This paper presents the current-carrying-capacity (CCC) characterization of a land-grid-array type microprocessor socket. This CCC study has been performed using both computational modeling and experiments using infrared camera. A subsequent risk assessment was performed against the maximum allowed temperature at the point of pressure contact of socket pin for the use-condition socket pin current and motherboard temperature. The results from the modeling and the experimental results are compared.
Computational Modeling and Experiments of Natural Convection for a Titan Montgolfiere