scholarly journals High temperature diffusion bonding for sintered alumina. 2nd report. Evaluation of bonding strength and microstructure.

1985 ◽  
Vol 32 (3) ◽  
pp. 90-94
Author(s):  
Tadaaki Sugita ◽  
Kimio Abraya ◽  
Kanji Ueda
Keyword(s):  
High Temperature ◽  
Diffusion Bonding ◽  
Bonding Strength ◽  
Temperature Diffusion

NDE Inspections and Simulation of Defects in Composite-Sintered Bushes

2013 ◽  
Vol 650 ◽  
pp. 582-587
Author(s):  
Kwang Hee Im ◽  
Ki Youl Kim ◽  
Ki Taek Shin ◽  
Han Hee Lee ◽  
To Kang ◽  
...  
Keyword(s):  
Wear Resistance ◽  
High Temperature ◽  
Carrying Capacity ◽  
Diffusion Bonding ◽  
Manufacturing Process ◽  
High Load ◽  
Load Carrying Capacity ◽  
Heavy Duty ◽  
Temperature Diffusion ◽  
Load Carrying

Bush is one of machine and automobile parts like brake used in drums and hubs in particular. Such bush parts are used for bearings of heavy-duty, large cars requiring wear resistance and high load carrying capacity. High temperature diffusion bonding has been applied for holding the both materials of the bushing together, which are outer steel materials and inner composite-sintered bushings. Therefore, it is very important evaluate the bonding integrity in manufacturing process. A simulation has been performed in order to evaluate the maximum defect sizes. Also, ultrasonic C-scan tests were performed for finding the defect in the composite-sintered bushings with the size of inherent flaws.

The Strength of Vacuum-Free Diffusion Bonding Joints of Ni-Bi Alloys and ZrO2 Ceramic

2010 ◽  
Vol 160-162 ◽  
pp. 231-234
Author(s):  
Hou Hong Pan ◽  
Ke Jun Wang ◽  
Isao Itoh
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Nickel Alloy ◽  
Diffusion Bonding ◽  
Bonding Strength ◽  
Room Temperature ◽  
Shear Fracture ◽  
Pure Nickel ◽  
Fracture Test ◽  
Free Diffusion

Ni-Bi alloys were selected to bond to ZrO2 ceramic by diffusion bonding at atmosphere for researching their bondability. The Ni-Bi alloys were Ni-xmass%Bi (x=0, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0) and ZrO2 ceramic was Z201N. The bonding was carried out at 973 K, 1037 K and 1173 K for 3.6 ks, 5.4 ks, 7.2 ks, 9.0 ks and10.8 ks under the pressure of 2 MPa, 4 MPa, 6 MPa, 8 MPa, 10 MPa and 12 MPa. The bonding strength was examined by the shear fracture test from room temperature to high temperature. The results indicate that pure nickel could be bonded to ZrO2. Adding bismuth into nickel alloy could obviously improved shear strength at room temperature. The optimum content of bismuth was 2%. The shear strength of vacuum-free diffusion bonding joint was higher than that of vacuum diffusion bonding joint. ZrO2/Ni-2Bi joint was bonded at 1173 K for 7.2 ks under 8 MPa, which shear strength was up to 22 MPa until the test temperature of 873 K.

Low Temperature Diffusion Bonding of Ti-6Al-4V to Oxygen Free Copper with High Bonding Strength Using Pure Ag Interlayer

2015 ◽  
Vol 44 (11) ◽  
pp. 2607-2611 ◽  
Author(s):  
Shen Qiang ◽  
Xiang Huiying ◽  
Li Meijuan ◽  
Luo Guoqiang ◽  
Wang Yiyu ◽  
...  
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Bonding Strength ◽  
High Bonding Strength ◽  
Temperature Diffusion

scholarly journals Insight into the Mechanical Performance of the UHPC Repaired Cementitious Composite System after Exposure to High Temperatures

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4095
Author(s):  
Qing Chen ◽  
Zhiyuan Zhu ◽  
Rui Ma ◽  
Zhengwu Jiang ◽  
Yao Zhang ◽  
...  
Keyword(s):  
Compressive Strength ◽  
High Temperature ◽  
High Temperatures ◽  
Bonding Strength ◽  
Composite System ◽  
Mechanical Performance ◽  
High Performance Concrete ◽  
Interfacial Structure ◽  
Cementitious Composite ◽  
Average Percentage

In this paper, the mechanical performance of an ultra-high-performance concrete (UHPC) repaired cementitious composite system, including the old matrix and the new reinforcement (UHPC), under various high temperature levels (20 °C, 100 °C, 300 °C, and 500 °C) was studied. In this system, UHPC reinforced with different contents of steel fibers and polypropylene (PP) fibers was utilized. Moreover, the physical, compressive, bonding, and flexural behaviors of the UHPC repaired system after being exposed to different high temperatures were investigated. Meanwhile, X-ray diffraction (XRD), baseline evaluation test (BET), and scanning electron microscope (SEM) tests were conducted to analyze the effect of high temperature on the microstructural changes in a UHPC repaired cementitious composite system. Results indicate that the appearance of the bonded system changed, and its mass decreased slightly. The average percentage of residual mass of the system was 99.5%, 96%, and 94–95% at 100 °C, 300 °C, and 500 °C, respectively. The residual compressive strength, bonding strength, and flexural performance improved first and then deteriorated with the increase of temperature. When the temperature reached 500 °C, the compressive strength, bonding strength, and flexural strength decreased by about 20%, 30%, and 15% for the UHPC bonded system, respectively. Under high temperature, the original components of UHPC decreased and the pore structure deteriorated. The cumulative pore volume at 500 °C could reach more than three times that at room temperature (about 20 °C). The bonding showed obvious deterioration, and the interfacial structure became looser after exposure to high temperature.

Experimental Research on Bond Strength between Rebar and Concrete after High Temperature

2011 ◽  
Vol 71-78 ◽  
pp. 1057-1061 ◽  
Author(s):  
Ke Fang Yin ◽  
Yang Han ◽  
Yi Liu
Keyword(s):  
Reinforced Concrete ◽  
High Temperature ◽  
Bond Strength ◽  
Experimental Research ◽  
Bonding Strength ◽  
Different Temperatures ◽  
Ultimate Bond Strength

With the centrally pulling-out test, the bond strength of reinforced concrete is measured with different temperatures and different cooling ways after high temperature; and the ultimate bond strength and slip of reinforced and concrete under different conditions are analyzed. The results show that the bonding strength declines gradually with the increase of temperature, and the ultimate slippage also decreases gradually.

Study on Bonding Properties of Copper and Aluminum in Nano Scale Using Molecular Dynamics Simulation

2012 ◽  
Vol 152-154 ◽  
pp. 183-187 ◽  
Author(s):  
Quang Cherng Hsu ◽  
Yen Yu Cheng ◽  
Bao Hsin Liu
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Bonding Strength ◽  
High Speed ◽  
Tensile Force ◽  
Pure Aluminum ◽  
Pure Copper ◽  
Dynamics Simulation ◽  
Low Speed ◽  
Speed Condition

According to MD simulation results, pressing depth between two bonding materials will affect bonding strength. Alloy material (Al0.9Cu0.1) had void defect phenomenon in low bonding speed condition because the increasing chance of atom migration which will result in low bonding strength. High tensile speed causes material fracture phenomena happen earlier than low speed. Material stress in low speed is smaller than in high speed. Fracture morphology of material is different in different tensile speed. In low speed condition, material can be stretched thinner than in high speed condition. Material in high temperature has greater kinetic energy than low temperature; therefore, material in high temperature has better formability and behaves larger tensile strain than low temperature. For pure aluminum, when temperature raises to 900K which is close to melting point (933K), its crystal structure is no longer belongs to F.C.C. structure, so bonding strength is weaker than low temperature. Large size material has larger contact area than small size material; therefore, the tensile force and tensile strength of the former are larger than the latter. The order of bonding strength for these three materials is: binary alloy > pure copper > pure aluminum.

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