scholarly journals Selective Plasma Etching of Polymer-Metal Mesh Foil in Large-Area Hydrogen Atmospheric Pressure Plasma

2020 ◽  
Vol 10 (20) ◽  
pp. 7356
Author(s):  
Richard Krumpolec ◽  
Jana Jurmanová ◽  
Miroslav Zemánek ◽  
Jakub Kelar ◽  
Dušan Kováčik ◽  
...  

We present a novel method of surface processing of complex polymer-metal composite substrates. Atmospheric-pressure plasma etching in pure H2, N2, H2/N2 and air plasmas was used to fabricate flexible transparent composite poly(methyl methacrylate) (PMMA)-based polymer film/Ag-coated Cu metal wire mesh substrates with conductive connection sites by the selective removal of the thin (~10–100 nm) surface PMMA layer. To mimic large-area roll-to-roll processing, we used an advanced alumina-based concavely curved electrode generating a thin and high-power density cold plasma layer by the diffuse coplanar surface barrier discharge. A short 1 s exposure to pure hydrogen plasma, led to successful highly-selective etching of the surface PMMA film without any destruction of the Ag-coated Cu metal wires embedded in the PMMA polymer. On the other hand, the use of ambient air, pure nitrogen and H2/N2 plasmas resulted in undesired degradation both of the polymer and the metal wires surfaces. Since it was found that the etching efficiency strongly depends on the process parameters, such as treatment time and the distance from the electrode surface, we studied the effect and performance of these parameters.

2014 ◽  
Vol 314 ◽  
pp. 1074-1081 ◽  
Author(s):  
Jia-Yang Juang ◽  
Tung-Sheng Chou ◽  
Hsin-Tien Lin ◽  
Yuan-Fang Chou ◽  
Chih-Chiang Weng

2014 ◽  
Vol 778-780 ◽  
pp. 759-762 ◽  
Author(s):  
Yasuhisa Sano ◽  
Hiroaki Nishikawa ◽  
Yuu Okada ◽  
Kazuya Yamamura ◽  
Satoshi Matsuyama ◽  
...  

Silicon carbide (SiC) is a promising semiconductor material for high-temperature, high-frequency, high-power, and energy-saving applications. However, because of the hardness and chemical stability of SiC, few conventional machining methods can handle this material efficiently. A plasma chemical vaporization machining (PCVM) technique is an atmospheric-pressure plasma etching process. We previously proposed a novel style of PCVM dicing using slit apertures for plasma confinement, which in principle can achieve both a high removal rate and small kerf loss, and demonstration experiments were performed using a silicon wafer as a sample. In this research, some basic experiments were performed using 4H-SiC wafer as a sample, and a maximum removal rate of approximately 10 μm/min and a narrowest groove width of 25 μm were achieved. We also found that argon can be used for plasma generation instead of expensive helium gas.


2019 ◽  
Vol 125 (6) ◽  
pp. 063304 ◽  
Author(s):  
Thi-Thuy-Nga Nguyen ◽  
Minoru Sasaki ◽  
Hidefumi Odaka ◽  
Takayoshi Tsutsumi ◽  
Kenji Ishikawa ◽  
...  

2015 ◽  
Vol 5 (2-4) ◽  
pp. 283-298 ◽  
Author(s):  
Tomoko Ito ◽  
Kensaku Gotoh ◽  
Kanako Sekimoto ◽  
Satoshi Hamaguchi

2011 ◽  
Vol 519 (20) ◽  
pp. 6746-6749 ◽  
Author(s):  
Seungryul Yoo ◽  
Taihyeop Lho ◽  
Dong Chan Seok ◽  
Yong Cheol Hong ◽  
Bongju Lee

Polymers ◽  
2021 ◽  
Vol 13 (16) ◽  
pp. 2711
Author(s):  
Dariusz Korzec ◽  
Thomas Andres ◽  
Eva Brandes ◽  
Stefan Nettesheim

The treatment of a polymer surface using an atmospheric pressure plasma jet (APPJ) causes a local increase of the surface free energy (SFE). The plasma-treated zone can be visualized with the use of a test ink and quantitatively evaluated. However, the inked area is shrinking with time. The shrinkage characteristics are collected using activation image recording (AIR). The recording is conducted by a digital camera. The physical mechanisms of activation area shrinkage are discussed. The error sources are analyzed and methods of error reduction are proposed. The standard deviation of the activation area is less than 3%. Three polymers, acrylonitrile butadiene styrene (ABS), high-density polyethylene (HDPE), and polyoxymethylene (POM), are examined as a test substrate material. Due to a wide variation range of SFE and a small hydrophobic recovery, HDPE is chosen. Since the chemical mixtures tend to temporal changes of the stoichiometry, the pure formamide test ink with 58 mN/m is selected. The method is tested for the characterization of five different types of discharge: (i) pulsed arc APPJ with the power of about 700 W; (ii) piezoelectric direct discharge APPJ; (iii) piezoelectric driven needle corona in ambient air; (iv) piezoelectric driven plasma needle in argon; and (v) piezoelectric driven dielectric barrier discharge (DBD). For piezoelectrically driven discharges, the power was either 4.5 W or 8 W. It is shown how the AIR method can be used to solve different engineering problems.


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