scholarly journals High-speed carrier-depletion silicon Mach-Zehnder optical modulators with lateral PN junctions

2014 ◽  
Vol 2 ◽  
Author(s):  
Graham T. Reed ◽  
David J. Thomson ◽  
Frederic Y. Gardes ◽  
Youfang Hu ◽  
Jean-Marc Fedeli ◽  
...  
Keyword(s):  
High Speed ◽  
Optical Modulators ◽  
Pn Junctions

High Speed Metal–Oxide–Semiconductor Capacitor-Based Silicon Optical Modulators

2006 ◽  
Vol 45 (8B) ◽  
pp. 6603-6608 ◽  
Author(s):  
Ling Liao ◽  
Dean Samara-Rubio ◽  
Ansheng Liu ◽  
Doron Rubin ◽  
Ulrich D. Keil ◽  
...  
Keyword(s):  
Metal Oxide ◽  
High Speed ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Optical Modulators ◽  
Metal Oxide Semiconductor Capacitor

Design optimization of high-speed optical modulators

2006 ◽  
Author(s):  
B. M. A. Rahman ◽  
Shyqyri Haxha ◽  
Vesel Haxha ◽  
Kenneth T. V. Grattan
Keyword(s):  
Design Optimization ◽  
High Speed ◽  
Optical Modulators

High Speed Silicon optical modulators

2011 ◽  
Author(s):  
G. T. Reed ◽  
D. Thomson ◽  
F. Y. Gardes ◽  
N G Emerson ◽  
J-M. Fédéli.
Keyword(s):  
High Speed ◽  
Optical Modulators

Microwave signal processing using high speed silicon optical modulators

2016 ◽  
Author(s):  
Linjie Zhou ◽  
Yanyang Zhou ◽  
Minjuan Wang ◽  
Yiming Zhong ◽  
Yujie Xia ◽  
...  
Keyword(s):  
Signal Processing ◽  
High Speed ◽  
Microwave Signal ◽  
Optical Modulators

Design optimization of high-speed optical modulators

2006 ◽  
Author(s):  
B. M. Azizur Rahman ◽  
Shyqyri Haxha ◽  
Vesel Haxha ◽  
Kenneth T. V. Grattan
Keyword(s):  
Design Optimization ◽  
High Speed ◽  
Optical Modulators

High-speed stacked tunneling PiN electro-optical modulators

2013 ◽  
Author(s):  
Pengfei Wu ◽  
Michael Shur ◽  
Zhaoran Rena Huang
Keyword(s):  
High Speed ◽  
Optical Modulators

Estimation of frequency response for high-speed LiNbO3 optical modulators

1999 ◽  
Vol 146 (2) ◽  
pp. 99-104 ◽  
Author(s):  
O. Mitomi ◽  
K. Noguchi ◽  
H. Miyazawa
Keyword(s):  
Frequency Response ◽  
High Speed ◽  
Optical Modulators

QUANTUM WELL OPTOELECTRONIC SWITCHING DEVICES

1990 ◽  
Vol 01 (01) ◽  
pp. 19-46 ◽  
Author(s):  
D.A.B. MILLER
Keyword(s):  
Integrated Circuits ◽  
Quantum Well ◽  
High Speed ◽  
Free Space Optics ◽  
Optical Logic ◽  
Optical Modulators ◽  
Space Optics ◽  
Good Potential ◽  
Parallel Arrays ◽  
Optoelectronic Switching

Quantum well semiconductor structures allow small, fast, efficient optoelectronic devices such as optical modulators and switches. These are capable of logic themselves and have good potential for integration with electronic integrated circuits for parallel high speed interconnections. Devices can be made both in waveguides and two-dimensional parallel arrays. Working arrays of optical logic and memory devices have been demonstrated, to sizes as large as 2 048 elements, all externally accessible in parallel with free-space optics. This article gives an overview of the physics underlying the operation of such devices, and describes the principles of several of the device types, including self-electrooptic effect devices (SEEDs).

Packaging Tradeoff for SIP Integration Targeting High Speed PAM-4 Applications

2015 ◽  
Vol 2015 (1) ◽  
pp. 000730-000734
Author(s):  
B Haentjens ◽  
G Desruelles ◽  
G Chrétien ◽  
A Leborgne ◽  
Y Haentjens ◽  
...  
Keyword(s):  
System Integration ◽  
High Speed ◽  
Pulse Amplitude ◽  
Electronic System ◽  
Design Flow ◽  
Ultra Wideband ◽  
Optical Modulators ◽  
Eye Diagram ◽  
Modulation Format ◽  
Bga Package

High speed transmission systems using optical fiber are now focusing on 4-level PAM (Pulse Amplitude Modulation) format. This is requesting ultra-wideband electronic system in package, with a high phase linearity behavior in order to drive the electro-optical modulators. Moreover, new power DAC (Digital to Analog Converter) dies, are now available to generate up to 56 GBd, 4-level PAM signals, and providing 4Vpp of differential output amplitude swing. High frequency studies have been pursued to provide system integration in a BGA (Ball Grid Array) package. The BGA package transitions optimization and the configuration of multi-lines carriers, becomes a key step in the design flow. In this paper, some steps of the design, manufacturing process of the SIP (System In Package) and its demonstration board are proposed. The choices of the package, the thermal management, the clock management function are studied according to the final environmental constraint of the SIP. The data lines phase skew are analyzed with the support of EM (Electro Magnetic) simulations to better understand the potential impact on the output eye. Finally, the BGA package transition, simulated and measured results are compared, from DC up to 40 GHz and the measured SIP output, 4 levels, 56GBps eye diagram is presented.

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