scholarly journals FLIP-CHIP INTEGRATED SOI-CMOS-MEMS FABRICATION TECHNOLOGY

2008 ◽  
Author(s):  
P.J. Gilgunn ◽  
G.K. Fedder
Keyword(s):  
Flip Chip ◽  
Fabrication Technology ◽  
Mems Fabrication ◽  
Cmos Mems ◽  
Soi Cmos

Micromachined magnetic ultrasound transducer in post-processed CMOS

2003 ◽  
Vol 773 ◽  
Author(s):  
Rohit Viswanathan ◽  
Nicholas Jankowski ◽  
Whye-Kei Lye ◽  
Gregory Petit Dufrenoy ◽  
Michael J. Harrison ◽  
...  
Keyword(s):  
Mechanical Vibration ◽  
Current Mode ◽  
Ultrasound Waves ◽  
Mems Fabrication ◽  
Future Challenges ◽  
Cmos Mems ◽  
Critical Components ◽  
Spiral Coils ◽  
Electro Magnetic ◽  
Dc Current

AbstractThis paper presents a novel MEMS Ultrasound Electro-Magnetic transducer. With advances in CMOS MEMS fabrication processes [2] we can explore and build miniature devices which could only be designed till a few years back. As our understanding in MEMS evolved, we explored the use of Electro-Magnetism as an effective way to produce ultrasound waves. Thus we can use a highly efficient and inexpensive fabrication technique to fabricate transducers with a fairly good capability to produce and detect ultrasound waves.The transducer consists of 2 concentric spiral coils, one carrying an AC current (which is tethered to the substrate at one end and free to vibrate at the other, also called the “Flapper”) and other coil carrying DC current (enveloping the inner coil, fixed and called “Stator”). The force arising from the interaction of the coupled magnetic fields induces a mechanical vibration of the flapper structure. The transducer serves as an actuator or a sensor (where we simply apply a pressure force on the flapper and note the frequency response of the flapper).The current mode helps to associate the transducer with front-end electronics, which is one of the most critical components of ultrasound imaging systemsAdvantages of this approach as compared to traditional PZT ceramics and capacitative micromachined devices are explored.Different dimensions of the transducer to accommodate the limitations in the processes are explored and a comparison of the parameters is presented.Potential uses and future challenges are discussed.

scholarly journals Fabrication technology for high light-extraction ultraviolet thin-film flip-chip (UV TFFC) LEDs grown on SiC

2019 ◽  
Vol 34 (3) ◽  
pp. 035007 ◽  
Author(s):  
Burhan K SaifAddin ◽  
Abdullah Almogbel ◽  
Christian J Zollner ◽  
Humberto Foronda ◽  
Ahmed Alyamani ◽  
...  
Keyword(s):  
Thin Film ◽  
Flip Chip ◽  
High Light ◽  
Light Extraction ◽  
Fabrication Technology

Development of a novel thermal switch through CMOS MEMS fabrication process

2011 ◽  
Author(s):  
You-Liang Lai ◽  
Lei-Chun Chou ◽  
Ying-Zong Juang ◽  
Hann-Huei Tsai ◽  
Sheng-Chieh Huang ◽  
...  
Keyword(s):  
Fabrication Process ◽  
Thermal Switch ◽  
Mems Fabrication ◽  
Cmos Mems

scholarly journals Thin Silicon Microdosimeter Utilizing 3-D MEMS Fabrication Technology: Charge Collection Study and Its Application in Mixed Radiation Fields

2018 ◽  
Vol 65 (1) ◽  
pp. 467-472 ◽  
Author(s):  
Linh T. Tran ◽  
Lachlan Chartier ◽  
Dale A. Prokopovich ◽  
David Bolst ◽  
Marco Povoli ◽  
...  
Keyword(s):  
Charge Collection ◽  
Fabrication Technology ◽  
Radiation Fields ◽  
Mems Fabrication ◽  
Thin Silicon

scholarly journals CMOS MEMS Fabrication Technologies and Devices

Micromachines ◽  
2016 ◽  
Vol 7 (1) ◽  
pp. 14 ◽  
Author(s):  
Hongwei Qu
Keyword(s):  
Mems Fabrication ◽  
Cmos Mems

scholarly journals Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application

2016 ◽  
Vol 5 (1) ◽  
pp. 55-61 ◽  
Author(s):  
Marc-Peter Schmidt ◽  
Aleksandr Oseev ◽  
Christian Engel ◽  
Andreas Brose ◽  
Bertram Schmidt ◽  
...  
Keyword(s):  
Impedance Spectroscopy ◽  
Flip Chip ◽  
Three Dimensional ◽  
Impedance Spectrum ◽  
Fabrication Technology ◽  
Free Standing ◽  
Flexible Polymer ◽  
Opposite Electrode ◽  
Electrical Connections ◽  
Molded Interconnect Devices

Abstract. The current contribution reports about the fabrication technology for the development of novel microfluidic impedance spectroscopy sensors that are directly attachable on 3-D molded interconnect devices (3D-MID) that provides an opportunity to create reduced-scale sensor devices for 3-D applications. Advantages of the MID technology in particular for an automotive industry application were recently discussed (Moser and Krause, 2006). An ability to integrate electrical and fluidic parts into the 3D-MID platform brings a sensor device to a new level of the miniaturization. The demonstrated sensor is made of a flexible polymer material featuring a system of electrodes that are structured on and embedded in the SU-8 polymer. The sensor chips can be directly soldered on the MID due to the electroless plated contact pads. A flip chip process based on the opposite electrode design and the implementation of all fluidic and electrical connections at one side of the sensors can be used to assemble the sensor to a three-dimensional substrate. The developed microfluidic sensor demonstrated a predictable impedance spectrum behavior and a sufficient sensitivity to the concentration of ethanol in deionized water. To the best of our knowledge, there is no report regarding such sensor fabrication technology.

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

2021 ◽  
Vol 2021 (HiTEC) ◽  
pp. 000018-000024
Author(s):  
Holger Kappert ◽  
Sebastian Braun ◽  
Norbert Kordas ◽  
Andre Kosfeld ◽  
Alexander Utz ◽  
...  
Keyword(s):  
High Temperature ◽  
Flip Chip ◽  
Mechanical Load ◽  
Industrial Processes ◽  
Sensor Systems ◽  
Integrated Sensor ◽  
Chip Technology ◽  
Operating Temperatures ◽  
Silver Sintering ◽  
Soi Cmos

Abstract Sensors are key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of industrial processes. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, because the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical load do not allow a reliable operation of sensitive electronic components. Fraunhofer is running the Lighthouse Project ‘eHarsh’ to overcome this hurdle. In the course of the project an integrated sensor readout electronic has been realized based on a set of three chips. A dedicated sensor frontend provides the analog sensor interface for resistive sensors typically arranged in a Wheatstone configuration. Furthermore, the chipset includes a 32-bit microcontroller for signal conditioning and sensor control. Finally, it comprises an interface chip including a bus transceiver and voltage regulators. The chipset has been realized in a high temperature 0.35 micron SOI-CMOS technology focusing operating temperatures up to 300 °C. The chipset is assembled on a multilayer ceramic LTCC-board using flip chip technology. The ceramic board consists of 4 layers with a total thickness of approx. 0.9 mm. The internal wiring is based on silver paste while external contacts were alternatively manufactured in silver (sintering/soldering) or in gold-alloys (wire bonding). As interconnection technology, silver sintering has been applied. It has already been shown that a significant increase in lifetime can be reached by using silver sintering for die attach applications. Using silver sintering for flip chip technology is a new and challenging approach. By adjusting the process parameter geared to the chipset design and the design of the ceramic board high quality flip chip interconnects can be generated.

521 Development of convex-shaped quartz-crystal resonator by using MEMS fabrication technology

2005 ◽  
Vol 2005.40 (0) ◽  
pp. 224-225
Author(s):  
Hisanori SHIMAMOTO ◽  
Eiji SAKATA ◽  
Matsuhiko NISHIZAWA ◽  
Takashi ABE
Keyword(s):  
Quartz Crystal ◽  
Fabrication Technology ◽  
Quartz Crystal Resonator ◽  
Crystal Resonator ◽  
Mems Fabrication

Optimization of SOI CMOS MEMS piezo resistive pressure sensor

2017 ◽  
Author(s):  
Rana Muhammad Owais ◽  
Muhammad Shahroz Khan ◽  
Zartash Gul Khawaja ◽  
Mohtashim Mansoor ◽  
Zahid Mehmood
Keyword(s):  
Pressure Sensor ◽  
Cmos Mems ◽  
Soi Cmos
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