Surface Correlation based Indoor Precise Localization System in Vulnerable Environment with Very Few RF Transmitters

2019 ◽  
Author(s):  
Jung Ho Lee ◽  
Taikjin Lee
Keyword(s):  
Precise Localization ◽  
Localization System ◽  
Rf Transmitters

Design of a Bell-Shaped Ultra Wideband Antenna for Indoor Localization System

2015 ◽  
Vol 5 (6) ◽  
pp. 323 ◽  
Author(s):  
Nadia Ghariani ◽  
Mohamed Salah Karoui ◽  
Mondher Chaoui ◽  
Mongi Lahiani ◽  
Hamadi Ghariani
Keyword(s):  
Indoor Localization ◽  
Ultra Wideband ◽  
Localization System ◽  
Wideband Antenna

VLSI Implementation of an Adaptable Localization System for All Unicycle Robot Platforms

2017 ◽  
Vol 10 (1) ◽  
pp. 8
Author(s):  
Badr Elkari ◽  
Hassan Ayad ◽  
Abdeljalil El Kari ◽  
Mostafa Mjahed
Keyword(s):  
Vlsi Implementation ◽  
Localization System

Super-Conducting Quantum Interference Device Technique: 3-D Localization of a Short within a Flip Chip Assembly

2001 ◽  
Author(s):  
Kendall Scott Wills ◽  
Omar Diaz de Leon ◽  
Kartik Ramanujachar ◽  
Charles P. Todd
Keyword(s):  
Form Factor ◽  
Failure Analysis ◽  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Time Domain Reflectometry ◽  
Interfacial Region ◽  
Precise Localization ◽  
Super Conducting ◽  
Accuracy Of Measurement

Abstract In the current generations of devices the die and its package are closely integrated to achieve desired performance and form factor. As a result, localization of continuity failures to either the die or the package is a challenging step in failure analysis of such devices. Time Domain Reflectometry [1] (TDR) is used to localize continuity failures. However the accuracy of measurement with TDR is inadequate for effective localization of the failsite. Additionally, this technique does not provide direct 3-Dimenstional information about the location of the defect. Super-conducting Quantum Interference Device (SQUID) Microscope is useful in localizing shorts in packages [2]. SQUID microscope can localize defects to within 5um in the X and Y directions and 35um in the Z direction. This accuracy is valuable in precise localization of the failsite within the die, package or the interfacial region in flipchip assemblies.

Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing

2012 ◽  
Author(s):  
P. Larré ◽  
H. Tupin ◽  
C. Charles ◽  
R.H. Newton ◽  
A. Reverdy
Keyword(s):  
Electron Beam ◽  
Failure Analysis ◽  
Test Structure ◽  
Precise Localization ◽  
Isolation Method ◽  
Accurate Detection ◽  
Conventional Methods ◽  
Technology Nodes ◽  
Tem Lamella

Abstract As technology nodes continue to shrink, resistive opens have become increasingly difficult to detect using conventional methods such as AVC and PVC. The failure isolation method, Electron Beam Absorbed Current (EBAC) Imaging has recently become the preferred method in failure analysis labs for fast and highly accurate detection of resistive opens and shorts on a number of structures. This paper presents a case study using a two nanoprobe EBAC technique on a 28nm node test structure. This technique pinpointed the fail and allowed direct TEM lamella.

SPECIFIC CHARACTERISTICS OF BONE STRUCTURES ON CT-SCANS OF PATIENTS WITH SINONASAL INVERTED PAPILLOMAS

2019 ◽  
Vol 65 (4) ◽  
pp. 590-595
Author(s):  
Arkadiy Naumenko ◽  
Kseniya Sapova ◽  
Oleg Konoplev ◽  
Svetlana Astashchenko ◽  
Igor Chernushevich
Keyword(s):  
Computed Tomography ◽  
Tumor Recurrence ◽  
Inverted Papilloma ◽  
Ct Scans ◽  
Precise Localization ◽  
Sinonasal Inverted Papilloma ◽  
Bone Structures ◽  
Inverted Papillomas

Precise localization and excision of the originating site of a sinonasal inverted papilloma is essential for decreasing tumor recurrence. In this study we evaluated the use of preoperative computed tomography (CT) to pinpoint the attachment/origi-nating sites of the tumor.

Sign in / Sign up

Export Citation Format

Share Document