Antiphase Boundary Tubes in Ordered Intermetallic Compounds

1992 ◽  
Vol 288 ◽  
Author(s):  
Alfonso H.W. Ngan ◽  
I.P. Jones ◽  
R.E. SMALLMAN
Keyword(s):  
Intermetallic Compounds ◽  
Antiphase Boundary ◽  
Ordered Intermetallic

Precise Quantitative Evaluation of Nano-Ordered Intermetallic Compounds in Sn-3.0Ag-0.5Cu Lead-Free Solder Bump by Using TEM

2008 ◽  
Vol 47-50 ◽  
pp. 907-911
Author(s):  
Chang Woo Lee ◽  
Y.S. Shin ◽  
J.H. Kim
Keyword(s):  
Intermetallic Compounds ◽  
Flip Chip ◽  
Solder Bump ◽  
Lead Free Solder ◽  
Growth Behaviour ◽  
Sic Particles ◽  
Imcs Growth ◽  
Ordered Intermetallic ◽  
Free Solder ◽  
The One

The growth behaviour of the intermetallic compounds (IMCs) in Pb-free solder bump is investigated. The Pb-free micro-bump, Sn-50%Bi, was fabricated by binary electroplating for flip-chip bond. The diameter of the bump is about 506m and the height is about 60 6m. In order to increase the reliability of the bonding, it is necessary to protect the growth of the IMCs in interface between Cu pad and the solder bump. For control of IMCs growth, SiC particles were distributed in the micro-solder bump during electroplating. The thickness of the IMCs in the interface was estimated by FE-SEM, EDS, XRF and TEM. From the results, The IMCs were found as Cu6Sn5 and Cu3Sn. The thickness of the IMCs decreases with increase the amount of SiC particles until 4 g/cm2. The one candidate of the reasons is that the SiC particles could decrease the area which be reacted between the solder and Cu layer. And another candidate is that the particle can make to difficult inter-diffusion within the interface.

Effect of accelerating voltage on planar and axial channeling in ordered intermetallic compounds

1992 ◽  
Vol 7 (8) ◽  
pp. 2119-2125 ◽  
Author(s):  
P.R. Munroe ◽  
I. Baker
Keyword(s):  
Intermetallic Compounds ◽  
Site Occupancy ◽  
Boron Doped ◽  
Ordered Intermetallic ◽  
Axial Channeling ◽  
Delocalization Effects

The ternary site occupancy of two alloys, vanadium in NiAl + V and hafnium in nickel-rich, boron doped Ni3Al + Hf, was determined by ALCHEMI, or atom location by channeling enhanced microanalysis. Vanadium exhibited a preference for the aluminum sublattice in NiAl, and hafnium preferentially occupied the aluminum sites in Ni3Al. Spectra were acquired over a range of accelerating voltages from 80 kV to 200 kV. Delocalization effects were observed to increase as the accelerating voltage increased, which thus reduces the accuracy of the ALCHEMI data. For NiAl + V, both planar and axial channeling were performed, and delocalization effects were greater for axial channeling, further reducing the accuracy of the ALCHEMI data.

Phase-Field Simulation of Antiphase Boundary Migration in Intermetallic Compounds with Solute and Vacancy Segregation

2011 ◽  
Vol 1295 ◽  
Author(s):  
Yuichiro Koizumi ◽  
Tatsuya Yokoi ◽  
Masayuki Ouchi ◽  
Yoritoshi Minamino ◽  
Masato Yoshiya ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Phase Field ◽  
Boundary Migration ◽  
Antiphase Boundary ◽  
Phase Field Simulation ◽  
Field Simulation ◽  
Vacancy Distribution

ABSTRACTThe effects of solute and vacancy segregation on APB migration in Ti3Al, and their dependence on composition, have been investigated by using a phase-field simulation in which vacancy distribution is taken into account. Al-atoms are depleted and vacancies segregate at APB in stoichiometric Ti3Al (Ti-25Al), whereas Al-atoms segregate and vacancies are depleted in Alrich one (Ti-28Al). The simulation indicates that APB in Ti3Al migrates much faster in Ti-25Al than in Ti-28Al with the effect of vacancy segregation whereas it migrates slightly faster in Ti-28Al than in Ti-25Al in the absence of the effect of vacancy segregation.

Interdiffusion Behavior of Electroplated Platinum-Iridium Alloys on Nickel-Base Single Crystal Superalloy TMS-82+

2006 ◽  
Vol 522-523 ◽  
pp. 293-300
Author(s):  
Ying Na Wu ◽  
Aya S. Suzuki ◽  
Hideyuki Murakami ◽  
Seiji Kuroda
Keyword(s):  
Chemical Composition ◽  
Single Crystal ◽  
Intermetallic Compounds ◽  
Single Crystal Superalloy ◽  
Outward Diffusion ◽  
X Ray ◽  
Diffusion Treatment ◽  
Ordered Intermetallic ◽  
Nickel Base ◽  
Depth Concentration

In the present study, platinum-iridium alloys (Ir = 15.8, 27.3, 36.1, 100at.%) were electroplated on a nickel-base single crystal superalloy TMS-82+ followed by a diffusion treatment at 1373K for 1 h. Interdiffusion behavior between the Pt-Ir films and substrates was investigated in terms of chemical composition, phase constitution and morphology. X-ray analysis revealed that annealed specimens consisted of several fcc solid solutioned phases with various lattice parameters, together with ordered intermetallic compounds (L12-(Pt,Ni)3Al and B2-(Ir,Ni)Al), due to the inward diffusion of Pt and Ir from the electrodeposited films to the superalloy substrates, and the outward diffusion of solute elements (Ni, Al, Cr, Co) in the superalloy substrates into the films during annealing. The depth concentration analysis indicated that the Pt-36.1Ir film effectively retarded the outward diffusion of solute elements, especially nickel, from the substrate.

Sign in / Sign up

Export Citation Format

Share Document