Reliability Engineering. Study on "Fibro-Composites". Morphology of PBT/PE Blend.

1998 ◽  
Vol 47 (12) ◽  
pp. 1270-1275 ◽  
Author(s):  
Kazuo KITAGAWA ◽  
Takeshi SEMBA ◽  
Hiroyuki HAMADA
Keyword(s):  
Reliability Engineering ◽  
Engineering Study

scholarly journals Reliability Engineering. Study of Grading Mechanism by the Markov Type Grinding Model. Application of Grinding Matrix.

1998 ◽  
Vol 47 (12) ◽  
pp. 1264-1269
Author(s):  
Toshimasa OZAKI ◽  
Hiroshi KANAI ◽  
Shigeo MIWA ◽  
Kei HARA ◽  
Eiichi ONUMA
Keyword(s):  
Reliability Engineering ◽  
Model Application ◽  
Markov Type ◽  
Engineering Study

Signature Analysis: Statistical Models and Their Application to FA

1996 ◽  
Author(s):  
C.K. Lakshminarayan ◽  
S. Pabbisetty ◽  
O. Adams ◽  
F. Pires ◽  
M. Thomas ◽  
...  
Keyword(s):  
Risk Assessment ◽  
Failure Analysis ◽  
Statistical Models ◽  
Essential Elements ◽  
Assessment Model ◽  
Signature Analysis ◽  
Risk Assessment Model ◽  
Sample Sizes ◽  
Reliability Engineering ◽  
Semiconductor Chips

Abstract This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations among failures that fail due to the same failure mechanism. The idea of correlation is important because semiconductor chips are processed in batches. Also any risk assessment model should comprehend correlations over time. The statistical models developed will provide the required sample sizes for the Failure Analysis lab to state "We are A% confident that B% of future parts will fail due to the same signature." The paper provides tables and graphs for the evaluation of such a risk assessment. The implementation of Signature Analysis will achieve the dual objective of improved customer satisfaction and reduced cycle time. This paper will also highlight it's applicability as well as the essential elements that need to be in place for it to be effective. Different examples have been illustrated of how the concept is being used by Failure Analysis Operations (FA) and Customer Quality and Reliability Engineering groups.

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