scholarly journals Antenna Design for Microwave and Millimeter Wave Applications: Latest Advances and Prospects

2021 ◽  
Vol 11 (12) ◽  
pp. 5556
Author(s):  
Hosung Choo
Keyword(s):  
Millimeter Wave ◽  
Antenna Design ◽  
New Approaches ◽  
Substantial Effort

Until recently, substantial effort has been devoted to new approaches and attempts to the design of antennas for microwave and millimeter-wave applications [...]

Monolithic Circular Transistor-Antenna Design for High-Performance Plasmonic Millimeter-Wave Detectors

2020 ◽  
Vol 68 (4) ◽  
pp. 2511-2522
Author(s):  
Ramesh Patel ◽  
Min Woo Ryu ◽  
Mun Seok Choe ◽  
EunMi Choi ◽  
Kyung Rok Kim ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
High Performance ◽  
Antenna Design

scholarly journals Millimeter-Wave CMOS On-Chip Dipole Antenna Design Optimization

2013 ◽  
Vol 24 (6) ◽  
pp. 595-601
Author(s):  
GeunRyoung Choi ◽  
Seung-Ho Choi ◽  
Kook Joo Lee ◽  
Moonil Kim ◽  
Dowon Kim ◽  
...  
Keyword(s):  
Design Optimization ◽  
Millimeter Wave ◽  
Dipole Antenna ◽  
Antenna Design ◽  
On Chip

Material Impact With Package Solution for 5G RF Application

2020 ◽  
Author(s):  
Po Yuan (James) Su ◽  
Yu Po Wang ◽  
Yu Cheng Pai ◽  
Ying Wei Lu ◽  
Teny Shih ◽  
...  
Keyword(s):  
Antenna Array ◽  
Millimeter Wave ◽  
Data Transmission ◽  
Signal Transmission ◽  
Data Rate ◽  
Structure Design ◽  
Antenna Design ◽  
Future Application ◽  
Phase Array ◽  
Package Design

Abstract From the fifth-generation (5G) of system architecture evolution, there are more and more demands which require high data rate communication, low latency, and massive connectivity for network data transmission. For millimeter-wave (mm-wave), communications, the antenna size for mobile application is shunk from PCB level to package level, therefore Antenna in Package (AiP) is developed. Recently, high bandwidth with high performance data rate transmission is the key for 5G and that also can provide the lower latency than current fourth generation. That is the reason can be explained that millimeter-wave (mm-wave) of bandwidth can offer excellent network coverage in the city and the antenna design for 5G wireless telcommcation is getting important. All frequency of signal have to use the networking devices to achieve high speed data transmission requirement. As we known, mm-wave is used for mobile phone of signal transmission, and the material with the package design become really important. The mm-wave performance can be impacted by material with structure design, and DK, DF and package level design will be the material portion to effect the signal performance. In this paper, material selection, antenna array and package design will be the key for the Antenna in Package (AiP). For antenna design, we need the lower DF, DK, phase array and structure design to help our signal performance which means lowest insertion loss will be the best for signal transmission. We will do the comparsion for the paper discussion for the material, package and beamforming with antenna array design. Finally, this paper will provide the advanced package solution for future application.

A Simple Low-Profile Broadband Antenna Design for 5G Millimeter-Wave Applications Over 38 GHz Spectrum

2021 ◽  
Author(s):  
Musa Hussain ◽  
Irtiza Abbas Awan ◽  
Abdullah Mazhar ◽  
Syed Naheel Raza Rizvi ◽  
Mohammed Alibakhshikenari ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Antenna Design ◽  
Broadband Antenna ◽  
Low Profile

scholarly journals Millimeter Wave on Chip Antenna Using Dogbone Shape Artificial Magnetic Conductor

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Guo Qing Luo ◽  
Zheng Zheng Song ◽  
Xiao Hong Zhang ◽  
Xiao Ping Hu
Keyword(s):  
Millimeter Wave ◽  
Metal Layer ◽  
Cmos Technology ◽  
Dipole Antenna ◽  
Antenna Design ◽  
Magnetic Conductor ◽  
Artificial Magnetic Conductor ◽  
On Chip Antenna ◽  
Enhance Efficiency ◽  
On Chip

An artificial magnetic conductor (AMC) applied in millimeter wave on chip antenna design based on a standard 0.18 μm CMOS technology is studied. The AMC consisting of two-dimensional periodic dogbone shape elements is constructed at one metal layer of the CMOS structure. After its performance has been completely investigated, it has been used in an on chip dipole antenna design as an artificial background to enhance efficiency of the dipole antenna. The result shows that 0.72 dB gain has been achieved at 75 GHz when the AMC is constructed by a 4*6 dogbone array.

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