Development of the combined spatial and temporal pulse modulation for the laser impulse metal bonding process

2021 ◽  
Vol 33 (1) ◽  
pp. 012011
Author(s):  
Woo-Sik Chung ◽  
Lianzhi Wen ◽  
Alexander Olowinsky
Keyword(s):  
Bonding Process ◽  
Pulse Modulation ◽  
Metal Bonding ◽  
Laser Impulse ◽  
Temporal Pulse

scholarly journals Study on the thermal load of the laser impulse metal bonding process to the metallized thermal sensitive substrate

2020 ◽  
Author(s):  
W.-S. Chung ◽  
F. Nagel ◽  
A. Olowinsky ◽  
A. Gillner
Keyword(s):  
Thermal Load ◽  
Thermal Destruction ◽  
Metal Layer ◽  
Welding Process ◽  
Bonding Process ◽  
Electronic Components ◽  
Metal Bonding ◽  
Novel Approach ◽  
Laser Impulse ◽  
Joining Process

AbstractThe laser impulse metal bonding (LIMBO) process opens a new possibility to join a thick interconnector on a thin metal layer which lays on a sensitive substrate such as epoxy resin (FR4) material. Since the FR4 tolerates only limited amount of the thermal load during the joining process, the LIMBO process applies a novel approach to separate the melting and joining phase. Hence, the thermal load on the underlying substrate during the joining phase is minimized and therefore allows a welding approach even for electric as well as electronic components. However, the substrate is thermally affected due to the heat conduction which is induced during the joining phase. In this paper, the thermal cycle induced to the sensitive substrate during the LIMBO process and the overlap welding process for enlarging the weld joint area will be investigated. To evaluate the maximal amount of thermal load on the sensitive substrate below a thin copper layer by given setting, the thermal destruction threshold of substrate is exceeded on purpose. For the understanding of the heat distribution during the joining stage, the experimental results are validated with simulation results.

scholarly journals Investigation of the melt dynamics during the laser impulse metal bonding process with keyhole measurement

Procedia CIRP ◽  
2020 ◽  
Vol 94 ◽  
pp. 753-757
Author(s):  
Woo-Sik Chung ◽  
Justin Reska ◽  
Alexander Olowinsky ◽  
Arnold Gillner
Keyword(s):  
Bonding Process ◽  
Metal Bonding ◽  
Laser Impulse

scholarly journals Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles

2013 ◽  
Vol 54 (6) ◽  
pp. 879-883 ◽  
Author(s):  
Jianfeng Yan ◽  
Guisheng Zou ◽  
Yingchuan Zhang ◽  
Jiaxin Li ◽  
Lei Liu ◽  
...  
Keyword(s):  
Bonding Process ◽  
Metal Bonding ◽  
Mixed Nanoparticles

scholarly journals Metal–metal bonding process using cuprous oxide nanoparticles

2016 ◽  
Vol 5 (4) ◽  
pp. 345-352 ◽  
Author(s):  
Yoshio Kobayashi ◽  
Takafumi Maeda ◽  
Yusuke Yasuda ◽  
Toshiaki Morita
Keyword(s):  
Cuprous Oxide ◽  
Bonding Process ◽  
Oxide Nanoparticles ◽  
Metal Bonding ◽  
Cuprous Oxide Nanoparticles ◽  
Metal Metal

scholarly journals A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag2O microparticles

2009 ◽  
Vol 165 ◽  
pp. 012074 ◽  
Author(s):  
Akio Hirose ◽  
Hiroaki Tatsumi ◽  
Naoya Takeda ◽  
Yusuke Akada ◽  
Tomo Ogura ◽  
...  
Keyword(s):  
Ag Nanoparticles ◽  
Bonding Process ◽  
Metal Bonding ◽  
In Situ Formation

Metal?metal bonding process using Ag metallo-organic nanoparticles

2005 ◽  
Vol 53 (8) ◽  
pp. 2385-2393 ◽  
Author(s):  
E IDE ◽  
S ANGATA ◽  
A HIROSE ◽  
K KOBAYASHI
Keyword(s):  
Bonding Process ◽  
Organic Nanoparticles ◽  
Metal Bonding ◽  
Metal Metal

Low-Temperature Metal^|^#8211;Metal Bonding Process Using Leaf-Like Aggregates Composed of CuO Nanoparticles

2015 ◽  
Vol 48 (1) ◽  
pp. 1-6 ◽  
Author(s):  
Takafumi Maeda ◽  
Yoshio Kobayashi ◽  
Yusuke Yasuda ◽  
Toshiaki Morita
Keyword(s):  
Low Temperature ◽  
Bonding Process ◽  
Cuo Nanoparticles ◽  
Metal Bonding

Preparation of copper nanoparticles and metal-metal bonding process using them

2013 ◽  
Vol 10 (2) ◽  
pp. 113-118 ◽  
Author(s):  
Y. Kobayashi ◽  
S. Ishida ◽  
K. Ihara ◽  
Y. Yasuda ◽  
T. Morita
Keyword(s):  
Copper Nanoparticles ◽  
Bonding Process ◽  
Metal Bonding ◽  
Metal Metal
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