scholarly journals SCALABLE LIQUID METAL THIN LINE PATTERNING FOR PASSIVE ELECTRONIC COMPONENTS USING SOFT LITHOGRAPHY

2016 ◽  
Author(s):  
M. Kim ◽  
H. Alrowais ◽  
S. Pavlidis ◽  
O. Brand
Keyword(s):  
Liquid Metal ◽  
Soft Lithography ◽  
Electronic Components ◽  
Thin Line

scholarly journals Universal synthesis of conductive liquid network in polymers enabling elastic printed circuit board technology

2021 ◽  
Author(s):  
Jiheong Kang ◽  
Wonbeom Lee ◽  
Hyunjun Kim ◽  
Inho Kang ◽  
Hongjun Park ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Acoustic Field ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
System Level ◽  
Large Strains ◽  
Stretchable Electronics ◽  
Electronic Components ◽  
Conductive Liquid ◽  
Printed Circuit

Abstract Stretchable electronics are considered next-generation electronic devices in a broad range of emerging fields, including soft robotics1,2, biomedical devices3,4, human-machine interfaces5,6, and virtual or augmented reality devices7,8. A stretchable printed circuit board (S-PCB) is a basic conductive framework for the facile assembly of system-level stretchable electronics with various electronic components. Since an S-PCB is responsible for electrical communications between numerous electronic components, the conductive lines in S-PCB should strictly satisfy the following features: (i) metallic conductivity, (ii) constant electrical resistance during dynamic stretching, and (iii) tough interface bonding with various components9. Despite recent significant advances in intrinsically stretchable conductors10,11,12, they cannot simultaneously satisfy the above stringent requirements. Here, we present a new concept of conductive liquid network-based elastic conductors. These conductors are based on unprecedented liquid metal particles assembled network (LMPNet) and an elastomer. The unique assembled network structure and reconfigurable nature of the LMPNet conductor enabled high conductivity, high stretchability, tough adhesion, and imperceptible resistance changes under large strains, which enabled the first elastic-PCB (E-PCB) technology. We synthesized LMPNet through an acoustic field-driven cavitation event in the solid state. When an acoustic field is applied, liquid metal nanoparticles (LMPnano) are remarkably generated from original LMPs and assemble into a highly conductive particle network (LMPNet). Finally, we demonstrated a multi-layered E-PCB, in which various electronic components were integrated with tough adhesion to form a highly stretchable health monitoring system. Since our synthesis of LMPNet is universal, we could synthesize LMPNet in various polymers, including hydrogel, self-healing elastomer and photoresist and add new functions to LMPNet.

Direct printing and assembly of FM radio at the user end via liquid metal printer

Circuit World ◽  
2014 ◽  
Vol 40 (4) ◽  
pp. 134-140 ◽  
Author(s):  
Jun Yang ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
Large Scale ◽  
Room Temperature ◽  
Mechanical Stability ◽  
Circuit Board ◽  
Electronic Components ◽  
Time Saving ◽  
Content Type ◽  
Fm Radio ◽  
Liquid Metal Ink

Purpose – This paper aims to demonstrate the practicability of the liquid metal printer, developed in the authors’ laboratory, in the direct manufacture and assembly of circuit boards at the end customer side using GaIn24.5 alloy as printing ink at room temperature. Design/methodology/approach – A practical procedure for printing a real designed frequency modulation (FM) radio circuit on flexible and transparent substrate using liquid metal printer was established. Necessary electronic components are then assembled on this circuit board. To enhance the mechanical stability of the FM radio circuit board, we further package the circuit board using room temperature vulcanizing silicone rubber. Finally, an efficient way to recycle the liquid metal ink and electronic components is presented at the end of circuit board’s life cycle. Findings – Methods of designing the circuit patterns that are applicable to liquid metal printer are similar to the conventional printed circuit board (PCB) designing strategies. The procedure of applying liquid metal printer for printing the circuits is entirely automatic, cost-effective and highly time-saving, which allows the user to print out desired device in a moment. Through appropriate packaging, the FM radio circuit board can be flexibly used. These PCBs own many outstanding merits including easy modification and stretchability. Nearly all liquid metal ink and components can be recycled. Originality/value – The present end-customer-oriented liquid metal printing opens the way for large-scale personal electronics manufacture which is expected to initiate many emerging applications in education, design, industry, entertainment and more maker targets.

scholarly journals Size-Scalable and High-Density Liquid-Metal-Based Soft Electronic Passive Components and Circuits Using Soft Lithography

2016 ◽  
Vol 27 (3) ◽  
pp. 1604466 ◽  
Author(s):  
Min-gu Kim ◽  
Hommood Alrowais ◽  
Spyridon Pavlidis ◽  
Oliver Brand
Keyword(s):  
Liquid Metal ◽  
Soft Lithography ◽  
High Density ◽  
Passive Components

Liquid Metal Embrittlement of Copper Wires

2000 ◽  
Author(s):  
L. E. Brown
Keyword(s):  
Liquid Metal ◽  
Failure Mechanism ◽  
Liquid Metal Embrittlement ◽  
Electronic Components

Abstract Intermittent opens in hand-assembled electronic components have a number of expected causes. In this case the failure mechanism that was identified is of concern in certain industries, but is unexpected in the electronics business. Solder in solder pots and in flow solder systems is expected to become contaminated with the various metals and other materials that the solder contacts during use. In the analysis presented here, the solder was determined to be contaminated with mercury. This contaminated solder caused wires tinned in the solder to fracture due to liquid-metal embrittlement. Liquid-metal embrittlement (LME) is the reduction in metal ductility caused by contact with liquid metal.

Linear growth of instabilities on a liquid metal under normal electric field

1993 ◽  
Vol 3 (8) ◽  
pp. 1201-1225 ◽  
Author(s):  
G. N�ron de Surgy ◽  
J.-P. Chabrerie ◽  
O. Denoux ◽  
J.-E. Wesfreid
Keyword(s):  
Liquid Metal ◽  
Electric Field ◽  
Linear Growth ◽  
Normal Electric Field

ENERGY SPREADS IN FIELD EVAPORATION AND LIQUID-METAL ION SOURCES

1984 ◽  
Vol 45 (C9) ◽  
pp. C9-179-C9-182
Author(s):  
G. L.R. Mair ◽  
T. Mulvey ◽  
R. G. Forbes
Keyword(s):  
Liquid Metal ◽  
Metal Ion ◽  
Ion Sources ◽  
Field Evaporation
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