An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid

Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017 ◽

10.23919/date.2017.7927172 ◽

2017 ◽

Cited By ~ 1

Author(s):

Chao Yan ◽

Hengliang Zhu ◽

Dian Zhou ◽

Xuan Zeng

Keyword(s):

Thermal Simulation ◽

Algebraic Multigrid ◽

Simulation Approach ◽

3D Ics ◽

Linearized Model

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A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics

Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis - CODES+ISSS '11 ◽

10.1145/2039370.2039402 ◽

2011 ◽

Cited By ~ 3

Author(s):

Alain Fourmigue ◽

Giovanni Beltrame ◽

Gabriela Nicolescu ◽

El Mostapha Aboulhamid

Keyword(s):

Linear Time ◽

Thermal Simulation ◽

3D Ics ◽

Transient Thermal

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Analysis of Self-Heating in Poly-Si Thin-Film Transistors and Circuits by a Self-Consistent Electro-Thermal Simulation Approach

2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings ◽

10.1109/icsict.2006.306195 ◽

2006 ◽

Author(s):

Xiaojun Guo ◽

S.R.P. Silva

Keyword(s):

Thin Film ◽

Thin Film Transistors ◽

Thermal Simulation ◽

Simulation Approach ◽

Self Heating ◽

Self Consistent ◽

Si Thin Film

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Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias

Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014 ◽

10.7873/date.2014.087 ◽

2014 ◽

Cited By ~ 1

Author(s):

Alain Fourmigue ◽

Giovanni Beltrame ◽

Gabriela Nicolescu

Keyword(s):

Thermal Simulation ◽

Liquid Cooling ◽

Through Silicon Vias ◽

3D Ics ◽

Silicon Vias ◽

Transient Thermal

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Thermal simulation approach to the cooling of a power IGBT by heat pipes

2013 5th International Conference on Modeling, Simulation and Applied Optimization (ICMSAO) ◽

10.1109/icmsao.2013.6552691 ◽

2013 ◽

Cited By ~ 1

Author(s):

Ameni Driss ◽

Samah Maalej ◽

Mohamed Chaker Zaghdoudi

Keyword(s):

Heat Pipes ◽

Thermal Simulation ◽

Simulation Approach

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Using multi time-scale electro-thermal simulation approach to evaluate SiC-MOSFET power converter in virtual prototyping design tool

2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL) ◽

10.1109/compel.2017.8013278 ◽

2017 ◽

Cited By ~ 3

Author(s):

Ke Li ◽

Paul Evans ◽

Mark Johnson

Keyword(s):

Time Scale ◽

Virtual Prototyping ◽

Power Converter ◽

Thermal Simulation ◽

Design Tool ◽

Simulation Approach

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A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications

Proceedings of the 16th International Symposium on Power Semiconductor Devices & IC's ◽

10.1109/wct.2004.239990 ◽

2004 ◽

Cited By ~ 28

Author(s):

Kojima ◽

Yamada ◽

Ciappa ◽

Chiavarini ◽

Fichtner

Keyword(s):

Thermal Simulation ◽

Simulation Approach ◽

Igbt Modules

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Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias

Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014 ◽

10.7873/date2014.087 ◽

2014 ◽

Cited By ~ 1

Author(s):

Alain Fourmigue ◽

Giovanni Beltrame ◽

Gabriela Nicolescu

Keyword(s):

Thermal Simulation ◽

Liquid Cooling ◽

Through Silicon Vias ◽

3D Ics ◽

Silicon Vias ◽

Transient Thermal

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Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs

Journal of Computer and Communications ◽

10.4236/jcc.2016.415003 ◽

2016 ◽

Vol 04 (15) ◽

pp. 33-45 ◽

Cited By ~ 1

Author(s):

Hong-Wen Chiou ◽

Yu-Min Lee

Keyword(s):

Thermal Simulation ◽

Liquid Cooling ◽

Two Phase ◽

3D Ics ◽

Phase Liquid

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Investigation of in situ soil-atmosphere interaction with a hydro-thermal simulation approach: application to an instrumented site

European Journal of Environmental and Civil engineering ◽

10.1080/19648189.2019.1681297 ◽

2019 ◽

pp. 1-24 ◽

Cited By ~ 1

Author(s):

Hossein Nowamooz ◽

Hossein Assadollahi

Keyword(s):

Thermal Simulation ◽

Simulation Approach ◽

Soil Atmosphere ◽

Atmosphere Interaction

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A novel electro-thermal simulation approach to inverter power modules for electric vehicle

2012 IEEE 6th International Conference on Information and Automation for Sustainability ◽

10.1109/iciafs.2012.6419912 ◽

2012 ◽

Author(s):

Dan Liu ◽

Lei Zhu ◽

Liang Kong ◽

Jin Zhang ◽

Jun Liu

Keyword(s):

Electric Vehicle ◽

Thermal Simulation ◽

Simulation Approach ◽

Power Modules

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