scholarly journals Bayesian Inference for 3D Volumetric Heat Sources Reconstruction from Surfacic IR Imaging

2020 ◽  
Vol 10 (5) ◽  
pp. 1607
Author(s):  
Marie-Marthe Groz ◽  
Emmanuelle Abisset-Chavanne ◽  
Anissa Meziane ◽  
Alain Sommier ◽  
Christophe Pradère
Keyword(s):  
Heat Source ◽  
Temperature Response ◽  
Optical Excitation ◽  
Thermal Characterization ◽  
Transient Temperature ◽  
Geometrical Shape ◽  
Heat Sources ◽  
Destructive Testing ◽  
Joule Effect ◽  
Ir Camera

The domain of non-destructive testing (NDT) or thermal characterization is currently often done by using contactless methods based on the use of an IR camera to monitor the transient temperature response of a system or sample warmed by using any heat source. Though many techniques use optical excitation (flash lamps, lasers, etc.), some techniques use volumetric sources such as acoustic or induction waves. In this paper, we propose a new inverse processing method, which allows for the estimation of 3D fields of heat sources from surface temperature measurements. This method should be associated with volumetric heat source generation. To validate the method, a volumetric source was generated by the Joule effect in a homogeneous PVC sample using an electrical thin cylindrical wire molded in the material. The inverse processing allows us to retrieve the depth of the wire and its geometrical shape and size. This tool could be a new procedure for retrieving 3D defects on NDT.

Transient Temperature Involving Oscillatory Heat Source With Application in Fretting Contact

2007 ◽  
Vol 129 (3) ◽  
pp. 517-527 ◽  
Author(s):  
Jun Wen ◽  
M. M. Khonsari
Keyword(s):  
Heat Source ◽  
Oscillation Amplitude ◽  
The Body ◽  
Transient Temperature ◽  
Dimensionless Frequency ◽  
Heat Sources ◽  
Infinite Body ◽  
Fitting Method ◽  
Wide Range ◽  
Analytical Expressions

An analytical approach for treating problems involving oscillatory heat source is presented. The transient temperature profile involving circular, rectangular, and parabolic heat sources undergoing oscillatory motion on a semi-infinite body is determined by integrating the instantaneous solution for a point heat source throughout the area where the heat source acts with an assumption that the body takes all the heat. An efficient algorithm for solving the governing equations is developed. The results of a series simulations are presented, covering a wide range of operating parameters including a new dimensionless frequency ω¯=ωl2∕4α and the dimensionless oscillation amplitude A¯=A∕l, whose product can be interpreted as the Peclet number involving oscillatory heat source, Pe=ω¯A¯. Application of the present method to fretting contact is presented. The predicted temperature is in good agreement with published literature. Furthermore, analytical expressions for predicting the maximum surface temperature for different heat sources are provided by a surface-fitting method based on an extensive number of simulations.

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

1999 ◽  
Author(s):  
V. H. Adams ◽  
K. Ramakrishna
Keyword(s):  
Heat Source ◽  
Heat Generation ◽  
Thermal Characterization ◽  
Electronic Packages ◽  
Heat Sources ◽  
Discrete Heat Sources ◽  
Uniform Heat ◽  
On Chip ◽  
Silicon Based

Abstract Simulations for thermal characterization of electronic packages for silicon-based integrated circuit (IC) components typically assume one of the two uniform heat generation conditions. They are: (1) an isoflux condition in which heat generation is uniformly distributed over the active surface of the die, or (2) a uniform heat generation over the entire (or active) volume of the die. The use of these models may be justified due to high thermal conductivity of silicon, size of the devices on the die, and their relatively uniform spatial distribution over the entire surface of the die in the traditional silicon technologies. However, the current and future technologies are migrating towards embedded systems solutions, such as system-on-chip, and in traditional applications devices are brought in close proximity to each other for improved on-chip electrical performance. These trends result in localized regions of power dissipation on the die that would invalidate the use of traditional uniform generation models in the thermal characterization. The present study examines the effect of discrete heat sources (as opposed to uniformly distributed sources) on the die on thermal performance and characterization of the electronic packages. For this purpose, a conjugate heat transfer problem of a memory chip in a 119 I/O flip chip ceramic and plastic ball grid array (FC-C & PBGA) package under natural and forced convection conditions. First the model is validated against experimentally measured thermal data on a 119 I/O FC-C & P BGA daisy-chain test packages with a thermal test die with uniformly distributed resistive heat source. Junction-to-ambient temperature difference predictions from the simulations are within 10% of the measurements for the uniform heating case. The validated model is then suitably modified to account for discrete heat sources and actual substrates. Results from the discrete heat sources study show a 15–20% increase in predicted junction-to-ambient temperature difference and a larger (a 10–15 °C) temperature variation across the active face of the die than for with a uniform heat source. These results call for the use of discrete heat sources in the thermal characterization of new generation of embedded silicon technologies. They also point to the need for development of test die and characterization methodologies for these technologies with discrete heat sources.

PLANETARY SELF-ORGANIZATION

2020 ◽  
Vol 42 (3) ◽  
pp. 271-282
Author(s):  
OLEG IVANOV
Keyword(s):  
Dynamical System ◽  
Heat Source ◽  
Mantle Convection ◽  
Plate Tectonics ◽  
Rotation Speed ◽  
Self Organization ◽  
Heat Sources ◽  
Kinematic Parameters ◽  
The Earth ◽  
New Type

The general characteristics of planetary systems are described. Well-known heat sources of evolution are considered. A new type of heat source, variations of kinematic parameters in a dynamical system, is proposed. The inconsistency of the perovskite-post-perovskite heat model is proved. Calculations of inertia moments relative to the D boundary on the Earth are given. The 9 times difference allows us to claim that the sliding of the upper layers at the Earth's rotation speed variations emit heat by viscous friction.This heat is the basis of mantle convection and lithospheric plate tectonics.

Fault Localization and Functional Testing of ICs by Lock-in Thermography

2002 ◽  
Author(s):  
O. Breitenstein ◽  
J.P. Rakotoniaina ◽  
F. Altmann ◽  
J. Schulz ◽  
G. Linse
Keyword(s):  
Spatial Resolution ◽  
Electronic Device ◽  
Imaging Techniques ◽  
Heat Diffusion ◽  
Acquisition Time ◽  
Temperature Modulation ◽  
Heat Sources ◽  
Ir Camera ◽  
Free Running ◽  
Lock In

Abstract In this paper new thermographic techniques with significant improved temperature and/or spatial resolution are presented and compared with existing techniques. In infrared (IR) lock-in thermography heat sources in an electronic device are periodically activated electrically, and the surface is imaged by a free-running IR camera. By computer processing and averaging the images over a certain acquisition time, a surface temperature modulation below 100 µK can be resolved. Moreover, the effective spatial resolution is considerably improved compared to stead-state thermal imaging techniques, since the lateral heat diffusion is suppressed in this a.c. technique. However, a serious limitation is that the spatial resolution is limited to about 5 microns due to the IR wavelength range of 3 -5 µm used by the IR camera. Nevertheless, we demonstrate that lock-in thermography reliably allows the detection of defects in ICs if their power exceeds some 10 µW. The imaging can be performed also through the silicon substrate from the backside of the chip. Also the well-known fluorescent microthermal imaging (FMI) technique can be be used in lock-in mode, leading to a temperature resolution in the mK range, but a spatial resolution below 1 micron.

scholarly journals Inductive Thermography as Non-Destructive Testing for Railway Rails

2021 ◽  
Vol 11 (3) ◽  
pp. 1003
Author(s):  
Christoph Tuschl ◽  
Beate Oswald-Tranta ◽  
Sven Eck
Keyword(s):  
Eddy Current ◽  
Electrical Discharge Machining ◽  
Rolling Contact ◽  
Heat Diffusion ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Ir Camera ◽  
Advantages And Disadvantages ◽  
Average Crack ◽  
Non Destructive

Inductive thermography is a non-destructive testing method, whereby the specimen is slightly heated with a short heating pulse (0.1–1 s) and the temperature change on the surface is recorded with an infrared (IR) camera. Eddy current is induced by means of high frequency (HF) magnetic field in the surface ‘skin’ of the specimen. Since surface cracks disturb the eddy current distribution and the heat diffusion, they become visible in the IR images. Head checks and squats are specific types of damage in railway rails related to rolling contact fatigue (RCF). Inductive thermography can be excellently used to detect head checks and squats on rails, and the method is also applicable for characterizing individual cracks as well as crack networks. Several rail pieces with head checks, with artificial electrical discharge-machining (EDM)-cuts and with a squat defect were inspected using inductive thermography. Aiming towards rail inspection of the track, 1 m long rail pieces were inspected in two different ways: first via a ‘stop-and-go’ technique, through which their subsequent images are merged together into a panorama image, and secondly via scanning during a continuous movement of the rail. The advantages and disadvantages of both methods are compared and analyzed. Special image processing tools were developed to automatically fully characterize the rail defects (average crack angle, distance between cracks and average crack length) in the recorded IR images. Additionally, finite element simulations were used to investigate the effect of the measurement setup and of the crack parameters, in order to optimize the experiments.

scholarly journals Analysis and Comparison of Some Low-Temperature Heat Sources for Heat Pumps

Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1853 ◽  
Author(s):  
Pavel Neuberger ◽  
Radomír Adamovský
Keyword(s):  
Heat Transfer ◽  
Low Temperature ◽  
Heat Source ◽  
Heat Pump ◽  
Heat Exchangers ◽  
Ambient Air ◽  
Heat Transfer Fluid ◽  
Heat Sources ◽  
Ground Heat Exchangers ◽  
Temperature Heat

The efficiency of a heat pump energy system is significantly influenced by its low-temperature heat source. This paper presents the results of operational monitoring, analysis and comparison of heat transfer fluid temperatures, outputs and extracted energies at the most widely used low temperature heat sources within 218 days of a heating period. The monitoring involved horizontal ground heat exchangers (HGHEs) of linear and Slinky type, vertical ground heat exchangers (VGHEs) with single and double U-tube exchanger as well as the ambient air. The results of the verification indicated that it was not possible to specify clearly the most advantageous low-temperature heat source that meets the requirements of the efficiency of the heat pump operation. The highest average heat transfer fluid temperatures were achieved at linear HGHE (8.13 ± 4.50 °C) and double U-tube VGHE (8.13 ± 3.12 °C). The highest average specific heat output 59.97 ± 41.80 W/m2 and specific energy extracted from the ground mass 2723.40 ± 1785.58 kJ/m2·day were recorded at single U-tube VGHE. The lowest thermal resistance value of 0.07 K·m2/W, specifying the efficiency of the heat transfer process between the ground mass and the heat transfer fluid, was monitored at linear HGHE. The use of ambient air as a low-temperature heat pump source was considered to be the least advantageous in terms of its temperature parameters.

Experimental and Theoretical Analysis of Transient Response of Plate Heat Exchangers in Presence of Nonuniform Flow Distribution

2008 ◽  
Vol 130 (5) ◽  
Author(s):  
N. Srihari ◽  
Sarit K. Das
Keyword(s):  
Steady State ◽  
Heat Exchangers ◽  
Sudden Change ◽  
Temperature Response ◽  
Flow Distribution ◽  
Transient Temperature ◽  
Nonuniform Flow ◽  
Flow Rates ◽  
Plate Heat ◽  
Flow Maldistribution

Transient analysis helps us to predict the behavior of heat exchangers subjected to various operational disturbances due to sudden change in temperature or flow rates of the working fluids. The present experimental analysis deals with the effect of flow distribution on the transient temperature response for U-type and Z-type plate heat exchangers. The experiments have been carried out with uniform and nonuniform flow distributions for various flow rates. The temperature responses are analyzed for various transient characteristics, such as initial delay and time constant. It is also possible to observe the steady state characteristics after the responses reach asymptotic values. The experimental observations indicate that the Z-type flow configuration is more strongly affected by flow maldistribution compared to the U-type in both transient and steady state regimes. The comparison of the experimental results with numerical solution indicates that it is necessary to treat the flow maldistribution separately from axial thermal dispersion during modeling of plate heat exchanger dynamics.

Development of Convective Heat Transfer Near Suddenly Heated, Vertically Aligned Horizontal Wires

1987 ◽  
Vol 109 (4) ◽  
pp. 912-918 ◽  
Author(s):  
J. R. Parsons ◽  
M. L. Arey
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Fluid Layer ◽  
Convective Motion ◽  
Transient Behavior ◽  
Temperature Fields ◽  
Heat Sources ◽  
Transfer Coefficients ◽  
Vertically Aligned ◽  
The Wire

Experiments have been performed which describe the transient development of natural convective flow from both a single and two vertically aligned horizontal cylindrical heat sources. The temperature of the wire heat sources was monitored with a resistance bridge arrangement while the development of the flow field was observed optically with a Mach–Zehnder interferometer. Results for the single wire show that after an initial regime where the wire temperature follows pure conductive response to a motionless fluid, two types of fluid motion will begin. The first is characterized as a local buoyancy, wherein the heated fluid adjacent to the wire begins to rise. The second is the onset of global convective motion, this being governed by the thermal stability of the fluid layer immediately above the cylinder. The interaction of these two motions is dependent on the heating rate and relative heat capacities of the cylinder and fluid, and governs whether the temperature response will exceed the steady value during the transient (overshoot). The two heat source experiments show that the merging of the two developing temperature fields is hydrodynamically stabilizing and thermally insulating. For small spacing-to-diameter ratios, the development of convective motion is delayed and the heat transfer coefficients degraded by the proximity of another heat source. For larger spacings, the transient behavior approaches that of a single isolated cylinder.

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