scholarly journals Mechanical-reliability evaluation of a proposed emergency-response radioiodine air sampler

1982 ◽  
Author(s):  
J Krupa ◽  
S Bird ◽  
B Motes
Keyword(s):  
Emergency Response ◽  
Reliability Evaluation ◽  
Mechanical Reliability ◽  
Air Sampler

Thermo-Mechanical Reliability Evaluation of PLCC Packaging

2013 ◽  
Vol 816-817 ◽  
pp. 795-799
Author(s):  
Xiang Hui Guo ◽  
Chun Guang Xu ◽  
Liu Yang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Geometric Model ◽  
Reliability Evaluation ◽  
Test Method ◽  
Acoustic Microscopy ◽  
Microelectronic Packaging ◽  
Mechanical Reliability ◽  
Element Analysis ◽  
Chip Carrier

Thermo-mechanical failure is the main factor to impact the microelectronic packaging reliability. Under thermal loads, the microelectronic packaging is easy to produce cracks, delamination, voids, and other defects, which can emerge and grow under thermo-mechanical stresse caused by the different coefficients of thermal expansion (CTE). Firstly, a geometric model of Plastic Leaded Chip Carrier (PLCC) packaging was established and the thermo-mechanical property of PLCC packaging was analyzed using finite element analysis (FEA) software ANSYS. Then, the thermal cycling test on a set of PLCC packaging was conducted according to the MIL-STD-883H Microcircuits Test Method Standard with temperature range from-65°C to 150°C, and the crack growth rate of PLCC packaging was studied experimentally using Scanning Acoustic Microscopy (SAM). Finally, the Anand model was adopted to predict thermal fatigue life, which was consistent with the experimental results. With these researches, the thermo-mechanical reliability evaluation of the PLCC packaging was investigated using finite element analysis (FEA) combined with analytical methods.

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