads to bone resorption, loosening and failure. In vitro cell culture studies have shown particles in the size range 0.1 to 1 micrometre to be at least six times more reactive than larger particles. Studies of historically used gamma irradiated in air polyethylene show increased wear rate with damaged femoral heads and with aged and oxidised polyethylene. The aged and oxidised polyethylene also produced a greater percentage of smaller particles leading to increased osteolytic potential. Combined tribological and biological simulation models have been developed for pre-clinical assessment of osteolytic potential of artificial hip joints.

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