scholarly journals Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy

2019 ◽  
Vol 9 (6) ◽  
pp. 1112 ◽  
Author(s):  
Qing He ◽  
Dongdong Zhu ◽  
Duo Dong ◽  
Mengjia Xu ◽  
Anpeng Wang ◽  
...  

The effect of bonding temperature on the microstructure and mechanical properties of transient liquid phase (TLP) joints of GH4169 superalloy was investigated. Joining processes were carried out at 1040–1100 °C for 30 min using BNi-2 solder paste. The results showed that three distinct microstructural zones were formed in the joint region: an athermal solidification zone (ASZ), consisting of eutectic compounds; an isothermal solidification zone (ISZ), consisting of γ solid solution; and a diffusion affected zone (DAZ), consisting of Ni-Cr rich boride and Cr-Nb-Mo-rich boride compounds. With increasing bonding temperature, the amounts of eutectic compounds in ASZ first decreased and then increased. A eutectic-free joint centerline was obtained at 1080 °C. The maximum bonding shear strength reached 728.03 MPa due to the completion of isothermal solidification. Fractographic studies revealed that the boride compounds in ASZ and the intermetallic compounds in DAZ were the main causes for the failure of joints. The fracture mode of the sample bonded at 1040 °C was brittle, and the fracture path was along the ASZ. However, the fracture mode of the sample bonded at 1080 °C was ductile, and the fracture occurred along the DAZ.

2020 ◽  
Vol 9 (5) ◽  
pp. 10355-10365
Author(s):  
Alireza Doroudi ◽  
Ali Ebrahimzadeh Pilehrood ◽  
Mohammadjavad Mohebinia ◽  
Ali Dastgheib ◽  
Armin Rajabi ◽  
...  

Materials ◽  
2019 ◽  
Vol 12 (5) ◽  
pp. 769 ◽  
Author(s):  
Abdulaziz AlHazaa ◽  
Ibrahim Alhoweml ◽  
Muhammad Shar ◽  
Mahmoud Hezam ◽  
Hany Abdo ◽  
...  

Ti-6Al-4V and Mg-AZ31 were bonded together using the Transient Liquid Phase Bonding Process (TLP) after coating both surfaces with zinc. The zinc coatings were applied using the screen printing process of zinc paste. Successful bonds were obtained in a vacuum furnace at 500 °C and under a uniaxial pressure of 1 MPa using high frequency induction heat sintering furnace (HFIHS). Various bonding times were selected and all gave solid joints. The bonds were successfully achieved at 5, 10, 15, 20, 25, and 30 min. The energy dispersive spectroscopy (EDS) line scan confirmed the diffusion of Zn in both sides but with more diffusion in the Mg side. Diffusion of Mg into the joint region was detected with significant amounts at bonds made for 20 min and above, which indicate that the isothermal solidification was achieved. In addition, Ti and Al from the base alloys were diffused into the joint region. Based on microstructural analysis, the joint mechanism was attributed to the formation of solidified mixture of Mg and Zn at the joint region with a presence of diffused Ti and Al. This conclusion was also supported by structural analysis of the fractured surfaces as well as the analysis across the joint region. The fractured surfaces were analyzed and it was concluded that the fractures occurred within the joint region where ductile fractures were observed. The strength of the joint was evaluated by shear test and found that the maximum shear strength achieved was 30.5 MPa for the bond made at 20 min.


2014 ◽  
Vol 33 (6) ◽  
pp. 525-529 ◽  
Author(s):  
X.Y. Gu ◽  
Z.Z. Duan ◽  
X.P. Gu ◽  
D.Q. Sun

AbstractIn the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy joints using a pure copper as interlayer was investigated. TLP bonded Ti3Al-Nb alloy joints composed of intermetallic compound layers were produced. Microstructural evolution of joints depended on both bonding time and bonding temperature. With increasing bonding time and bonding temperature, the joint width increased and amount of compounds in the joint decreased. The joint microstructure at 1173 K × 1 min mainly consisted of Ti (solid solution) + Ti2Cu + TiCu + Ti3Cu4 + Ti2Cu3 + TiCu4 + Cu (solid solution) phase and it changed to Ti (solid solution) + Ti2Cu + TiCu at 1223 K × 60 min. Compounds formed on cooling from the bonding temperature by liquid phase were eliminated from the joint at 1223 K × 60 min due to isothermal solidification of liquid phase. The increase of the width of joint is attributed to the composition difference between the isothermal solidification production and its adjacent base material.


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