scholarly journals Optimization of Additive and Current Conditions for Void-Free Filled Through-Silicon Via

2018 ◽  
Vol 8 (11) ◽  
pp. 2135 ◽  
Author(s):  
Se-Hee Shin ◽  
Tea-Yoo Kim ◽  
Jong-Hwan Park ◽  
Su-Jeong Suh
Keyword(s):  
High Performance ◽  
Electrochemical Analysis ◽  
Cross Sectional ◽  
Aspect Ratios ◽  
3D Packaging ◽  
Pulse Reverse ◽  
Increasing Demand ◽  
Poly Ethylene ◽  
Silicon Vias ◽  
Sectional Analysis

Studies of through-silicon vias (TSVs) have become important owing to the increasing demand for 3D packaging. To obtain high-performance devices, it is important to fill the holes inside TSVs without voids. In this study, poly(ethylene glycol), bis-(3-sodiumsulfopropyl disulfide), and Janus Green B are used as a suppressor, accelerator, and leveler, respectively, to achieve void-free filling of a TSV. The optimum conditions for the additives were studied, and electrochemical analysis was performed to confirm their effects. Different current conditions, such as pulse, pulse-reverse, and periodic pulse-reverse, were also employed to enhance the filling properties of copper (Cu) for a TSV with a hole diameter of 60 µm and depth/hole aspect ratios of 2, 2.5, and 3. The behavior of Cu filling was observed through a cross-sectional analysis of the TSV after Cu plating under various conditions.

Cost Comparison of 2.5D/3D Packaging to other Packaging Technologies

2013 ◽  
Vol 2013 (1) ◽  
pp. 000429-000433
Author(s):  
Chet Palesko ◽  
Amy Palesko ◽  
E. Jan Vardaman
Keyword(s):  
Cost Reduction ◽  
High Performance ◽  
Cost Comparison ◽  
Through Silicon Vias ◽  
Cost Drivers ◽  
3D Packaging ◽  
Silicon Vias ◽  
The Cost ◽  
3D Applications

2.5D and 3D applications using through silicon vias (TSVs) are increasingly being considered as an alternative to conventional packaging. Miniaturization and high performance product requirements are driving this move, although in many cases the cost of both 2.5D and 3D is still high. In this paper we will identify the major cost drivers for 2.5D and 3D packaging and assess cost reduction progress, including current costs versus expected future costs. We will also compare these costs to alternative packaging.

scholarly journals Association between glomerular filtration rate (measured by high-performance liquid chromatography with iohexol) and plasma oxalate

2018 ◽  
Vol 40 (1) ◽  
pp. 73-76 ◽  
Author(s):  
Luciano da Silva Selistre ◽  
Pierre Cochat ◽  
Dener lizot Rech ◽  
François Parant ◽  
Vandréa Carla de Souza ◽  
...  
Keyword(s):  
Glomerular Filtration Rate ◽  
Glomerular Filtration ◽  
High Performance ◽  
Filtration Rate ◽  
Case Series ◽  
Primary Hyperoxaluria ◽  
The Body ◽  
Cross Sectional ◽  
Sectional Analysis ◽  
Transplanted Kidneys

ABSTRACT Introduction: Secondary hyperoxalemia is a multifactorial disease that affects several organs and tissues in patients with native or transplanted kidneys. Plasma oxalate may increase during renal failure because it is cleared from the body by the kidneys. However, there is scarce evidence about the association between glomerular filtration rate and plasma oxalate, especially in the early stages of chronic kidney disease (CKD). Methods: A case series focuses on the description of variations in clinical presentation. A pilot study was conducted using a cross-sectional analysis with 72 subjects. The glomerular filtration rate (GFR) and plasma oxalate levels were measured for all patients. Results: Median (IQR) GFR was 70.50 [39.0; 91.0] mL/min/1.73 m2. Plasma oxalate was < 5.0 µmol/L in all patients with a GFR > 30 mL/min/1.73m2. Among the 14 patients with severe CKD (GFR < 30 mL/min/1.73 m2) only 4 patients showed a slightly increased plasma oxalate level (between 6 and 12 µmol/L). Conclusion: In non-primary hyperoxaluria, plasma oxalate concentration increases when GFR < 30mL/min/1.73 m2 and, in our opinion, values greater than 5 µmol/L with a GFR > 30 mL/min/1.73 m2 are suggestive of primary hyperoxaluria. Further studies are necessary to confirm plasma oxalate increase in patients with low GFR levels (< 30mL/min/1.73 m2).

Enabling Robust Copper Fill of High Aspect Ratio Through Silicon Vias

2010 ◽  
Vol 2010 (1) ◽  
pp. 000176-000179
Author(s):  
Mark Willey ◽  
Damo Srinivas ◽  
Sesha Varadarajan ◽  
David Porter ◽  
Easwar Srinivasan ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Speed ◽  
High Performance ◽  
Process Window ◽  
Seed Technology ◽  
Aspect Ratios ◽  
Reducing Costs ◽  
Electroplating Process ◽  
Silicon Vias

Today's Through Silicon Via (TSV) processes are limited to aspect ratios of 10:1. High performance logic devices drive the need for aspect ratios approaching 20:1 in order to achieve the desired performance while simultaneously reducing costs. The reduced via area required on the wafer enables the designer to utilize less real estate on the die to reduce cost or to potentially add redundant vias to improve yield. However, current conventional processes and techniques are not capable of achieving robust fill on aspect ratios greater than 12:1. This presentation will highlight the technical challenges in achieving robust copper fill on super high aspect ratio TSV structures. Additionally, a compelling, economic solution pathway will be presented that integrates a low temperature conformal high quality dielectric isolation layer, a high step coverage Cu barrier / seed technology and a void free high speed electroplating process with a wide process window that could accelerate the adoption of the high aspect ratio TSV design schemes.

scholarly journals Serum xanthophyll carotenoids are associated with estimated glomerular filtration rate in an aged cohort

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Declan Browne ◽  
Michael A. Williams ◽  
Alexander P. Maxwell ◽  
Bernadette McGuinness ◽  
Peter Passmore ◽  
...  
Keyword(s):  
Sensitivity Analysis ◽  
Glomerular Filtration Rate ◽  
Glomerular Filtration ◽  
High Performance ◽  
Filtration Rate ◽  
Estimated Glomerular Filtration Rate ◽  
Serum Levels ◽  
Cross Sectional ◽  
Traditional Risk Factors ◽  
Sectional Analysis

AbstractProgressive renal decline is associated with increasing oxidative stress. However, the majority of studies have investigated endogenous antioxidants in predominantly advanced stages of kidney disease. Many traditional risk factors associated with renal dysfunction have been linked with cognitive decline as the kidneys and brain share comparable anatomic and haemodynamic characteristics that leave them susceptible to common pathogenic mechanisms. The objective of this study was to examine serum dietary antioxidants and their association with renal function characterised by estimated glomerular filtration rate (eGFR) in a cross-sectional analysis of 570 participants. High performance liquid chromatography quantified serum levels of retinol, α-tocopherol, γ-tocopherol and six carotenoids (α-carotene, β-carotene, β-cryptoxanthin, lutein, lycopene and zeaxanthin) in participants. Multiple regression analyses were used to evaluate associations while adjusting for potential confounders. A sensitivity analysis was performed in cognitively-intact participants only. Serum levels of the xanthophyll carotenoid lutein were positively associated with eGFR in analyses adjusted for age (years), gender, smoking, APOE4 status and Alzheimer’s disease. Retinol was inversely associated with eGFR, although was no longer significant in the smaller sensitivity analysis. Our findings identify significant associations between the xanthophyll carotenoids and eGFR. Further investigations are required to confirm these findings.

High Removal Rate CMP Process on TSV Thick Cu Overburden

2010 ◽  
Vol 1249 ◽  
Author(s):  
Raymond Caramto ◽  
Jamal Qureshi ◽  
Jerry Mase
Keyword(s):  
Cross Sections ◽  
Removal Rate ◽  
Aspect Ratios ◽  
Overburden Thickness ◽  
Cu Electroplating ◽  
Constant Resistance ◽  
3D Packaging ◽  
High Removal Rate ◽  
Silicon Vias ◽  
Cu Cmp

AbstractIn 3D packaging, Through Silicon Vias (TSVs) with high aspect ratios and depths measuring tens of microns are filled by advanced Cu electroplating processes. Today's 300mm TSV plating platforms are intended to produce bottom-up via fill, no seam voids, and minimal, controlled overburden. To achieve this, the preceding Cu-seed coverage must be continuous at a constant resistance, and the plating chemistries optimized. However, other factors such as hardware configurations and simple depletion of the plating formulations during the extended TSV process can lead to high Cu overburden thickness requiring a high removal rate (HRR) chemical-mechanical polish (CMP) process to remove the thick Cu layer.Presented here are CMP results of a thick Cu overburden (~6um) resulting from the fill of 5 x 25um TSVs on 300mm wafers. The goal is to uniformly polish the overburden and utilize the tool's endpoint system at Cu clear before the next step of conventional barrier CMP. Slurries were screened for removal rate, uniformity, planarization ability, and defectivity. This study focuses on achieving a removal rate of >2.5um/min through evaluation of several commercial slurries in a multi-step polish application. Cross-sections post-plating show the Cu overburden, barrier and liner layer. Cross-sections post-CMP quantify Cu recess, dielectric loss, and presence/absence of seam defects. The process selected is demonstrated to achieve good planarization results with low occurrence of polish defects, at a rate and selectivity suitable for emerging 3D TSV Cu CMP applications.

High-resolution scanning electron microscopy of thin-film magnetic media of magnetic recording disk

1992 ◽  
Vol 50 (2) ◽  
pp. 1334-1335
Author(s):  
K. Ogura ◽  
H. Nishioka ◽  
N. Ikeo ◽  
T. Kanazawa ◽  
J. Teshima
Keyword(s):  
Thin Film ◽  
Fine Structure ◽  
High Resolution ◽  
Magnetic Recording ◽  
High Performance ◽  
Magnetic Hysteresis ◽  
Grain Structure ◽  
Magnetic Media ◽  
Cross Sectional ◽  
Resolution Observation

Structural appraisal of thin film magnetic media is very important because their magnetic characters such as magnetic hysteresis and recording behaviors are drastically altered by the grain structure of the film. However, in general, the surface of thin film magnetic media of magnetic recording disk which is process completed is protected by several-nm thick sputtered carbon. Therefore, high-resolution observation of a cross-sectional plane of a disk is strongly required to see the fine structure of the thin film magnetic media. Additionally, observation of the top protection film is also very important in this field.Recently, several different process-completed magnetic disks were examined with a UHR-SEM, the JEOL JSM 890, which consisted of a field emission gun and a high-performance immerse lens. The disks were cut into approximately 10-mm squares, the bottom of these pieces were carved into more than half of the total thickness of the disks, and they were bent. There were many cracks on the bent disks. When these disks were observed with the UHR-SEM, it was very difficult to observe the fine structure of thin film magnetic media which appeared on the cracks, because of a very heavy contamination on the observing area.

Ultramicrotomy as a Technique for Materials Specimen Preparation

1990 ◽  
Vol 48 (2) ◽  
pp. 428-429
Author(s):  
S.R. Glanvill
Keyword(s):  
Materials Science ◽  
Structural Information ◽  
Specimen Preparation ◽  
Preparation Technique ◽  
Cross Sectional ◽  
Surfaces And Interfaces ◽  
Beam Analysis ◽  
Flat Embedding ◽  
20 Nm ◽  
Sectional Analysis

This paper summarizes the application of ultramicrotomy as a specimen preparation technique for some of the Materials Science applications encountered over the past two years. Specimens 20 nm thick by hundreds of μm lateral dimension are readily prepared for electron beam analysis. Materials examined include metals, plastics, ceramics, superconductors, glassy carbons and semiconductors. We have obtain chemical and structural information from these materials using HRTEM, CBED, EDX and EELS analysis. This technique has enabled cross-sectional analysis of surfaces and interfaces of engineering materials and solid state electronic devices, as well as interdiffusion studies across adjacent layers.Samples are embedded in flat embedding moulds with Epon 812 epoxy resin / Methyl Nadic Anhydride mixture, using DY064 accelerator to promote the reaction. The embedded material is vacuum processed to remove trapped air bubbles, thereby improving the strength and sectioning qualities of the cured block. The resin mixture is cured at 60 °C for a period of 80 hr and left to equilibrate at room temperature.

Twitter Usage Using Common Reference to Tinnitus

2020 ◽  
Vol 29 (2) ◽  
pp. 206-217
Author(s):  
Jianyuan Ni ◽  
Monica L. Bellon-Harn ◽  
Jiang Zhang ◽  
Yueqing Li ◽  
Vinaya Manchaiah
Keyword(s):  
Nonprofit Organizations ◽  
Temporal Trends ◽  
Temporal Analysis ◽  
Cross Sectional ◽  
For Profit ◽  
Common Reference ◽  
Personal Experiences ◽  
Twitter Users ◽  
Sectional Analysis ◽  
Share Information

Objective The objective of the study was to examine specific patterns of Twitter usage using common reference to tinnitus. Method The study used cross-sectional analysis of data generated from Twitter data. Twitter content, language, reach, users, accounts, temporal trends, and social networks were examined. Results Around 70,000 tweets were identified and analyzed from May to October 2018. Of the 100 most active Twitter accounts, organizations owned 52%, individuals owned 44%, and 4% of the accounts were unknown. Commercial/for-profit and nonprofit organizations were the most common organization account owners (i.e., 26% and 16%, respectively). Seven unique tweets were identified with a reach of over 400 Twitter users. The greatest reach exceeded 2,000 users. Temporal analysis identified retweet outliers (> 200 retweets per hour) that corresponded to a widely publicized event involving the response of a Twitter user to another user's joke. Content analysis indicated that Twitter is a platform that primarily functions to advocate, share personal experiences, or share information about management of tinnitus rather than to provide social support and build relationships. Conclusions Twitter accounts owned by organizations outnumbered individual accounts, and commercial/for-profit user accounts were the most frequently active organization account type. Analyses of social media use can be helpful in discovering issues of interest to the tinnitus community as well as determining which users and organizations are dominating social network conversations.

Evaluation of the prevalence and nutritional and social determinants of overweight in a population of schoolchildren: a cross-sectional analysis of 5,037 children

2012 ◽  
Vol 58 (4) ◽  
pp. 472-476 ◽  
Author(s):  
Caroline Filla Rosaneli ◽  
Flavia Auler ◽  
Carla Barreto Manfrinato ◽  
Claudine Filla Rosaneli ◽  
Caroline Sganzerla ◽  
...  
Keyword(s):  
Social Determinants ◽  
Cross Sectional ◽  
Cross Sectional Analysis ◽  
Sectional Analysis
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