scholarly journals Stability of Passivation Film on Stainless Steel in a Nickel Electroless Plating Bath.

1994 ◽  
Vol 43 (494) ◽  
pp. 1416-1421
Author(s):  
Yoshihiro SUGIE ◽  
Masafumi KOBUNE ◽  
Satoshi FUJII ◽  
Tadahiro YAMAMOTO
Keyword(s):  
Stainless Steel ◽  
Electroless Plating ◽  
Plating Bath ◽  
Passivation Film

scholarly journals 2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

2015 ◽  
Vol 2015 ◽  
pp. 1-11
Author(s):  
Ahmet Ozan Gezerman ◽  
Burcu Didem Çorbacıoğlu
Keyword(s):  
Waste Water ◽  
Electroless Plating ◽  
Thioglycolic Acid ◽  
Electroless Nickel ◽  
Optical Microscope ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Plating Bath ◽  
Bath Solution ◽  
Microscope Images

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

Electroless Plating of Copper Interconnections on Ion Beam Catalyzed Polyimide

1989 ◽  
Vol 167 ◽  
Author(s):  
T. Flottmann ◽  
A. Tulke ◽  
E. Esper ◽  
W. Lohmann
Keyword(s):  
Electroless Plating ◽  
Surface Composition ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Plating Bath ◽  
Chemical Surface ◽  
Polyimide Substrate ◽  
Palladium Acetylacetonate ◽  
Catalytic Sites

AbstractDecomposition of a palladium compound by ion irradiation has been used to catalyze electroless plating on polyimide. First, palladium-acetylacetonate or -acetate is spin-coated on a polyimide substrate. The thin resist film is then irradiated through a mask with He or Ar ions of 100 keV energy. After washing off the film parts which were not exposed to the ion beam, copper is deposited on the catalyzed polyimide substrate in an alkaline electroless plating bath. When using alkaline resistant polyimide, copper lines several microns thick can be plated. The chemical surface composition of the Pd-compounds after ion beam exposure has been investigated with ESCA. It has been found that the Pd is partially reduced. Pd-acetate is more effective to form catalytic sites than Pd-acetylacetonate.

Effect of hydrogen on semiconductor properties and pitting initiation of 2205 duplex stainless steel passivation film

2020 ◽  
Vol 67 (3) ◽  
pp. 313-320 ◽  
Author(s):  
Chuanbo Zheng ◽  
Jiayan Huang ◽  
Gua Yi
Keyword(s):  
Stainless Steel ◽  
Duplex Stainless Steel ◽  
Passive Film ◽  
Corrosion Behavior ◽  
Current Density ◽  
Anodic Polarization ◽  
Content Type ◽  
2205 Duplex Stainless Steel ◽  
Passivation Film ◽  
Semiconductor Properties

Purpose This paper aims to study the effect of current density of hydrogen charging on the semiconductor properties and pitting initiation of 2205 duplex stainless steel (DSS) passivation film. Design/methodology/approach In this work, the 2205 DSS is pre-hydrogenated and passivated. Then, the passivation film is tested by electrochemical impedance method, Mott–Schottky curve method and dynamic potential scanning method. The influences of hydrogen on the properties of the passivation film and the corrosion behavior of the matrix were studied by analyzing the curves obtained in the electrochemical test. The surface of the passivation film after pre-hydrogenation and anodic polarization was observed by using the ultra-depth three-dimensional microscopy and the scanning electron microscope. The integrity, density and corrosion morphology of the passivation film were studied and discussed. Findings With the increase of the hydrogen current density, the growth of the passivation film is hindered, the concentrations of donor and acceptor in the film are increased, the conductivity of the passivation film increases. In the anodic polarization, the dimensional passive current density increases with the increase of the hydrogen current density, and the pitting potential is reversed, the more likely the sample is pitting. In general, hydrogen hinders the formation of the passive film on duplex stainless steel, which increases the concentration of point defects in the passive film. Finally, the passive film is easy to crack and pitting. Originality/value The performance of passive film is an important condition to influence the corrosion behavior of stainless steel. However, little research has been done on the effects of hydrogen on the electrochemistry and pitting sensitivity of 2205 DSS passivation films. The effect of hydrogen on semiconductor properties and pitting initiation of 2205 DSS passivation film is needed to be investigated.

Electroless Silver Plating Process on Al-Ag Alloy Powder

2013 ◽  
Vol 800 ◽  
pp. 256-259
Author(s):  
Wang Qun ◽  
Ye Fan Li ◽  
Dong Mei Li ◽  
Zhi Xue Qu
Keyword(s):  
Electroless Plating ◽  
Alloy Powder ◽  
Glucose Solution ◽  
Silver Content ◽  
Silver Coating ◽  
Chemical Compositions ◽  
Composite Powders ◽  
Plating Bath ◽  
Thiourea Solution ◽  
Electroless Silver Plating

The Ag coating was deposited on the surface of Al-Ag alloy powder by electroless plating process. 10 wt% of AgNO3 was put in the powder for precursor replacement reaction, and then added the powder into electroless plating bath which contained glucose solution, solution of silver ammonia, thiourea solution, tartaric acid solution and absolute ethanol. The effects of formula components were analyzed. The surface morphology of the prepared composite particles was studied with SEM and their chemical compositions were confirmed by XRD. With the chemical etching method, silver content of the powder was determined. The studies have shown that an uniform, complete and dense silver coating for the Al-Ag composite powders was generated by this method, with the silver content being 20wt%, and the conductivity was favorable.

Formation and Structural Characterization of Electroless Ni-B-P Ternary Alloy Coatings

2014 ◽  
Vol 592-594 ◽  
pp. 385-390 ◽  
Author(s):  
P.G. Venkatakrishnan ◽  
S.S. Mohamed Nazirudeen ◽  
T.S.N. Sankara Narayanan
Keyword(s):  
Electroless Plating ◽  
Morphological Characteristics ◽  
Reducing Agents ◽  
Sodium Hypophosphite ◽  
Electron Microscopic ◽  
Plating Bath ◽  
Peak Broadening ◽  
Chloride Hexahydrate ◽  
Electroless Ni

The aim of the present investigation is to study the formation of electroless Ni-B-P alloy coatings and structural and morphological characterization of various coatings with different boron and phosphorous content. An alkaline plating bath with nickel chloride hexahydrate as the source of nickel ions and sodium borohydride and sodium hypophosphite as reducing agents were used for the formation of electroless Ni-B-P alloy coatings. The influence of changes in the concentrations of the reducing agents in the electroless plating bath on the chemical composition, structural and morphological characteristics of the coatings were studied. Scanning electron microscopic studies revealed that the surface morphology of Ni-B-P alloy coatings changed from corn cob-like structure to cauliflower-like structure with increasing borohydride concentration in electroless plating bath, whereas increase in hypophosphite concentration favoured sideway growth, thereby decreased the surface roughness of the Ni-B-P alloy coatings. The peak broadening in the X-Ray Diffraction profiles indicates the large reduction in the crystallite size of the electroless Ni-B-P alloy coatings with increasing boron content in the coating (i.e. for higher borohydride concentration in the plating bath).

Electroless plating of Pd after shielding the bottom of planar porous stainless steel for a highly stable hydrogen selective membrane

2014 ◽  
Vol 467 ◽  
pp. 93-99 ◽  
Author(s):  
Shin-Kun Ryi ◽  
Sung-Wook Lee ◽  
Duck-Kyu Oh ◽  
Beom-Seok Seo ◽  
Jin-Woo Park ◽  
...  
Keyword(s):  
Stainless Steel ◽  
Electroless Plating ◽  
Porous Stainless Steel ◽  
Selective Membrane
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