A three-dimensional modified strongly implicit procedure for heat conduction

AIAA Journal ◽  
1983 ◽  
Vol 21 (2) ◽  
pp. 295-303 ◽  
Author(s):  
M. Zedan ◽  
G. E. Schneider
Keyword(s):  
Heat Conduction ◽  
Three Dimensional ◽  
Strongly Implicit Procedure

scholarly journals Heating source localization in a reduced time

2016 ◽  
Vol 26 (3) ◽  
pp. 623-640 ◽  
Author(s):  
Sara Beddiaf ◽  
Laurent Autrique ◽  
Laetitia Perez ◽  
Jean-Claude Jolly
Keyword(s):  
Heat Conduction ◽  
Source Localization ◽  
Conjugate Gradient ◽  
Regularization Method ◽  
Three Dimensional ◽  
Gradient Algorithm ◽  
Iterative Regularization ◽  
Heating Source ◽  
Ill Posed ◽  
Reduced Time

Abstract Inverse three-dimensional heat conduction problems devoted to heating source localization are ill posed. Identification can be performed using an iterative regularization method based on the conjugate gradient algorithm. Such a method is usually implemented off-line, taking into account observations (temperature measurements, for example). However, in a practical context, if the source has to be located as fast as possible (e.g., for diagnosis), the observation horizon has to be reduced. To this end, several configurations are detailed and effects of noisy observations are investigated.

Simultaneous Determination of Steady Temperatures and Heat Fluxes on Surfaces of Three Dimensional Objects Using FEM

2001 ◽  
Author(s):  
Brian H. Dennis ◽  
George S. Dulikravich
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Heat Conduction ◽  
Three Dimensional ◽  
Heat Fluxes ◽  
Multiply Connected ◽  
Three Dimensional Objects ◽  
Solid Objects ◽  
System Solution

Abstract A finite element method (FEM) formulation is presented for the prediction of unknown steady boundary conditions in heat conduction on multiply connected three-dimensional solid objects. The present FEM formulation is capable of determining temperatures and heat fluxes on the boundaries where such quantities are unknown or inaccessible, provided such quantities are sufficiently over-specified on other boundaries. Details of the discretization, linear system solution techniques, regularization, and sample results for 3-D problems are presented.

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

2015 ◽  
Author(s):  
Koji Nishi ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Boundary Conditions ◽  
Thermal Resistance ◽  
Hot Spot ◽  
Three Dimensional ◽  
Thermal Design ◽  
Target Temperature ◽  
One Dimensional ◽  
Thermal Network

The thermal network method has a long history with thermal design of electronic equipment. In particular, a one-dimensional thermal network is useful to know the temperature and heat transfer rate along each heat transfer path. It also saves computation time and/or computation resources to obtain target temperature. However, unlike three-dimensional thermal simulation with fine pitch grids and a three-dimensional thermal network with sufficient numbers of nodes, a traditional one-dimensional thermal network cannot predict the temperature of a microprocessor silicon die hot spot with sufficient accuracy in a three-dimensional domain analysis. Therefore, this paper introduces a one-dimensional thermal network with average temperature nodes. Thermal resistance values need to be obtained to calculate target temperature in a thermal network. For this purpose, thermal resistance calculation methodology with simplified boundary conditions, which calculates thermal resistance values from an analytical solution, is also introduced in this paper. The effectiveness of the methodology is explored with a simple model of the microprocessor system. The calculated result by the methodology is compared to a three-dimensional heat conduction simulation result. It is found that the introduced technique matches the three-dimensional heat conduction simulation result well.

Effect of Three-Dimensional Electric Field and Heat Conduction to Electrodes on the Temperature Rise During Irreversible Electroporation

2011 ◽  
Author(s):  
Seiji Nomura ◽  
Kosaku Kurata ◽  
Hiroshi Takamatsu
Keyword(s):  
Heat Conduction ◽  
Electric Field ◽  
Temperature Rise ◽  
Heat Conduction Equation ◽  
Thermal Damage ◽  
Irreversible Electroporation ◽  
Three Dimensional ◽  
End Effects ◽  
Abnormal Cells ◽  
Novel Method

The irreversible electroporation (IRE) is a novel method to ablate abnormal cells by applying a high voltage between two electrodes that are stuck into abnormal tissues. One of the advantages of the IRE is that the extracellular matrix (ECM) may be kept intact, which is favorable for healing. For a successful IRE, it is therefore important to avoid thermal damage of ECM resulted from the Joule heating within the tissue. A three-dimensional (3-D) analysis was conducted in this study to predict temperature rise during the IRE. The equation of electric field and the heat conduction equation were solved numerically by a finite element method. It was clarified that the highest temperature rise occurred at the base of electrodes adjacent to the insulated surface. The result was significantly different from a two-dimensional (2-D) analysis due to end effects, suggesting that the 3-D analysis is required to determine the optimal condition.

Sign in / Sign up

Export Citation Format

Share Document