scholarly journals A Conceptual Investigation at the Interface between Wireless Power Devices and CMOS Neuron IC for Retinal Image Acquisition

2020 ◽  
Vol 10 (18) ◽  
pp. 6154
Author(s):  
AlaaDdin Al-Shidaifat ◽  
Sandeep Kumar ◽  
Shubhro Chakrabartty ◽  
Hanjung Song
Keyword(s):  
Integrated Circuit ◽  
Power Efficiency ◽  
Printed Circuit Board ◽  
National Standards ◽  
Circuit Board ◽  
Oxide Semiconductor ◽  
Dynamic Feedback ◽  
Wireless Power ◽  
Power Devices ◽  
Power Harvesting

In this paper, a conceptual investigation of the interface between wireless power devices and a retina complementary metal oxide semiconductor (CMOS) neuron integrated circuit (IC) have been presented. The proposed investigation consists of three designs: design-I, design-II, and design-III. Design-I involves a slotted loop monopole antenna as per American National Standards Institute (ANSI) guidelines, which achieve an ultra-wide band ranging from 3.1 GHz to 10.6 GHz. The biocompatible antenna is made on silicon-nitride substrate using on-wafer packaging technology and it is used as a receiver device. The performance of antenna provides a wideband, sufficient power to receive, and low losses due to the avoidance of printed circuit board (PCB) fabrication. A CMOS based multi-stack power harvesting circuit achieves the output power ranging from 4 mW to 2.7 W and corresponds from the selected Radio Frequency (RF) bands of loop antenna is exhibited in design-II. The power efficiency of 40% to 82%, with respect to output powers of 4 mW to 2.7 W, is achieved. Design-III includes a CMOS based retina neuron circuit that employs a dynamic feedback technique and support to achieve the number of read-out spikes. At the end of the interface between wireless power devices and a CMOS retina neuron IC, 50 mV read-out spikes are achieved, with varying light intensity, from 0 mW/cm2 to 2 mW/cm2. The proposed design-II and design-III are implemented and fabricated using commercial CMOS 0.065 µm, Samsung process. The antenna and RF power harvesting IC could be placed on a contact lens platform while retina neuron IC can be implanted after ganglions cells inside the eye. The antenna and harvesting IC are physically connected to the retina circuit in the form of light. This conceptual investigation could support medical professionals in achieving an interfacing approach to restore the image visualization.

scholarly journals Design and verification of a low-power AC/DC converter

2021 ◽  
Vol 72 (2) ◽  
pp. 113-118
Author(s):  
Miroslav Potočný ◽  
Viera Stopjaková ◽  
Martin Kováč
Keyword(s):  
Low Power ◽  
Experimental Verification ◽  
Integrated Circuit ◽  
Power Efficiency ◽  
Printed Circuit Board ◽  
Cmos Technology ◽  
Circuit Board ◽  
Line Voltage ◽  
Power Domain ◽  
Available Technology

Abstract This paper deals with the development and experimental verification of a low-power AC/DC converter. The proposed solution is aimed at the sub 0.5 W output power domain, commonly encountered in applications such as always-on wireless sensing nodes. To implement the proposed converter topology, a prototype application specific integrated circuit was designed and manufactured in a high voltage 0.35 µm CMOS technology, able to handle the maximum voltage of up to 120 V. The proposed design was first analyzed by transistor-level simulations showing high power efficiency and low no-load consumption of the developed converter. To facilitate experimental verification and measurement, an printed circuit board with the necessary external components was developed, as the available technology is unable to handle the AC line voltage directly. While the developed converter operated well with decreased input AC voltage, reliability issues arose during operation with the full AC line voltage of 230 Vrms. These are linked to digital control circuitry of the implemented chip and could be addressed in the second manufacturing run in the future.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Wireless Power Transfer Systems via Strong Coupled Magnetic Resonances — Design, PCB Implementation and Tests

2011 ◽  
Vol 383-390 ◽  
pp. 5984-5989
Author(s):  
Yan Ping Yao ◽  
Hong Yan Zhang ◽  
Zheng Geng
Keyword(s):  
Printed Circuit Board ◽  
Experimental System ◽  
Wireless Power Transfer ◽  
Circuit Board ◽  
Transfer Efficiency ◽  
Power Transfer ◽  
Wireless Power ◽  
Power Transfer Efficiency ◽  
Coil Winding ◽  
Magnetic Resonances

In this paper, we present theoretical analysis and detailed design of a class of wireless power transfer (WPT) systems based on strong coupled magnetic resonances. We established the strong coupled resonance conditions for practically implementable WPT systems. We investigated the effects of non-ideal conditions presented in most practical systems on power transfer efficiency and proposed solutions to deal with these problems. We carried out a design of WPT system by using PCB (Printed Circuit Board) antenna pair, which showed strong coupled magnetic resonances. The innovations of our design include: (1) a new coil winding pattern for resonant coils that achieves a compact space volume, (2) fabrication of resonant coils on PCBs, and (3) integration of the entire system on a pair of PCBs. Extensive experiments were performed and experimental results showed that our WPT system setup achieved a guaranteed power transfer efficiency 14% over a distance of two times characteristic length(44cm). The wireless power transfer efficiency in this PCB based experimental system was sufficiently high to lighten up a LED with a signal generator.

Virtual Ground Fence: A Simple Method for Protection against High Frequency Simultaneous Switching Noise

2012 ◽  
Vol 2012 (1) ◽  
pp. 001081-001084 ◽  
Author(s):  
Jesse Bowman ◽  
A. Ege Engin
Keyword(s):  
Power Distribution ◽  
Distribution System ◽  
Power Efficiency ◽  
Printed Circuit Board ◽  
Supply Voltage ◽  
Circuit Board ◽  
Voltage Source ◽  
Accurate Estimation ◽  
Simple Method ◽  
Power Distribution System

When integrating sensitive RF analog devices with complex VLSI digital components, simultaneously switching drivers cause supply voltage fluctuations which can propagate both horizontally and vertically between the power/ground planes. The same voltage source on a printed circuit board can be shared to increase power efficiency and reduce space used. In order to accomplish this, on board filtering is needed to isolate the noise between these two types of devices for proper operation. Hence, accurate estimation and improvement of the performance of power/ground planes is critical in a mixed-signal system. We present a new method to minimize the noise transfer at high frequencies to the power distribution system, called the Virtual Ground Fence. At its basic level, the Virtual Ground Fence consists of quarter-wave transmission-line stubs that act as short circuits between power and ground planes at their design frequency. We will present various configurations of Virtual Ground Fence for different coupling scenarios.

High quality factor fractal inductor with complementary split-ring array inclusion

Circuit World ◽  
2020 ◽  
Vol 46 (3) ◽  
pp. 215-219
Author(s):  
Akhendra Kumar Padavala ◽  
Narayana Kiran Akondi ◽  
Bheema Rao Nistala
Keyword(s):  
Quality Factor ◽  
Circuit Design ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Circuit Board ◽  
Integrated Circuit Design ◽  
Split Ring ◽  
Content Type ◽  
Practical Implications

Purpose This paper aims to present an efficient method to improve quality factor of printed fractal inductors based on electromagnetic band-gap (EBG) surface. Design/methodology/approach Hilbert fractal inductor is designed and simulated using high-frequency structural simulator. To improve the quality factor, an EBG surface underneath the inductor is incorporated without any degradation in inductance value. Findings The proposed inductor and Q factor are measured based on well-known three-dimensional simulator, and the results are compared experimentally. Practical implications The proposed method was able to significantly decrease the noise with increase in the speed of radio frequency and sensor-integrated circuit design. Originality/value Fractal inductor is designed and simulated with and without EBG surfaces. The measurement of printed circuit board prototypes demonstrates that the inclusion of split-ring array as EBG surface increases the quality factor by 90 per cent over standard fractal inductor of the same dimensions with a small degradation in inductance value and is capable of operating up to 2.4 GHz frequency range.

scholarly journals A Comprehensive Comparison of EMI Immunity in CMOS Amplifier Topologies

Electronics ◽  
2019 ◽  
Vol 8 (10) ◽  
pp. 1181 ◽  
Author(s):  
Simone Becchetti ◽  
Anna Richelli ◽  
Luigi Colalongo ◽  
Zsolt Kovacs-Vajna
Keyword(s):  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Complementary Metal Oxide Semiconductor ◽  
Circuit Board ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Fair Comparison ◽  
Comprehensive Comparison ◽  
Folded Cascode ◽  
Cmos Amplifier

This paper provides the results of a comprehensive comparison between complementary metal oxide semiconductor (CMOS) amplifiers with low susceptibility to electromagnetic interference (EMI). They represent the state-of-the-art in low EMI susceptibility design. An exhaustive scenario for EMI pollution has been considered: the injected interference can indeed directly reach the amplifier pins or can be coupled from the printed circuit board (PCB) ground. This is also a key point for evaluating the susceptibility from EMI coupled to the output pin. All of the amplifiers are re-designed in a United Microelectronics Corporation (UMC) 180 nm CMOS process in order to have a fair comparison. The topologies investigated and compared are basically derived from the Miller and the folded cascode ones, which are well-known and widely used by CMOS analog designers.

Investigations of temperature sensor embedded into PCB

2020 ◽  
Vol 37 (4) ◽  
pp. 199-204
Author(s):  
Kamil Janeczek ◽  
Aneta Araźna ◽  
Wojciech Stęplewski ◽  
Marek Kościelski ◽  
Krzysztof Lipiec ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Functional Properties ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Circuit Board ◽  
Temperature Sensitive ◽  
Content Type ◽  
Transponder Ic ◽  
Passive Sensor

Purpose The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties. Design/methodology/approach A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor circuitry was fabricated and embedded into a PCB with the proposed technologies. Finally, properties of the embedded structures were examined as well-functional parameters of the sensor circuitries. Findings The described investigation results confirmed that the proposed technologies using an epoxy resin or standard materials used for PCB’s production allowed to successfully produce sensors embedded into PCBs. This technology did not have a negative significant impact either on quality of solder joints of the assembled transponder IC or on functional properties of the embedded sensor. Apart from the identification data, the reported sensor can provide information about a selected property of its environment, e.g. temperature when its internal temperature sensitive element is used or other factors with the use of external sensitive elements, such as humidity. Research limitations/implications It is planned to carry on the reported investigations to examine other types of sensor circuitries capable of indicating e.g. humidity level and to evaluate influence of the proposed technology on their functional properties. Practical implications The reported sensor circuitries can be successfully used in electronic industry in internet of things systems not only to identify monitored electronic devices, but also to control selected parameters of external environment. This creates opportunity to detect device malfunction by detecting local temperature growth or to analyze its environment, which might allow to predict failure of controlled products using radio waves. This advantage seems to be extremely beneficial for applications, such as space, aviation or military, in which embedded sensor systems may lead to enhancing reliability of electronic devices by reacting on occurred failures in a more efficient way. Originality/value This study demonstrates valuable information for engineers conducting research on sensor components embedded into PCBs. The reported technologies are quite simple and cost-effective because of the use of standard materials known for PCB’s production or an epoxy resin which could be treated as an additional encapsulant material enhancing mechanical properties of the embedded sensor transponder IC.

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