scholarly journals Fatigue of Smooth Round Bar Specimens and Crack Growth Characteristics of Glass and Silicon Nitride under Static and Cyclic Loading.

1991 ◽  
Vol 40 (458) ◽  
pp. 1491-1496 ◽  
Author(s):  
Hiroto SUGAWARA ◽  
Akio OTSUKA ◽  
Takehiko AMANO
Keyword(s):  
Silicon Nitride ◽  
Cyclic Loading ◽  
Crack Growth ◽  
Growth Characteristics ◽  
Round Bar ◽  
Static And Cyclic Loading

Adhesion and Reliability of Epoxy/Glass Interfaces

2000 ◽  
Vol 123 (4) ◽  
pp. 401-404 ◽  
Author(s):  
John E. Ritter ◽  
Armin Huseinovic
Keyword(s):  
Fatigue Crack ◽  
Cyclic Loading ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Slow Crack Growth ◽  
Cyclic Fatigue ◽  
Aqueous Environments ◽  
Crack Tip Plasticity ◽  
Static And Cyclic Loading ◽  
Microelectronic Components

The reliability of microelectronic components is profoundly influenced by the fracture resistance of the polymer/inorganic interfaces and by the progressive debonding of these interfaces in aqueous environments. Consequently, fatigue (slow) crack growth in epoxy/glass interfaces bonded with the silane coupling agent 3-aminopropyltriethoxysilane (3-APES) was studied under static and cyclic loading at 23°C and in either dry or humid conditions using the double cleavage drilled compression (DCDC) test. Crack growth rates under cyclic loading were significantly greater than under static loading, indicating that stress corrosion effects are negligible and that crack tip plasticity controls cyclic fatigue crack growth at silane (3-APES) bonded epoxy/glass interfaces. After aging at 94°C in water, these silane bonded epoxy/glass interfaces exhibited somewhat greater resistance to cyclic fatigue crack growth than the unaged samples; however, after aging at 98°C in water cyclic fatigue crack growth became cohesive and fractal in nature. Mechanisms for fatigue crack growth at silane (3-APES) bonded epoxy/glass interfaces are discussed.

Evaluation of Tensile Static, Dynamic, and Cyclic Fatigue Behavior for A Hiped Silicon Nitride at Elevated Temperatures

1992 ◽  
Vol 287 ◽  
Author(s):  
Chih-Kuang Jack Lin ◽  
Michael G. Jenkins ◽  
Matitison K. Ferber
Keyword(s):  
Silicon Nitride ◽  
Cyclic Loading ◽  
Crack Growth ◽  
Failure Mechanism ◽  
Fatigue Behavior ◽  
Slow Crack Growth ◽  
Cyclic Fatigue ◽  
Creep Rupture ◽  
Static Fatigue ◽  
Dynamic Fatigue

ABSTRACTTensile fatigue behavior of a hot-isostatically-pressed (HIPed) silicon nitride was investigated over ranges of constant stresses, constant stress rates, and cyclic loading at 1150-1370°C. At 1150°C, static and dynamic fatigue failures were governed by a slow crack growth mechanism. Creep rupture was the dominant failure mechanism in static fatigue at 1260 and 1370°C. A transition of failure mechanism from slow crack growth to creep rupture appeared at stress rates ≤10−2 MPa/s for dynamic fatigue at 1260 and 1370°C. At 1 150-1370°C, cyclic loading appeared to be less damaging than static loading as cyclic fatigue specimens displayed greater failure times than static fatigue specimens under the same maximum stresses.

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