scholarly journals Preparation Conditions of rf-Sputter Deposited Fe/AlN Multilayered Thin Films and Their Properties.

1998 ◽  
Vol 45 (3) ◽  
pp. 253-256
Author(s):  
Shinichi Kikkawa ◽  
Shinsuke Enomoto ◽  
Masao Takahashi ◽  
Ken Hirota ◽  
Osamu Yamaguchi
Keyword(s):  
Thin Films ◽  
Preparation Conditions ◽  
Sputter Deposited ◽  
Multilayered Thin Films

scholarly journals Nanoindentation Study of Amorphous Metal Multilayered Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
J. B. Vella ◽  
R. C. Cammarata ◽  
T. P. Weihs ◽  
C. L. Chien ◽  
A. B. Mann ◽  
...  
Keyword(s):  
Thin Films ◽  
Plastic Deformation ◽  
Amorphous Metal ◽  
Repeat Length ◽  
Total Thickness ◽  
Sapphire Substrates ◽  
Multilayered Systems ◽  
Magnetron Sputter ◽  
Sputter Deposited ◽  
Multilayered Thin Films

AbstractNanoindentation studies were preformed on amorphous metal, multilayered thin films containing alternating layers of Fe50Ti50 and Cu35Nb65 in order to investigate the mechanism for plastic deformation in metallic glass. Films with a total thickness of 1μm and bilayer repeat lengths ranging from 2 to 50 nm were magnetron sputter-deposited onto sapphire substrates. In contrast to many crystalline multilayered systems, where large hardness enhancements have been observed when the bilayer repeat length is reduced below about 10 nm, no significant hardness enhancement as a function of bilayer repeat length was observed in the Fe50Ti50/ Cu35Nb65 amorphous metal system. This result suggests that a dislocation–like mechanism for plastic deformation may not be appropriate for these amorphous metals.

Processing and microstructural characterization of sputter-deposited Ni/Ni3Al multilayered thin films

2003 ◽  
Vol 18 (4) ◽  
pp. 979-987 ◽  
Author(s):  
Evan A. Sperling ◽  
Rajarshi Banerjee ◽  
Gregory B. Thompson ◽  
Jason P. Fain ◽  
Peter M. Anderson ◽  
...  
Keyword(s):  
Thin Films ◽  
Crystallographic Texture ◽  
Volume Fraction ◽  
Microstructural Characterization ◽  
Processing Parameters ◽  
Face Centered Cubic ◽  
Orientation Relationships ◽  
Bilayer Period ◽  
Sputter Deposited ◽  
Multilayered Thin Films

The crystallographic texture, orientation relationships, coherency stress, and thermal stability of sputter-deposited Ni/Ni3Al multilayered thin films were studied as a function of bilayer period (Λ) as well as processing parameters such as substrate type, deposition temperature, and prebake conditions. Deposition onto oxidized Si or single-crystal Cu(001), NaCl(001), or KBr(001) substrates near room temperature produces multilayers with a [111] crystallographic texture along the Ni/Ni3Al interface normal and a disordered face-centered cubic structure for the Ni3Al phase. In contrast, deposition at 673 K onto NaCl(001) or KBr(001) substrates that are prebaked in vacuum at 693 K produces a chemically ordered L12 structure for the Ni3Al phase and (001) epitaxial growth. X-ray diffraction measurements of (001) multilayers with equal volume fraction of Ni and Ni3Al reveals a transition from a nearly incoherent state at Λ=40 nm to a semicoherent one at Λ 40 nm. Remarkably, (001) multilayers were observed to solutionize at 1373 K, which is approximately 100 K below that predicted by the Ni–Al phase diagram.

Characterization of reactive phase formation in sputter-deposited Ni/Al multilayer thin films using TEM

1996 ◽  
Vol 54 ◽  
pp. 1000-1001
Author(s):  
G. Lucadamo ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Phase Formation ◽  
Dark Field ◽  
Nickel Layer ◽  
Multilayer Thin Films ◽  
Cross Sectional ◽  
Dark Field Imaging ◽  
Transmission Electron ◽  
Sputter Deposited ◽  
Constant Heating

The subject of reactive phase formation in multilayer thin films of varying periodicity has stimulated much research over the past few years. Recent studies have sought to understand the reactions that occur during the annealing of Ni/Al multilayers. Dark field imaging from transmission electron microscopy (TEM) studies in conjunction with in situ x-ray diffraction measurements, and calorimetry experiments (isothermal and constant heating rate), have yielded new insights into the sequence of phases that occur during annealing and the evolution of their microstructure.In this paper we report on reactive phase formation in sputter-deposited lNi:3Al multilayer thin films with a periodicity A (the combined thickness of an aluminum and nickel layer) from 2.5 to 320 nm. A cross-sectional TEM micrograph of an as-deposited film with a periodicity of 10 nm is shown in figure 1. This image shows diffraction contrast from the Ni grains and occasionally from the Al grains in their respective layers.

TEM studies of solid-state reactions in sputter-deposited Nb/Al multilayer thin films

1996 ◽  
Vol 54 ◽  
pp. 1020-1021
Author(s):  
F. Ma ◽  
S. Vivekanand ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Stoichiometric Composition ◽  
Analytical Electron Microscopy ◽  
Grain Structure ◽  
Solid State Reactions ◽  
Multilayer Thin Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sputter Deposited

Solid state reactions in sputter-deposited Nb/Al multilayer thin films have been studied by transmission and analytical electron microscopy (TEM/AEM), differential scanning calorimetry (DSC) and X-ray diffraction (XRD). The Nb/Al multilayer thin films for TEM studies were sputter-deposited on (1102)sapphire substrates. The periodicity of the films is in the range 10-500 nm. The overall composition of the films are 1/3, 2/1, and 3/1 Nb/Al, corresponding to the stoichiometric composition of the three intermetallic phases in this system.Figure 1 is a TEM micrograph of an as-deposited film with periodicity A = dA1 + dNb = 72 nm, where d's are layer thicknesses. The polycrystalline nature of the Al and Nb layers with their columnar grain structure is evident in the figure. Both Nb and Al layers exhibit crystallographic texture, with the electron diffraction pattern for this film showing stronger diffraction spots in the direction normal to the multilayer. The X-ray diffraction patterns of all films are dominated by the Al(l 11) and Nb(l 10) peaks and show a merging of these two peaks with decreasing periodicity.

Transformation and Deformation Behavior in Sputter-Deposited Ti-Ni-Cu Thin Films

1995 ◽  
Vol 05 (C8) ◽  
pp. C8-689-C8-694 ◽  
Author(s):  
T. Hashinaga ◽  
S. Miyazaki ◽  
T. Ueki ◽  
H. Horikawa
Keyword(s):  
Thin Films ◽  
Deformation Behavior ◽  
Sputter Deposited

Chromium multilayered thin films with orientated microstructure

2005 ◽  
Vol 123 ◽  
pp. 137-142 ◽  
Author(s):  
J. Takadoum ◽  
J. Lintymer ◽  
J. Gavoille ◽  
N. Martin
Keyword(s):  
Thin Films ◽  
Multilayered Thin Films

The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

2003 ◽  
Vol 766 ◽  
Author(s):  
A. Sekiguchi ◽  
J. Koike ◽  
K. Ueoka ◽  
J. Ye ◽  
H. Okamura ◽  
...  
Keyword(s):  
Thin Films ◽  
Adhesion Strength ◽  
Nitrogen Concentration ◽  
Scratch Test ◽  
Barrier Structure ◽  
Barrier Layers ◽  
Cu Metallization ◽  
Microstructure Observation ◽  
Sputter Deposited ◽  
Sulfur Containing

AbstractAdhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

scholarly journals Sputter Deposited Metal Layers Embedded in Composites—From Fundamentals to Applications

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 190
Author(s):  
Florian Cougnon ◽  
Mathias Kersemans ◽  
Wim Van Paepegem ◽  
Diederik Depla
Keyword(s):  
Thin Films ◽  
Heat Flux ◽  
Sputter Deposition ◽  
Image Correlation ◽  
Fiber Reinforced Polymers ◽  
Thermal Probe ◽  
Reinforced Polymers ◽  
Magnetron Sputter Deposition ◽  
Sputter Deposited ◽  
Metal Layers

Due to the low heat flux towards the substrate, magnetron sputter deposition offers the possibility to deposit thin films on heat sensitive materials such as fiber-reinforced polymers, also known as composite materials. Passive thermal probe measurements during the sputter deposition of metal layers show indeed that the temperature increase remains well below 25 °C for film thicknesses up to 600 nm. The latter thickness threshold is based on the influence of embedded metal films on the adhesion of the composite plies. Films thicker than this threshold deteriorate the mechanical integrity of the composite. The introduction of the uncured composite in the vacuum chamber strongly affects the base pressure by outgassing of impurities from the composite. The impurities affect the film properties as illustrated by their impact on the Seebeck coefficient of sputter deposited thermocouples. The restrictions to embed thin films in composites, as illustrated by both the heat flux measurements, and the study on the influence of impurities, are however not insurmountable. The possibility to use embedded thin films will be briefly demonstrated in different applications such as digital volume image correlation, thermocouples, and de-icing.

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