scholarly journals Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level

2021 ◽  
Vol 11 (6) ◽  
pp. 2679
Author(s):  
Andrew Wileman ◽  
Suresh Perinpanayagam ◽  
Sohaib Aslam
Keyword(s):  
Power Electronics ◽  
Computer Aided Design ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Fluid Dynamic ◽  
Circuit Board ◽  
Mechanical Shock ◽  
Element Analysis ◽  
Physics Of Failure ◽  
Printed Circuit

This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a life-cycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the period of operation. Primarily, it involves converting an electronic computer aided design (eCAD) circuit layout into computational fluid dynamic (CFD) and finite element analysis (FEA) models with accurate geometries. From this, stressors, such as thermal cycling, mechanical shock, natural frequency, and harmonic and random vibrations, are applied to understand PCB degradation, and semiconductor and capacitor wear, and accordingly provide a method for high-fidelity power PCB modelling, which can be subsequently used to facilitate virtual testing and digital twinning for aircraft systems and sub-systems.

scholarly journals MODIFICATION OF TOOL FOR MOVING TRACK SEGMENTS IN DELTA DESIGN CAD

2019 ◽  
pp. 130-133
Author(s):  
A. Yu. Gladkevich
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design System ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Advantages And Disadvantages ◽  
Development Tools ◽  
Aided Design

Describes the process of improving and developing tools in computer‑aided design system Delta Design. Currently, the modern  process of PCB development is quite complex and time‑consuming process. Existing CAD systems make it easier to design a  printed circuit Board model by providing powerful development tools. Along with the increasing complexity of modern printed  circuit boards, the requirements for development tools are also growing, making them constantly improve. Using the example  of  the  Delta  Design  system,  the  process  of  improving  the  tool  for  moving  track  segments  is  described.  The  analysis  of  the  advantages and disadvantages of the existing tool is made, and the decision on the need to develop a new algorithm is justified.  Of the two proposed variants of such an algorithm, the optimal one was chosen in terms of the quality of the result obtained and  the convenience of operation.

Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures

1996 ◽  
Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh
Keyword(s):  
Experimental Data ◽  
Thermal Degradation ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Elevated Temperatures ◽  
Dielectric Breakdown ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Data Matching

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals Estimating Recycling Return of Integrated Circuits Using Computer Vision on Printed Circuit Boards

2021 ◽  
Vol 11 (6) ◽  
pp. 2808
Author(s):  
Leandro H. de S. Silva ◽  
Agostinho A. F. Júnior ◽  
George O. A. Azevedo ◽  
Sergio C. Oliveira ◽  
Bruno J. T. Fernandes
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Decision Criterion ◽  
Economic Feasibility ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Mechanical Recycling ◽  
Printed Circuit

The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC’s weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB’s ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs’ ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

scholarly journals A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

Electronics ◽  
2021 ◽  
Vol 10 (5) ◽  
pp. 539
Author(s):  
Ryan P. Tortorich ◽  
William Morell ◽  
Elizabeth Reiner ◽  
William Bouillon ◽  
Jin-Woo Choi
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Ground Plane ◽  
Circuit Board ◽  
Electronic Systems ◽  
Coupling Mechanism ◽  
Electromagnetic Modeling ◽  
Printed Circuit ◽  
Edge Radiation ◽  
Area Of Concern

Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) environments, there is growing interest in understanding how electronic systems are affected by such environments. Backdoor coupling in particular is an area of concern for all electronics, but there is limited understanding about the mechanisms behind backdoor coupling. In this work, we present a study on printed circuit board (PCB) backdoor coupling and the effects of via fencing. Existing work focuses on ideal stackups and indicates that edge radiation is significantly reduced by via fencing. In this study, both full wave electromagnetic modeling and experimental verification are used to investigate both ideal and practical PCB stackups. In the ideal scenario, we find that via fencing substantially reduces coupling, which is consistent with prior work on emissions. In the practical scenario, we incorporate component footprints and traces which naturally introduce openings in the top ground plane. Both simulation and experimental data indicate that via fencing in the practical scenario does not substantially mitigate coupling, suggesting that PCB edge coupling is not the dominant coupling mechanism, even at varying angles of incidence and polarization.

Hierarchical pyramidal subsampling in deep convolutional networks for visual pattern recognition

2021 ◽  
Author(s):  
A. E. Averyanikhin ◽  
A. I. Vlasov ◽  
E. V. Evdokimova
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Flaw Detection ◽  
Input Image ◽  
Circuit Board ◽  
Digital Data ◽  
Deep Convolutional Neural Networks ◽  
Size Scale ◽  
Printed Circuit ◽  
Convolutional Networks

The main problem of known deep convolutional neural networks (CNN) is that they require a fixed-size input image. This requirement is “artificial” and can reduce recognition accuracy for images or its parts of arbitrary size/scale. The paper proposes a strategy of combining “hierarchical pyramidal subselection” to eliminate the above restriction. The structure of the neural network using the proposed combining strategy allows the generation of prediction regardless of the size/scale of the original image, and also improves the accuracy of recognition. Features of application of CNN for identification and recognition of defects of conducting pattern of printed circuit board blanks have been considered. Features of defects of conductive pattern of printed circuit board blanks have been briefly discussed. The invention proposes the use of artificial CNN, which have advantages in speed and accuracy in solving problems of object recognition on images relative to existing methods. The focus is on the architecture of CNN using hierarchical pyramidal subselection. Capabilities of application of CNN for recognition of defects of conducting pattern of printed circuit board blanks have been shown. Proposed method of hierarchical pyramidal subselection in deep convolutional networks has been implemented in software complex, which allows processing digital data of photographs of conducting pattern of printed circuit boards, in particular during their flaw detection, and can be used for localization of existing defects of conducting pattern. The conclusion draws the possibilities of using methods and means of image processing in flaw detection of radio-electronic equipment and instruments

In-Plane Electromagnetic Generator Fabricated on Printed Circuit Board Technology

2013 ◽  
Vol 479-480 ◽  
pp. 524-529
Author(s):  
C.T. Pan ◽  
F.T. Hsu ◽  
C.C. Nien ◽  
Z.H. Liu ◽  
Y.J. Chen ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Energy Harvester ◽  
Cost Effective ◽  
Circuit Board ◽  
Outer Diameter ◽  
Magnetic Element ◽  
Induced Voltage ◽  
Element Analysis ◽  
Printed Circuit ◽  
Electromagnetic Generator

Small and efficient energy harvesters, as a renewable power supply, draw lots of attention in the last few years. This paper presents a planar rotary electromagnetic generator with copper coils fabricated by using printed circuit board (PCB) as inductance and Nd-Fe-B magnets as magnetic element. Coils are fabricated on PCB, which is presumably cost-effective and promising methods. 28-pole Nd-Fe-B magnets with outer diameter of 50 mm and thickness of 2 mm was sintered and magnetized, which can provide magnetic field of 1.44 Tesla. This harvester consists of planar multilayer with multi-pole coils and multi-pole permanent magnet, and the volume of this harvester is about 50x50x2.5 mm3. Finite element analysis is used to design energy harvesting system, and simulation model of the energy harvester is established. In order to verify the simulation, experiment data are compared with simulation result. The PCB energy harvester prototype can generate induced voltage 0.61 V and 13.29mW output power at rotary speed of 4,000 rpm.

scholarly journals Optimization Studies on Recovery of Metals from Printed Circuit Board Waste

2018 ◽  
Vol 2018 ◽  
pp. 1-10 ◽  
Author(s):  
P. Sivakumar ◽  
D. Prabhakaran ◽  
M. Thirumarimurugan
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Lead Nitrate ◽  
Acid Leaching ◽  
Circuit Board ◽  
Copper Recovery ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Electrode Combination ◽  
Lead Metal

The aim of the study was to recover copper and lead metal from waste printed circuit boards (PCBs). The electrowinning method is found to be an effective recycling process to recover copper and lead metal from printed circuit board wastes. In order to simplify the process with affordable equipment, a simple ammonical leaching operation method was adopted. The selected PCBs were incinerated into fine ash powder at 500°C for 1 hour in the pyrolysis reactor. Then, the fine ash powder was subjected to acid-leaching process to recover the metals with varying conditions like acid-base concentration, electrode combination, and leaching time. The relative electrolysis solution of 0.1 M lead nitrate for lead and 0.1 M copper sulphate for copper was used to extract metals from PCBs at room temperature. The amount of lead and copper extracted from the process was determined by an atomic absorption spectrophotometer, and results found were 73.29% and 82.17%, respectively. Further, the optimum conditions for the recovery of metals were determined by using RSM software. The results showed that the percentage of lead and copper recovery were 78.25% and 89.1% should be 4 hrs 10 A/dm2.

scholarly journals A model for the reflection of terahertz signals from printed circuit board surfaces

2018 ◽  
Vol 10 (2) ◽  
pp. 179-186 ◽  
Author(s):  
Alexander Fricke ◽  
Mounir Achir ◽  
Philippe Le Bars ◽  
Thomas Kürner
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Simulated Annealing Algorithm ◽  
Specular Reflection ◽  
Circuit Board ◽  
Network Analyzer ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Propagation Modeling ◽  
Annealing Algorithm

AbstractBased on vector network analyzer Measurements, a model for the specular reflection behavior of printed circuit boards in the Terahertz range has been derived. It has been calibrated to suit the behavior of the measurements using a simulated annealing algorithm. The model has been tailored for integration to ray-tracing-based propagation modeling.

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