Mechanical Reliability Evaluation and its Standardization of Thin Films Used in MEMS

2004 ◽  
Author(s):  
Toshiyuki Tsuchiya
Keyword(s):  
Thin Films ◽  
Reliability Evaluation ◽  
Mechanical Reliability

MECHANICAL BEHAVIOR OF FREESTANDING Mo THIN FILMS FOR RF–MEMS DEVICES

2006 ◽  
Vol 20 (25n27) ◽  
pp. 3757-3762 ◽  
Author(s):  
JAE-HYUN KIM ◽  
HAK-JOO LEE ◽  
SEUNG-WOO HAN ◽  
JUNG-YUP KIM ◽  
JUNG-SIL KIM ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Behavior ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Bending Test ◽  
Mems Devices ◽  
Mechanical Reliability ◽  
Sputtering Deposition ◽  
Stress Strain Relation ◽  
Wireless Telecommunication

Radio frequency microelectromechanical systems (RF–MEMS) are an attractive solution for wireless telecommunication applications. Freestanding films play an important role in RF–MEMS devices. For the successful commercialization of RF–MEMS devices, however, it is necessary to evaluate the mechanical reliability of freestanding films. The first step in the evaluation is to characterize the mechanical behavior of the films. This study focuses on freestanding Mo thin films. Mo test structures with a thickness of 960 nm were fabricated using sputtering deposition and patterned using a surface and bulk micromachining process. The strip-bending test was used to measure the stress–strain relation of the freestanding Mo thin films. The measured elastic modulus, initial stress, and yield strength of Mo thin films are reported.

Thermo-Mechanical Reliability Evaluation of PLCC Packaging

2013 ◽  
Vol 816-817 ◽  
pp. 795-799
Author(s):  
Xiang Hui Guo ◽  
Chun Guang Xu ◽  
Liu Yang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Geometric Model ◽  
Reliability Evaluation ◽  
Test Method ◽  
Acoustic Microscopy ◽  
Microelectronic Packaging ◽  
Mechanical Reliability ◽  
Element Analysis ◽  
Chip Carrier

Thermo-mechanical failure is the main factor to impact the microelectronic packaging reliability. Under thermal loads, the microelectronic packaging is easy to produce cracks, delamination, voids, and other defects, which can emerge and grow under thermo-mechanical stresse caused by the different coefficients of thermal expansion (CTE). Firstly, a geometric model of Plastic Leaded Chip Carrier (PLCC) packaging was established and the thermo-mechanical property of PLCC packaging was analyzed using finite element analysis (FEA) software ANSYS. Then, the thermal cycling test on a set of PLCC packaging was conducted according to the MIL-STD-883H Microcircuits Test Method Standard with temperature range from-65°C to 150°C, and the crack growth rate of PLCC packaging was studied experimentally using Scanning Acoustic Microscopy (SAM). Finally, the Anand model was adopted to predict thermal fatigue life, which was consistent with the experimental results. With these researches, the thermo-mechanical reliability evaluation of the PLCC packaging was investigated using finite element analysis (FEA) combined with analytical methods.

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