Joint Resistance to Ram

2005 ◽  
Author(s):  
Gregory Czarnecki ◽  
Ronald Hinrichsen ◽  
Michele Maxson
Keyword(s):  
Joint Resistance

Joint Resistance Characteristics in Ultrasonic Weld REBCO CC Tapes at Various Temperatures and Magnetic Fields

2018 ◽  
Vol 28 (4) ◽  
pp. 1-5 ◽  
Author(s):  
Hyung-Seop Shin ◽  
Mark Angelo Diaz ◽  
Zhierwinjay Mezona Bautista ◽  
Satoshi Awaji
Keyword(s):  
Magnetic Fields ◽  
Joint Resistance

Electromigration Performance of Fine-Pitch Copper Pillar Interconnections

2012 ◽  
Vol 2012 (1) ◽  
pp. 001018-001025
Author(s):  
Ahmer Syed ◽  
Christopher J. Berry ◽  
Karthikeyan Dhandapani ◽  
Patrick Thompson ◽  
Seung-Hyun Chae
Keyword(s):  
Stress Testing ◽  
No Reduction ◽  
Operating Temperature ◽  
Conduction Path ◽  
Package Design ◽  
Fine Pitch ◽  
Joint Resistance ◽  
Two Factors ◽  
Free Solder ◽  
Critical Consideration

The miniaturization trend in electronic packaging continues to drive smaller and smaller chip-to-substrate interconnections with no reduction in IC operating temperature or device power in sight. These two factors (current density and temperature) make the electromigration lifetime of chip-to-package interconnections a critical consideration in package design. Of particular interest these days are the “fine pitch copper pillar” structures due to their very small size (30um dia or less). This paper presents interconnection lifetime and metallurgical data on the same which demonstrates the extreme robustness of these joints due largely to their reaching a fully reacted state in which no free solder exists in the conduction path thus providing electromigration performance like that of the base copper and intermetallic compounds. Joint resistance trends observed during stress testing are also discussed.

Development of a Superconducting Joint Resistance Evaluation System

2020 ◽  
Vol 30 (4) ◽  
pp. 1-4
Author(s):  
Kensuke Kobayashi ◽  
Gen Nishijima ◽  
Akira Uchida ◽  
Munenori Amaya ◽  
Nobuya Banno ◽  
...  
Keyword(s):  
Evaluation System ◽  
Resistance Evaluation ◽  
Joint Resistance

scholarly journals Study of Factors in Joint Resistance for GdBCO Coated Conductors

2013 ◽  
Vol 45 ◽  
pp. 165-168 ◽  
Author(s):  
T. Watanabe ◽  
T. Kamata ◽  
T. Maebatake ◽  
R. Teranishi ◽  
T. Kiss ◽  
...  
Keyword(s):  
Coated Conductors ◽  
Joint Resistance
Sign in / Sign up

Export Citation Format

Share Document