Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2laser and hot-air methods

2013 ◽  
Vol 104 (7) ◽  
pp. 637-642 ◽  
Author(s):  
Yee-Wen Yen ◽  
Hsien-Ming Hsiao ◽  
Shao-Cheng Lo ◽  
Shu-Mei Fu
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Cu Substrate ◽  
Hot Air ◽  
Lead Free Solders

Interfacial reactions between Sn–8Zn–3Bi–xAg lead-free solders and Cu substrate

2009 ◽  
Vol 482 (1-2) ◽  
pp. 90-98 ◽  
Author(s):  
Lijuan Liu ◽  
Wei Zhou ◽  
Baoling Li ◽  
Ping Wu
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Cu Substrate ◽  
Lead Free Solders

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

Interfacial reactions of Sn–58Bi and Sn–0.7Cu lead-free solders with Alloy 42 substrate

2014 ◽  
Vol 54 (1) ◽  
pp. 233-238 ◽  
Author(s):  
Yee-Wen Yen ◽  
Ruo-Syun Syu ◽  
Chih-Ming Chen ◽  
Chien-Chung Jao ◽  
Guan-Da Chen
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Lead Free Solders

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Joint ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Free Solder ◽  
Substrate Surfaces ◽  
Lead Free Solders

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C

2004 ◽  
Vol 19 (12) ◽  
pp. 3560-3568 ◽  
Author(s):  
Chia-Wei Huang ◽  
Kwang-Lung Lin
Keyword(s):  
Intermetallic Compounds ◽  
Aging Time ◽  
Weight Percent ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Lead Free ◽  
Cu Substrate ◽  
Electroless Ni

The interfacial reactions of Sn–Zn based solder on Cu and Cu/Ni–P/Cu–plating substrates under aging at 150 °C were investigated in this study. The compositions of solders investigated were Sn–9Zn, Sn–8.55Zn–0.45Al, and Sn–8.55Zn–0.45Al–0.5Ag solders in weight percent. The experimental results indicated that the Cu substrate formed Cu5Zn8 with the Sn–9Zn solder and Al–Cu–Zn compound with Al–containing solders. However, it was detected that Cu6Sn5 formed at the Sn–9Zn/Cu interface and Cu5Zn8 formed at the Al–containing solders/Cu interface after aging for 1000 h. When it contacted with the Cu/Ni–P/Au substrate, the Sn–9Zn solder formed Au–Zn compound, and the Al–containing solders formed Al–Cu–Zn compound at the interface. After a long aging time, the intermetallic compounds existing between solders and the Cu/Ni–P/Au metallization layers almost did not grow. It was found that the interdiffusion between solders and Cu/Ni–P/Au was slower than that with Cu under aging. Furthermore, the addition of Ag to Sn–Zn solder resulted in the formation of AgZn3 particles at the interface.

Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys

JOM ◽  
2019 ◽  
Vol 71 (9) ◽  
pp. 3031-3040
Author(s):  
Yee-Wen Yen ◽  
Hsien-Ming Hsiao ◽  
Kuo-Jung Chen ◽  
Yi-Show Lin ◽  
Mei-Ting Lai
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Lead Free Solders ◽  
Co Alloys

Interfacial Reactions Between Lead-Free Solders and Common Base Materials

ChemInform ◽  
2006 ◽  
Vol 37 (30) ◽  
Author(s):  
T. Laurila ◽  
V. Vuorinen ◽  
J. K. Kivilahti
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Base Materials ◽  
Common Base ◽  
Lead Free Solders
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