Diffractive/refractive hybrid F-theta lens for laser drilling of multilayer printed circuit boards

Author(s):  
Keiji Fuse ◽  
Takeshi Okada ◽  
Keiji Ebata
2019 ◽  
Vol 2 (1) ◽  
pp. 61-68
Author(s):  
György Meszlényi ◽  
Enikő Bitay

Abstract The laser processing of materials which are highly reflective at laser wavelengths is problematic. We have to take into account that only a small part of the energy is absorbed, the main part being reflected. In this article we examine the laser processing of highly reflective copper and silver at 1070 nm wavelength. In laser drilling of printed circuit boards it is necessary to drill copper layer as well. In highly reflecting materials we can drill smaller holes because of the low energy efficiency. Naturally in single pulse laser drilling the focus position plays a key role: at the focal spot of the laser beam smaller diameter holes are produced, further from the focal spot, higher diameter holes are produced.


Circuit World ◽  
1984 ◽  
Vol 11 (1) ◽  
pp. 13-29 ◽  
Author(s):  
M.N. Watson

1990 ◽  
Vol 13 (4) ◽  
pp. 1055-1062 ◽  
Author(s):  
A. Kestenbaum ◽  
J.F. D'Amico ◽  
B.J. Blumenstock ◽  
M.A. DeAngelo

1997 ◽  
Author(s):  
Shozui Takeno ◽  
Masaharu Moriyasu ◽  
Masaki Kuzumoto

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