Thermodynamics of ordered intermetallic compounds containing point defects

2003 ◽  
Vol 94 (9) ◽  
pp. 954-961 ◽  
Author(s):  
J. Breuer ◽  
F. Sommer ◽  
E. J. Mittemeijer
Keyword(s):  
Intermetallic Compounds ◽  
Point Defects ◽  
Ordered Intermetallic

Precise Quantitative Evaluation of Nano-Ordered Intermetallic Compounds in Sn-3.0Ag-0.5Cu Lead-Free Solder Bump by Using TEM

2008 ◽  
Vol 47-50 ◽  
pp. 907-911
Author(s):  
Chang Woo Lee ◽  
Y.S. Shin ◽  
J.H. Kim
Keyword(s):  
Intermetallic Compounds ◽  
Flip Chip ◽  
Solder Bump ◽  
Lead Free Solder ◽  
Growth Behaviour ◽  
Sic Particles ◽  
Imcs Growth ◽  
Ordered Intermetallic ◽  
Free Solder ◽  
The One

The growth behaviour of the intermetallic compounds (IMCs) in Pb-free solder bump is investigated. The Pb-free micro-bump, Sn-50%Bi, was fabricated by binary electroplating for flip-chip bond. The diameter of the bump is about 506m and the height is about 60 6m. In order to increase the reliability of the bonding, it is necessary to protect the growth of the IMCs in interface between Cu pad and the solder bump. For control of IMCs growth, SiC particles were distributed in the micro-solder bump during electroplating. The thickness of the IMCs in the interface was estimated by FE-SEM, EDS, XRF and TEM. From the results, The IMCs were found as Cu6Sn5 and Cu3Sn. The thickness of the IMCs decreases with increase the amount of SiC particles until 4 g/cm2. The one candidate of the reasons is that the SiC particles could decrease the area which be reacted between the solder and Cu layer. And another candidate is that the particle can make to difficult inter-diffusion within the interface.

Antiphase Boundary Tubes in Ordered Intermetallic Compounds

1992 ◽  
Vol 288 ◽  
Author(s):  
Alfonso H.W. Ngan ◽  
I.P. Jones ◽  
R.E. SMALLMAN
Keyword(s):  
Intermetallic Compounds ◽  
Antiphase Boundary ◽  
Ordered Intermetallic

Effect of accelerating voltage on planar and axial channeling in ordered intermetallic compounds

1992 ◽  
Vol 7 (8) ◽  
pp. 2119-2125 ◽  
Author(s):  
P.R. Munroe ◽  
I. Baker
Keyword(s):  
Intermetallic Compounds ◽  
Site Occupancy ◽  
Boron Doped ◽  
Ordered Intermetallic ◽  
Axial Channeling ◽  
Delocalization Effects

The ternary site occupancy of two alloys, vanadium in NiAl + V and hafnium in nickel-rich, boron doped Ni3Al + Hf, was determined by ALCHEMI, or atom location by channeling enhanced microanalysis. Vanadium exhibited a preference for the aluminum sublattice in NiAl, and hafnium preferentially occupied the aluminum sites in Ni3Al. Spectra were acquired over a range of accelerating voltages from 80 kV to 200 kV. Delocalization effects were observed to increase as the accelerating voltage increased, which thus reduces the accuracy of the ALCHEMI data. For NiAl + V, both planar and axial channeling were performed, and delocalization effects were greater for axial channeling, further reducing the accuracy of the ALCHEMI data.

Hardening by Point Defects and Solutes in B2 Intermetallics

2002 ◽  
Vol 753 ◽  
Author(s):  
L. M. Pike ◽  
Y. A. Chang ◽  
C. T. Liu ◽  
I. M. Anderson
Keyword(s):  
Solid Solution ◽  
Point Defect ◽  
Point Defects ◽  
Solid Solution Hardening ◽  
Quenching Temperature ◽  
Solid Solution Softening ◽  
Ordered Intermetallic ◽  
Multiple Defect ◽  
Binary Compounds ◽  
Hardness Values

ABSTRACTThis paper provides a review of recent progress on point defect and solute hardening in binary and ternary B2 intermetallics. As is the case for disordered metallic solutions, the presence of point defects and solute atoms in ordered intermetallic compounds results in solid solution hardening (SSH). However, factors unique to ordered systems are often responsible for unusual hardening effects. Binary compounds with identical crystal structures can exhibit significantly different hardness behavior. Ternary solute additions to ordered compounds can give rise to apparent solid solution softening as well as unexpectedly rapid hardening. These effects arise from the interaction of multiple defect types as well as the presence of multiple sublattice sites available for solute occupation. Therefore, before the SSH behavior of ordered intermetallics can be properly studied, it is necessary to develop an understanding of the types and quantities of the point defects which are present. Three recent studies by the authors are reviewed. Much of the work was done on NiAl and FeAl in binary form as well as with ternary additions. Defect concentrations over wide ranges in alloy composition and quenching temperature were determined using the ALCHEMI (atom location by channeling enhanced microanalysis) technique combined with vacancy measurements. Hardness values were also measured. It was found that most of the observed SSH effects could be rationalized on the basis of the measured point defect concentrations.

Interdiffusion Behavior of Electroplated Platinum-Iridium Alloys on Nickel-Base Single Crystal Superalloy TMS-82+

2006 ◽  
Vol 522-523 ◽  
pp. 293-300
Author(s):  
Ying Na Wu ◽  
Aya S. Suzuki ◽  
Hideyuki Murakami ◽  
Seiji Kuroda
Keyword(s):  
Chemical Composition ◽  
Single Crystal ◽  
Intermetallic Compounds ◽  
Single Crystal Superalloy ◽  
Outward Diffusion ◽  
X Ray ◽  
Diffusion Treatment ◽  
Ordered Intermetallic ◽  
Nickel Base ◽  
Depth Concentration

In the present study, platinum-iridium alloys (Ir = 15.8, 27.3, 36.1, 100at.%) were electroplated on a nickel-base single crystal superalloy TMS-82+ followed by a diffusion treatment at 1373K for 1 h. Interdiffusion behavior between the Pt-Ir films and substrates was investigated in terms of chemical composition, phase constitution and morphology. X-ray analysis revealed that annealed specimens consisted of several fcc solid solutioned phases with various lattice parameters, together with ordered intermetallic compounds (L12-(Pt,Ni)3Al and B2-(Ir,Ni)Al), due to the inward diffusion of Pt and Ir from the electrodeposited films to the superalloy substrates, and the outward diffusion of solute elements (Ni, Al, Cr, Co) in the superalloy substrates into the films during annealing. The depth concentration analysis indicated that the Pt-36.1Ir film effectively retarded the outward diffusion of solute elements, especially nickel, from the substrate.

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