scholarly journals The Use of Single-Phase Immersion Cooling by Using Two Types of Dielectric Fluid for Data Center Energy Savings

2022 ◽  
Vol 119 (1) ◽  
pp. 275-286
Author(s):  
Nugroho Agung Pambudi ◽  
Awibi Muhamad Yusuf ◽  
Alfan Sarifudin
Keyword(s):  
Data Center ◽  
Single Phase ◽  
Energy Savings ◽  
Dielectric Fluid ◽  
Immersion Cooling

A Numerical Study of Single Phase Dielectric Fluid Immersion Cooling of Multichip Modules

2012 ◽  
Vol 2012 (1) ◽  
pp. 000581-000590
Author(s):  
Roy W. Knight ◽  
Seth Fincher ◽  
Sushil H. Bhavnani ◽  
Daniel K. Harris ◽  
R. Wayne Johnson
Keyword(s):  
Single Phase ◽  
Printed Circuit Board ◽  
Numerical Study ◽  
Design Guidelines ◽  
Circuit Board ◽  
Dielectric Fluid ◽  
Multichip Modules ◽  
Ansys Fluent ◽  
Immersion Cooling ◽  
Numerical Parametric Study

Immersion, single phase free convection cooling of multichip modules on a printed circuit board in a pool of dielectric fluid was examined numerically, with experimental verification of baseline cases. A multi-chip module with multiple thermal test cells with temperature sensing capability was simulated. The commercially available computational fluid dynamics program from ANSYS, Fluent, was used with the electronics packaging front end, Icepak, employed to create the models and compact conduction modules. Simulations were first performed of an experimental test vehicle which had five 18 mm by 18 mm die, arranged in a cross pattern, equally spaced die, 25 mm between them. Two of the die were aligned vertically with the center die, two aligned horizontally with it. The board was suspended vertically in a large pool of dielectric fluid. Heat was dissipated in the die at a flux of up to 2 W/cm2, based on the die surface area. Simulation results were compared with experimentally measured die temperature values and excellent agreement was seen for the cases of one die heated and all five die uniformly heated with the board cooled by FC-72. A numerical parametric study was performed to examine the effect of die size and spacing on temperature rise. In addition to FC-72, immersion cooling in Novec 649 and HFE 7100 were modeled. Design guidelines are suggested for dielectric fluid immersion cooled multichip modules.

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

2020 ◽  
Author(s):  
Shuai Shao ◽  
Tianyi Gao ◽  
Huawei Yang ◽  
Jie Zhao ◽  
Jiajun Zhang
Keyword(s):  
Power Density ◽  
Thermal Performance ◽  
Data Center ◽  
High Performance ◽  
Single Phase ◽  
Cooling System ◽  
Thermal Power ◽  
Fluid Temperature ◽  
Primary Loop ◽  
Immersion Cooling

Abstract Along with advancements in microelectronics packaging, the power density of processor units has steadily increased over time. Data center servers equipped for high performance computing (HPC) often use multiple central processing units (CPUs) and graphical processing units (GPUs), thereby resulting in an increased power density, exceeding 1 kW per U. Many data center organizations are evaluating single phase immersion technology as a potential energy and resource saving cooling option. In this work immersion cooling was studied at a power level of 2.7kW/U with a 5U-height immersion cooling tank. Heat generated by a simulated GPU server was transferred to the secondary loop coolant, and then exchanged with the primary loop facility coolant through the heat exchanger. The chiller supply and return temperature and flow rate was controlled for the primary loop. The simulated GPU server chassis was designed to provide thermal power equivalent to a high power density server. Eight simulated power heaters, of which each unit was the size of a GPU chipset, was assembled in the comparable location to a real IT equipment on a 4U server chassis. Power for the GPU simulated chassis was able to support up to 2700 W maximum. Three investigations for this immersion cooling system evaluation were performed through comprehensive testing. The first is to identify the key decision making factor(s) for evaluating the thermal performance of 4 hydrocarbon-based dielectric coolants, including power parametric analysis, transient analysis, power cycling test, and fluid temperature profiling. The second is to develop an optimization strategy for the immersion system thermal performance. The third is to verify the capability of an 1U heat sink to support high density processor units over 300 W per GPU in an immersion cooling solution.

Numerical simulation of the single-phase immersion cooling process using a dielectric fluid in a data server

2021 ◽  
Author(s):  
Aditya Chhetri ◽  
Devendra Kashyap ◽  
Arvind Mali ◽  
Chaitanya Agarwal ◽  
Caroline Ponraj ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Single Phase ◽  
Dielectric Fluid ◽  
Cooling Process ◽  
Immersion Cooling

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

2021 ◽  
Author(s):  
Jimil M. Shah ◽  
Keerthivasan Padmanaban ◽  
Hrishabh Singh ◽  
Surya Duraisamy Asokan ◽  
Satyam Saini ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Single Phase ◽  
Printed Circuit Board ◽  
Structural Integrity ◽  
Circuit Board ◽  
Dielectric Fluid ◽  
Air Cooling ◽  
Passive Components ◽  
Material Compatibility ◽  
Immersion Cooling

Abstract The adoption of Single-phase Liquid Immersion Cooling (Sp-LIC) for Information Technology equipment provides an excellent cooling platform coupled with significant energy savings. There are, however, very limited studies related to the reliability of such cooling technology. The Accelerated Thermal Cycling (ATC) test given ATC JEDEC is relevant just for air cooling but there is no such standard for immersion cooling. The ASTM benchmark D3455 with some appropriate adjustments was adopted to test the material compatibility because of the air and dielectric fluid differences in the heat capacitance property and corresponding ramp rate during thermal cycling. For this study, accelerated thermal degradation of the printed circuit board (PCB), passive components, and fiber optic cables submerged in air, white mineral oil, and synthetic fluid at a hoisted temperature of 45C and 35% humidity is undertaken. This paper serves multiple purposes including designing experiments, testing and evaluating material compatibility of PCB, passive components, and optical fibers in different hydrocarbon oils for single-phase immersion cooling. Samples of different materials were immersed in different hydrocarbon oils and air and kept in an environmental chamber at 45C for a total of 288 hours. Samples were then evaluated for their mechanical and electrical properties using Dynamic Mechanical Analyzer (DMA) and a multimeter, respectively. The cross-sections of some samples were also investigated for their structural integrity using SEM. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.

Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

2019 ◽  
Author(s):  
Dhruvkumar Gandhi ◽  
Uschas Chowdhury ◽  
Tushar Chauhan ◽  
Pratik Bansode ◽  
Satyam Saini ◽  
...  
Keyword(s):  
Thermal Performance ◽  
Single Phase ◽  
Data Centers ◽  
Dielectric Fluid ◽  
Air Cooling ◽  
Processing Unit ◽  
Input Output ◽  
Dielectric Fluids ◽  
Immersion Cooling ◽  
Oil Immersion

Abstract Complete immersion of servers in synthetic dielectric fluids is rapidly becoming a popular technique to minimize the energy consumed by data centers for cooling purposes. In general, immersion cooling offers noteworthy advantages over conventional air-cooling methods as synthetic dielectric fluids have high heat dissipation capacities which are roughly about 1200 times greater than air. Other advantages of dielectric fluid immersion cooling include even thermal profile on chips, reduction in noise and addressing reliability and operational enhancements like whisker formation and electrochemical migration. Nevertheless, lack of data published and availability of long-term reliability data on immersion cooling is insufficient which makes most of data centers operators reluctant to implement this technique. The first part of this paper will compare thermal performance of single-phase oil immersion cooled HP ProLiant DL160 G6 server against air cooled server using computational fluid dynamics on 6SigmaET®. Focus of the study are major components of the server like Central Processing Unit (CPU), Dual in Line Memory Module (DIMM), Input/output Hub (IOH) chip and Input/output controller Hub (ICH). The second part of this paper focuses on thermal performance optimization of oil immersion cooled servers by varying inlet oil temperature, flow rate and using different fluid.

Impact of integrated hot water cooling and desiccant-assisted evaporative cooling systems on energy savings in a data center

Energy ◽  
2014 ◽  
Vol 78 ◽  
pp. 384-396 ◽  
Author(s):  
Min-Hwi Kim ◽  
Sang-Woo Ham ◽  
Jun-Seok Park ◽  
Jae-Weon Jeong
Keyword(s):  
Data Center ◽  
Energy Savings ◽  
Evaporative Cooling ◽  
Hot Water ◽  
Water Cooling ◽  
Cooling Systems

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

2019 ◽  
Author(s):  
Jimil M. Shah ◽  
Ravya Dandamudi ◽  
Chinmay Bhatt ◽  
Pranavi Rachamreddy ◽  
Pratik Bansode ◽  
...  
Keyword(s):  
Thermal Management ◽  
Power Density ◽  
Heat Sink ◽  
Single Phase ◽  
Data Centers ◽  
Air Cooling ◽  
Third Generation ◽  
Dielectric Fluids ◽  
Immersion Cooling ◽  
The Impact

Abstract In today’s networking world, utilization of servers and data centers has been increasing significantly. Increasing demand of processing and storage of data causes a corresponding increase in power density of servers. The data center energy efficiency largely depends on thermal management of servers. Currently, air cooling is the most widely used thermal management technology in data centers. However, air cooling has started to reach its limits due to high-powered processors. To overcome these limitations of air cooling in data centers, liquid immersion cooling methods using different dielectric fluids can be a viable option. Thermal shadowing is an effect in which temperature of a cooling medium increases by carrying heat from one source and results in decreasing its heat carrying capacity due to reduction in the temperature difference between the maximum junction temperature of successive heat sink and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling. In this study, the impact of thermal shadowing in a third-generation open compute server using different dielectric fluids is compared. The heat sink is a critical part for cooling effectiveness at server level. This work also provides an efficient range of heat sinks with computational modelling of third generation open compute server. Optimization of heat sink can allow to cool high-power density servers effectively for single-phase immersion cooling applications. A parametric study is conducted, and significant savings in the volume of a heat sink have been reported.

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