scholarly journals Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

10.30544/344 ◽  
2018 ◽  
Vol 24 (1) ◽  
pp. 27-36 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Mechanical Properties ◽  
Hardness Test ◽  
Tensile Tests ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Microstructural Investigation ◽  
Pure Lead ◽  
Free Solder

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

2018 ◽  
Vol 18 (1) ◽  
pp. 49-57 ◽  
Author(s):  
P. Manoj Kumar ◽  
G. Gergely ◽  
D. K. Horváth ◽  
Z. Gácsi
Keyword(s):  
Mechanical Properties ◽  
Hardness Test ◽  
Tensile Tests ◽  
Optical Microscope ◽  
Solder Alloys ◽  
Extensive Discussion ◽  
Microstructural Investigation ◽  
Pure Lead ◽  
Cu Content ◽  
Sac Solder

Abstract The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

2017 ◽  
Vol 266 ◽  
pp. 196-200 ◽  
Author(s):  
Suchart Chantaramanee ◽  
Phairote Sungkhaphaitoon ◽  
Thawatchai Plookphol
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Vickers Microhardness ◽  
Lead Free ◽  
Mechanical And Thermal Properties ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Sac305 Solder ◽  
Percent Elongation ◽  
Free Solder

In this research, we investigated the influence of indium and antimony additions on the microstructure, mechanical and thermal properties of Sn-3.0Ag-0.5Cu lead free solder alloys. The results revealed that the addition of 0.5 wt.%InSb into SAC305 solder alloys resulted to a reduced melting temperature by 3.8 °C and IMCs phases formed new Ag3(Sn,In) and SnSb in the Sn-rich matrix with a decreased grain size of 28%. These phases improved the mechanical properties of solder alloys. In addition, the mechanical properties of SAC305 solder alloys increased by adding 0.5 wt.%InSb, resulting in an increase of ultimate tensile strength of 24%, but the percent elongation decreased to 45.8%. Furthermore, the Vickers microhardness slightly increased of the SAC305 solder alloys.

Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys

2013 ◽  
Vol 572 ◽  
pp. 97-106 ◽  
Author(s):  
Wislei R. Osório ◽  
Leandro C. Peixoto ◽  
Leonardo R. Garcia ◽  
Nathalie Mangelinck-Noël ◽  
Amauri Garcia
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Microstructure And Mechanical Properties ◽  
Free Solder

scholarly journals Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens

Metals ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 1348
Author(s):  
Tatsuya Kobayashi ◽  
Ikuo Shohji
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Fatigue Properties ◽  
Strength Increase ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Power Module ◽  
Power Semiconductors ◽  
Ni Content ◽  
Free Solder

Sn-Sb-Ni solder alloy is expected to be used as a die-attach material for a next-generation power semiconductors in power module. The aim of this paper is to investigate the effects of the Ni content on microstructures, tensile, and fatigue properties of Sn-10Sb-xNi (x = 0.05, 0.10, 0.25, 0.50) (mass%) lead-free solder alloys using miniature size specimens. The Sn-10Sb-Ni solder alloys have the microstructure in which Sb-Sn and Ni-Sb compounds are dispersed in the β-Sn matrix. As the Sb and Ni content increases, Sb-Sn and Ni-Sb compounds are coarsened, respectively. The effect of the Ni content on tensile properties of the alloy is slight at 25 °C. At 150 °C and 200 °C, 0.1% proof stress and tensile strength increase gradually with the Ni content increases, and saturate at the Ni amount over 0.25 mass%. According to the fatigue test at 200 °C, the fatigue properties of Sn-10Sb-Ni with 0.10–0.25 mass% Ni are better than that of the Sn-10Sb. From the experimental results, Sn-10Sb-Ni with 0.10–0.25 mass% Ni have superior mechanical properties.

Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

2013 ◽  
Vol 562 ◽  
pp. 194-204 ◽  
Author(s):  
Wislei R. Osório ◽  
Daniel R. Leiva ◽  
Leandro C. Peixoto ◽  
Leonardo R. Garcia ◽  
Amauri Garcia
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Dendritic Array ◽  
Free Solder

scholarly journals Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys

2020 ◽  
Vol 38 (1) ◽  
pp. 34-40
Author(s):  
B. Yavuzer ◽  
D. Özyürek ◽  
T. Tunçay
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Eutectic Alloy ◽  
Investment Casting ◽  
The Other ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Casting Method ◽  
Free Solder

AbstractThis study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu added alloys and the Al2O3 phase has formed due to addition of Al. It was found that small and round-shaped Al2O3 phase increased the tensile strength of the new alloy compared to the eutectic alloy. In addition, it was observed that the microhardness of Cu added alloys was lower than that of Sn-9Zn eutectic alloy, but the microhardness of alloys containing Al was higher compared to the other eutectic Sn-9Zn alloy.

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

2017 ◽  
Vol 29 (2) ◽  
pp. 110-117 ◽  
Author(s):  
Izhan Abdullah ◽  
Muhammad Nubli Zulkifli ◽  
Azman Jalar ◽  
Roslina Ismail
Keyword(s):  
Mechanical Properties ◽  
Room Temperature ◽  
Deformation Behaviour ◽  
Tensile Tests ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Content Type ◽  
Free Solder

Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature. Design/methodology/approach Tensile tests with different strain rates of 1.5 × 10−6, 1.5 × 10−5, 1.5 × 10−4, 1.5 × 10−3, 1.5 × 10−2 and 1.5 × 10−1 s−1 at room temperature of 25°C were carried out on lead-free Sn-3.0Ag-0.5Cu (SAC305) solder wire. Stress-strain curves and mechanical properties such as yield strength, ultimate tensile strength and elongation were determined from the tensile tests. A microstructure analysis was performed by measuring the average grain size and the aspect ratio of the grains. Findings It was observed that higher strain rates showed pronounced dynamic recrystallization on the stress-strain curve. The increase in the strain rates also decreased the grain size of the SAC305 solder wire. It was found that higher strain rates had a pronounced effect on changing the deformation or shape of the grain in a longitudinal direction. An increase in the strain rates increased the tensile strength and ductility of the SAC solder wire. The primary deformation mechanism for strain rates below 1.5 × 10−1 s−1 was grain boundary sliding, whereas the deformation mechanism for strain rates of 1.5 × 10−1 s−1 was diffusional creep. Originality/value Most of the studies regarding the deformation behaviour of lead-free solder usually consider the effect of the elevated temperature. For the current analysis, the effect of the temperature is kept constant at room temperature to analyze the deformation of lead-free solder wire solely because of changes of strain rates, and this is the originality of this paper.

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

2014 ◽  
Vol 582 ◽  
pp. 229-235 ◽  
Author(s):  
Chih-Yao Liu ◽  
Min-Hsiung Hon ◽  
Moo-Chin Wang ◽  
Ying-Ru Chen ◽  
Kuo-Ming Chang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Aging Time ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder ◽  
Effects Of Aging
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