scholarly journals Low-power ASIC suitable for miniaturized wireless EMG systems

2019 ◽  
Vol 70 (5) ◽  
pp. 393-399 ◽  
Author(s):  
Vilem Kledrowetz ◽  
Roman Prokop ◽  
Lukas Fujcik ◽  
Michal Pavlik ◽  
Jiří Háze
Keyword(s):  
Low Power ◽  
Integrated Circuit ◽  
High Performance ◽  
Low Voltage ◽  
Cmos Technology ◽  
Instrumentation Amplifier ◽  
Pass Filter ◽  
Delta Sigma ◽  
Pulse Density ◽  
Wide Range

Abstract Nowadays, the technology advancements of signal processing, low-voltage low-power circuits and miniaturized circuits have enabled the design of compact, battery-powered, high performance solutions for a wide range of, particularly, biomedical applications. Novel sensors for human biomedical signals are creating new opportunities for low weight wearable devices which allow continuous monitoring together with freedom of movement of the users. This paper presents the design and implementation of a novel miniaturized low-power sensor in integrated circuit (IC) form suitable for wireless electromyogram (EMG) systems. Signal inputs (electrodes) are connected to this application-specific integrated circuit (ASIC). The ASIC consists of several consecutive parts. Signals from electrodes are fed to an instrumentation amplifier (INA) with fixed gain of 50 and filtered by two filters (a low-pass and high-pass filter), which remove useless signals and noise with frequencies below 20 Hz and above 500 Hz. Then signal is amplified by a variable gain amplifier. The INA together with the reconfigurable amplifier provide overall gain of 50, 200, 500 or 1250. The amplified signal is then converted to pulse density modulated (PDM) signal using a 12-bit delta-sigma modulator. The ASIC is fabricated in TSMC0.18 mixed-signal CMOS technology.

A LOW POWER CRYOGENIC CMOS ROIC DESIGN FOR 512 × 512 IRFPA

2013 ◽  
Vol 22 (10) ◽  
pp. 1340033 ◽  
Author(s):  
HONGLIANG ZHAO ◽  
YIQIANG ZHAO ◽  
YIWEI SONG ◽  
JUN LIAO ◽  
JUNFENG GENG
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Integrated Circuit ◽  
High Performance ◽  
Supply Voltage ◽  
Cmos Technology ◽  
High Gain ◽  
Readout Integrated Circuit ◽  
Chip Area ◽  
Operating Modes

A low power readout integrated circuit (ROIC) for 512 × 512 cooled infrared focal plane array (IRFPA) is presented. A capacitive trans-impedance amplifier (CTIA) with high gain cascode amplifier and inherent correlated double sampling (CDS) configuration is employed to achieve a high performance readout interface for the IRFPA with a pixel size of 30 × 30 μm2. By optimizing column readout timing and using two operating modes in column amplifiers, the power consumption is significantly reduced. The readout chip is implemented in a standard 0.35 μm 2P4M CMOS technology. The measurement results show the proposed ROIC achieves a readout rate of 10 MHz with 70 mW power consumption under 3.3 V supply voltage from 77 K to 150 K operating temperature. And it occupies a chip area of 18.4 × 17.5 mm2.

Low Power High Performance Full Adder Design Using Gate Diffusion Input Techniques

2020 ◽  
Vol 17 (4) ◽  
pp. 1595-1599
Author(s):  
N. Suresh ◽  
K. Subba Rao ◽  
R. Vassoudevan
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Integrated Circuit ◽  
High Performance ◽  
Large Scale ◽  
Digital Signal ◽  
Full Adder ◽  
Cmos Technology ◽  
Digital Circuit ◽  
Essential Components

Very Large Scale Integrated (VLSI) technology for a widespread use of high performance portable integrated circuit (IC) devices such as MP3, PDA, mobile phones is increasing rapidly. Most of the VLSI applications, such as digital signal processing, image processing and microprocessors, extensively use arithmetic operations. In this research novel low power full adder architecture has been proposed for various applications which uses the advanced adder and multiplier designs. A full-adder is one of the essential components in digital circuit design; many improvements have been made to reduce the architecture of a full adder. In this research modified full adder using GDI technique is proposed to achieve low power consumption. By using GDI cell, the transistor count is greatly reduced, thereby reducing the power consumption and propagation delay while maintaining the low complexity of the logic design. The parameters in terms of Power, Delay, and Surface area are investigated by comparison of the proposed GDI technology with an optimized 90 nm CMOS technology.

An Ultra-Low-Voltage Low-Power Current-Mode True RMS-to-DC Converter

2016 ◽  
Vol 25 (06) ◽  
pp. 1650066 ◽  
Author(s):  
Pantre Kompitaya ◽  
Khanittha Kaewdang
Keyword(s):  
Integrated Circuits ◽  
Low Power ◽  
High Performance ◽  
Dynamic Range ◽  
Low Voltage ◽  
Supply Voltage ◽  
Circuit Complexity ◽  
Current Mode ◽  
Cmos Technology ◽  
Low Supply Voltage

A current-mode CMOS true RMS-to-DC (RMS: root-mean-square) converter with very low voltage and low power is proposed in this paper. The design techniques are based on the implicit computation and translinear principle by using CMOS transistors that operate in the weak inversion region. The circuit can operate for two-quadrant input current with wide input dynamic range (0.4–500[Formula: see text]nA) with an error of less than 1%. Furthermore, its features are very low supply voltage (0.8[Formula: see text]V), very low power consumption ([Formula: see text]0.2[Formula: see text]nW) and low circuit complexity that is suitable for integrated circuits (ICs). The proposed circuit is designed using standard 0.18[Formula: see text][Formula: see text]m CMOS technology and the HSPICE simulation results show the high performance of the circuit and confirm the validity of the proposed design technique.

A Reliable, Low Power and Nonvolatile MTJ-Based Flip-Flop for Advanced Nanoelectronics

2018 ◽  
Vol 27 (13) ◽  
pp. 1850205 ◽  
Author(s):  
Ramin Rajaei
Keyword(s):  
Low Power ◽  
Integrated Circuit ◽  
High Performance ◽  
Radiation Effects ◽  
Large Scale ◽  
Vlsi Design ◽  
Magnetic Tunnel Junction ◽  
Cmos Technology ◽  
Flip Flop ◽  
Reliability Challenge

Very large-scale integrated circuit (VLSI) design faces many challenges with today’s nanometer CMOS technology, including leakage current and reliability issues. Magnetic tunnel junction (MTJ) hybrid with CMOS transistors can offer many advantages for future VLSI design such as high performance, low power consumption, easy integration with CMOS and also nonvolatility. However, MTJ-based logic circuits suffer from a reliability challenge that is the read disturbance issue. This paper proposes a new nonvolatile magnetic flip-flop (MFF) that offers a disturbance-free sensing and a low power write operation over the previous MFFs. This magnetic-based logic circuit is based on the previous two-in-one (TIO) MTJ cell that presents the aforementioned attributes. Radiation-induced single event upset, as another reliability challenge, is also taken into consideration for the MFFs and another MFF robust against radiation effects is suggested and evaluated.

Design and Layout of a High-Performance PWM Control Class D Amplifiers IC Systems

2012 ◽  
Vol 203 ◽  
pp. 469-473
Author(s):  
Ruei Chang Chen ◽  
Shih Fong Lee
Keyword(s):  
Low Power ◽  
High Performance ◽  
Low Voltage ◽  
Design Flow ◽  
Total Power ◽  
Cmos Process ◽  
Low Power Circuits ◽  
Class D ◽  
Total Power Consumption ◽  
Power Circuits

This paper presents the design and implementation of a novel pulse width modulation control class D amplifiers chip. With high-performance, low-voltage, low-power and small area, these circuits are employed in portable electronic systems, such as the low-power circuits, wireless communication and high-frequency circuit systems. This class D chip followed the chip implementation center advanced design flow, and then was fabricated using Taiwan Semiconductor Manufacture Company 0.35-μm 2P4M mixed-signal CMOS process. The chip supply voltage is 3.3 V which can operate at a maximum frequency of 100 MHz. The total power consumption is 2.8307 mW, and the chip area size is 1.1497×1.1497 mm2. Finally, the class D chip was tested and the experimental results are discussed. From the excellent performance of the chip verified that it can be applied to audio amplifiers, low-power circuits, etc.

scholarly journals A Low-Power Opamp-Less Second-Order Delta-Sigma Modulator for Bioelectrical Signals in 0.18 µm CMOS

Sensors ◽  
2021 ◽  
Vol 21 (19) ◽  
pp. 6456
Author(s):  
Fernando Cardes ◽  
Nikhita Baladari ◽  
Jihyun Lee ◽  
Andreas Hierlemann
Keyword(s):  
Low Power ◽  
Low Frequency ◽  
Cmos Technology ◽  
Low Noise ◽  
Second Order ◽  
Frequency Noise ◽  
Voltage Controlled Oscillator ◽  
Noise Shaping ◽  
Delta Sigma Modulator ◽  
Delta Sigma

This article reports on a compact and low-power CMOS readout circuit for bioelectrical signals based on a second-order delta-sigma modulator. The converter uses a voltage-controlled, oscillator-based quantizer, achieving second-order noise shaping with a single opamp-less integrator and minimal analog circuitry. A prototype has been implemented using 0.18 μm CMOS technology and includes two different variants of the same modulator topology. The main modulator has been optimized for low-noise, neural-action-potential detection in the 300 Hz–6 kHz band, with an input-referred noise of 5.0 μVrms, and occupies an area of 0.0045 mm2. An alternative configuration features a larger input stage to reduce low-frequency noise, achieving 8.7 μVrms in the 1 Hz–10 kHz band, and occupies an area of 0.006 mm2. The modulator is powered at 1.8 V with an estimated power consumption of 3.5 μW.

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