Ablation of Copper Metal Films by Femtosecond Laser Multipulse Irradiation

Ablation of copper using multipulse femtosecond laser irradiation with an 800 nm wavelength and 120-fs pulse duration is investigated theoretically. A two-temperature model, which includes dynamic optical and thermal-physical properties, is considered. The numerical results of the material thermal response obtained by varying the pulse number, the separation times between pulses and laser fluences are presented. Our results show that the increasing of pulse number with a separation time less than the thermal relaxation time can dramatically enhance the lattice temperature without a noticeable increase in ablation depth. Therefore, we suggest that the vaporization rate can be augmented in comparison to the melting rate during the same single-phase explosion at the same total fluence where a fast heat accumulation effect plays an important role for cleaner ablation during micromachining.