The Effect of the Process Temperature on the Bondability in Transient Liquid Phase (tlp) Diffusion Bonding of AISI 430 Ferritic Stainless Steel with Nodular (Spheroid) Cast Iron Using a Copper Interlayer

2006 ◽  
Vol 43 (11) ◽  
pp. 575-585 ◽  
Author(s):  
Sermin Ozan ◽  
Mustafa Taskin ◽  
Sedat Kolukisa
Keyword(s):  
Stainless Steel ◽  
Cast Iron ◽  
Liquid Phase ◽  
Ferritic Stainless Steel ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Process Temperature ◽  
Copper Interlayer ◽  
Aisi 430

Corrosion Behavior of the Transient Liquid Phase Diffusion Bonding Joint of TiNi Shape Memory Alloy and Stainless Steel in Hanks' Solution

2013 ◽  
Vol 750-752 ◽  
pp. 739-742
Author(s):  
Ying Ling Wang ◽  
Qiu Zhi Gao ◽  
Gui Fang Sun ◽  
Jie Ye
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Liquid Phase ◽  
Shape Memory Alloy ◽  
Shape Memory ◽  
Corrosion Behavior ◽  
Pitting Corrosion ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Phase Diffusion

The transient liquid phase diffusion bonding (TLP-DB) was employed to join TiNi shape memory alloy (SMA) and stainless steel (SS) with an interlayer metal of Ag-Cu eutectic metal foil.The corrosion behavior of the TLP-DB joint in Hanks solution at 37°C was investigated by electrochemical methods.The results show that the corrosion resistance of the joint is comparable to, but lower than that of base metals during the early anodic polarization, and the corrosion rate of the joint is between that of TiNi SMA and SS in the transpassive region at high potentials. The corrosion resistance of the specimens in Hanks' solution is associated with the surface quality, mircotructure and the intermetallics. Both TiNi SMA and SS display the characteristics of localized corrosion with a little pitting corrosion, while the joints mainly show the characteristics of pitting corrosion concentrated on the enrichment Cu phases.

scholarly journals Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints

Metals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 613 ◽  
Author(s):  
Abdulaziz AlHazaa ◽  
Nils Haneklaus
Keyword(s):  
Stainless Steel ◽  
Solid State ◽  
Liquid Phase ◽  
Austenitic Stainless Steel ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Dissimilar Material ◽  
Solid State Diffusion ◽  
Tlp Bonding ◽  
State Diffusion

Similar and dissimilar material joints of AISI grade 304 (1.4301) and AISI grade 316 (1.4401) austenitic stainless steel by solid state diffusion bonding and transient liquid phase (TLP) bonding are of interest to academia and industry alike. Appropriate bonding parameters (bonding temperature, bonding time, and bonding pressure) as well as suitable surface treatments, bonding atmosphere (usually high vacuum or protective gas) and interlayers are paramount for successful bonding. The three main parameters (temperature, time, and pressure) are interconnected in a strong non-linear way making experimental data important. This work reviews the three main parameters used for solid state diffusion bonding, TLP bonding and to a smaller degree hot isostatic pressing (HIP) of AISI grade 304 and AISI grade 316 austenitic stainless steel to the aforementioned materials (similar joints) as well as other materials, namely commercially pure titanium, Ti-6A-4V, copper, zircaloy and other non-ferrous metals and ceramic materials (dissimilar joints).

Partial Transient Liquid Phase Diffusion Bonding of Zircaloy-4 to Stabilized Austenitic Stainless Steel 321 Using Titanium Interlayer

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
M. Mazar Atabaki ◽  
J. Idris
Keyword(s):  
Stainless Steel ◽  
Liquid Phase ◽  
Austenitic Stainless Steel ◽  
Energy Dispersive Spectroscopy ◽  
Diffusion Bonding ◽  
Dynamic Pressure ◽  
Transient Liquid Phase ◽  
Energy Dispersive ◽  
Vacuum Furnace ◽  
Phase Diffusion

In this study, an innovative method was applied for bonding Zircaloy-4 to stabilized austenitic stainless steel 321 using an active titanium interlayer. Specimens were joined by partial transient liquid phase diffusion bonding method in a vacuum furnace at different temperatures under 1 MPa dynamic pressure of contact. The influence of different bonding temperatures on the microstructure, microindentation hardness, joint strength, and interlayer thickness has been studied. Additionally, a simple numerical model was developed to predict the evolution of interlayer during partial transient liquid phase diffusion bonding. Diffusion of Fe, Cr, Ni, and Zr has been investigated by scanning electron microscopy examinations and energy dispersive spectroscopy elemental analyses. Results showed that control of heating and cooling rate and 20 min soaking at 1223 K produces a perfect joint. However, solid state diffusion of the melting point depressant elements into the joint metal causes the solid/liquid interface to advance until the joint is solidified. The tensile strength values of all bonded specimens were found around 480–670 MPa. Energy dispersive spectroscopy studies indicated that the melting occurred along the interface of bonded specimens as a result of transfer of atoms between the interlayer and the matrix during bonding. The evolution of interlayer film thickness indicates a good agreement between the calculation and experimental measurement. This technique provides a reliable method of bonding zirconium alloy to stainless steel.

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