scholarly journals Modular System-Level Modeling Method for the Susceptibility Prediction of Balise Information Transmission System

2020 ◽  
Vol 10 (21) ◽  
pp. 7944
Author(s):  
Dan Zhang ◽  
Yinghong Wen ◽  
Jinbao Zhang ◽  
Jianjun Xiao ◽  
Yali Song ◽  
...  
Keyword(s):  
High Speed ◽  
Electromagnetic Compatibility ◽  
Theoretical Method ◽  
Simulation Method ◽  
Physical Structure ◽  
Modeling Method ◽  
Test Method ◽  
System Level ◽  
Modular System ◽  
System Level Modeling

For high-speed train, balise transmission module (BTM) system is easily interfered with by other equipment of the train. This could cause the train to malfunction. Studying the electromagnetic susceptibility (EMS) of the BTM is very important for the performance and efficiency of the train. In this paper, a modular, system-level modeling method is proposed to predict the EMS of BTM systems. Based on object-oriented technology and a modular method, the BTM system is disassembled into several modules according to the electromagnetic characteristics of the whole system rather than the physical structure. All the modules are mutually independent, and the total EMS could be evaluated by the output of them. The modules of three key elements of electromagnetic compatibility (EMC), i.e., sources, coupling paths, and sensitive equipment, are established by the theoretical method, full-wave simulation method, and black-box test method, respectively, and put into different layers. According to the functions of the BTM system, the EMS of BTM is given by analyzing the interrelation of input and output of modules. Results of the proposed model were verified by measurement.

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

Hybrid Simulation of Tracked Vehicle Suspension on Real-Time Environment

2016 ◽  
Vol 248 ◽  
pp. 161-168
Author(s):  
Sławomir Kciuk ◽  
Paweł Kielan ◽  
Arkadiusz Mężyk ◽  
Krzysztof Wilk
Keyword(s):  
Virtual Environments ◽  
Real Time ◽  
High Speed ◽  
Dynamic Properties ◽  
Simulation Method ◽  
Test Method ◽  
Original Design ◽  
Actual Object ◽  
Linear Characteristic ◽  
Non Linear

The work presents simulation method of dynamic properties used as assistance in the construction process of suspension systems for high-speed tracked vehicles. Special consideration has been given to the real-time coupling of virtual models with the dynamic response of actual elastic-damping elements of the vehicles. An original design method has been proposed. The method is characterized by the fact that each of the design stages are not performed sequentially, but are parallel to each other and that at each level, mutual coupling between the tasks of the design process occurs. The proposed simulation method using the dSpace system is based on the integration of virtual environment such as LMS Virtual Lab or MATLAB/Simulink with the actual object such as a damper, by means of dedicated input/output devices operating in real time. The method developed in the work allowed for an extension of the classic co-simulations, that is, simulations in two coupled virtual environments, to include an actual component or, rather – its dynamic – often non-linear – characteristic, its response to excitation. The method developed in the work allowed for an extension of the classic co-simulations, that is, simulations in two coupled virtual environments, to include an actual component or, rather – its dynamic – often non-linear – characteristic, its response to excitation.The developed test method and the computer programs have been verified by means of experimental measurements of the dynamic characteristics of the actual object during test-ground tests and in the laboratory. The obtained results of the simulations and experiments allow to confirm the validity of the assumed thesis, which has been included in the summary.

scholarly journals A Network-Based Method to Analyze EMI Events of On-Board Signaling System in Railway

2020 ◽  
Vol 10 (24) ◽  
pp. 9059
Author(s):  
Meng Li ◽  
Yinghong Wen ◽  
Guodong Wang ◽  
Dan Zhang ◽  
Jinbao Zhang
Keyword(s):  
High Speed ◽  
Electromagnetic Compatibility ◽  
Graph Model ◽  
System Level ◽  
Train Control ◽  
Modeling Process ◽  
Time Operation ◽  
Measurement Results ◽  
Real Time Operation

The On-board Train Control System (OTCS) plays an important role in the real-time operation of the electric multiple units (EMU) in high-speed railway. The EMU is a complex system made up of various electrical and electronic equipment, so the interactions of the electromagnetic (EM) environment and OTCS are difficult to study, which leads to more challenges to analyze EM interference (EMI) events at the system level. To overcome this difficulty, this paper proposes the thought of a graph model to solve the problem. First, a framework is proposed to more clearly reflect the relationship between the EMC (Electromagnetic Compatibility) problem and network through a comparison with them. Second, a network theory-based model is presented to express the EMC elements for the OTCS in EMU. It decomposes the OTCS and EMU with EMC elements into edges and nodes of the network, which parameters are defined corresponding to EM sources, sensitive equipment, and coupling paths. Thus, each part could be modeled separately or together by calculation, simulation, or measurement, respectively, and the EMC problem could be represented by the paths from origin to destination in the network. Moreover, the modeling process was elucidated by the specific cases in OTCS and the validity of the proposed approach was verified by calculation and measurement results in the case study.

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