High-Capacity Loop Heat Pipe with Flat Evaporator for Efficient Cooling Systems

2020 ◽  
Vol 34 (3) ◽  
pp. 465-475
Author(s):  
Yury Maydanik ◽  
Mariya Chernysheva ◽  
Sergey Vershinin
Keyword(s):  
Heat Pipe ◽  
High Capacity ◽  
Loop Heat Pipe ◽  
Cooling Systems ◽  
Flat Evaporator

Effect of Sintering Temperature Curve in Wick Manufactured for Loop Heat Pipe with Flat Evaporator

2014 ◽  
Vol 595 ◽  
pp. 24-29 ◽  
Author(s):  
Shen Chun Wu ◽  
Kuei Chi Lo ◽  
Jia Ruei Chen ◽  
Chen Yu Chung ◽  
Weie Jhih Lin ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Sintering Temperature ◽  
Temperature Curve ◽  
Loop Heat Pipe ◽  
Transfer Performance ◽  
Total Thermal Resistance ◽  
Flat Evaporator ◽  
Increasing Temperature

This paper specifically addresses the effect of the sintering temperature curve in manufacturing nickel powder capillary structure (wick) for a loop heat pipe (LHP) with flat evaporator. The sintering temperature curve is composed of three regions: a region of increasing temperature, a region of constant temperature, and a region of decreasing temperature. The most important region is the increasing temperature region, as the rate of temperature increase directly affects the performance of the wick.When the slope of the region of increasing temperature is 0.8 (equivalent to 8 OC/min), the structure of the manufactured wick is complete, with the best heat transfer performance result. Experimental resultsshowed that the optimal heat transfer performance is 160W, the minimal total thermal resistance is approximately 0.43OC/W, and the heat flux is 17W/cm2; the optimal wick manufactured has an effective pore radius of 5.2 μm, a permeability of 5.9×10-13m2, and a porosity of 64%.

scholarly journals A Novel Analytical Modeling of a Loop Heat Pipe Employing Thin-Film Theory: Part II—Experimental Validation

Energies ◽  
2019 ◽  
Vol 12 (12) ◽  
pp. 2403 ◽  
Author(s):  
Eui Guk Jung ◽  
Joon Hong Boo
Keyword(s):  
Steady State ◽  
Heat Pipe ◽  
Film Theory ◽  
Design Parameters ◽  
Working Fluid ◽  
Coolant Temperature ◽  
Loop Heat Pipe ◽  
Analysis Model ◽  
Proposed Model ◽  
Flat Evaporator

Part I of this study introduced a mathematical model capable of predicting the steady-state performance of a loop heat pipe (LHP) with enhanced rationality and accuracy. Additionally, investigation of the effect of design parameters on the LHP thermal performance was also reported in Part I. The objective of Part II is to experimentally verify the utility of the steady-state analytical model proposed in Part I. To this end, an experimental device comprising a flat-evaporator LHP (FLHP) was designed and fabricated. Methanol was used as the working fluid, and stainless steel as the wall and tubing-system material. The capillary structure in the evaporator was made of polypropylene wick of porosity 47%. To provide vapor removal passages, axial grooves with inverted trapezoidal cross-section were machined at the inner wall of the flat evaporator. Both the evaporator and condenser components measure 40 × 50 mm (W × L). The inner diameters of the tubes constituting the liquid- and vapor-transport lines measure 2 mm and 4 mm, respectively, and the lengths of these lines are 0.5 m. The maximum input thermal load was 90 W in the horizontal alignment with a coolant temperature of 10 °C. Validity of the said steady-state analysis model was verified for both the flat and cylindrical evaporator LHP (CLHP) models in the light of experimental results. The observed difference in temperature values between the proposed model and experiment was less than 4% based on the absolute temperature. Correspondingly, a maximum error of 6% was observed with regard to thermal resistance. The proposed model is considered capable of providing more accurate performance prediction of an LHP.

scholarly journals Miniature Loop Heat Pipe With Flat Evaporator for Cooling Computer CPU

2007 ◽  
Vol 30 (1) ◽  
pp. 42-49 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Chris Dixon ◽  
Mastaka Mochizuki ◽  
Roger R. Riehl
Keyword(s):  
Heat Pipe ◽  
Loop Heat Pipe ◽  
Flat Evaporator

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

2005 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Thermal Control ◽  
Capillary Forces ◽  
High Heat ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Wick Structure ◽  
Flat Evaporator ◽  
Heat Loads

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.

Sign in / Sign up

Export Citation Format

Share Document