Effect of Chlorhexidine Application Methods on Microtensile Bond Strength to Dentin in Class I Cavities

2010 ◽  
Vol 35 (6) ◽  
pp. 618-623 ◽  
Author(s):  
Y-E. Chang ◽  
D-H. Shin
Keyword(s):  
Clinical Practice ◽  
Phosphoric Acid ◽  
Bond Strength ◽  
Clinical Relevance ◽  
Class I ◽  
Microtensile Bond Strength ◽  
High Bond ◽  
High Bond Strength ◽  
Application Methods

Clinical Relevance In order to secure high bond strength in clinical practice, 2% chlorhexidine application after etching with 37% phosphoric acid is the recommended procedure.

scholarly journals Effect of the C-factor and Dentin Preparation Method in the Bond Strength of a Mild Self-etch Adhesive

2009 ◽  
Vol 34 (4) ◽  
pp. 452-459 ◽  
Author(s):  
M. S. M. Marques ◽  
S. Kenshima ◽  
A. Muench ◽  
R. Y. Ballester ◽  
L. E. Rodrigues Filho
Keyword(s):  
Bond Strength ◽  
Clinical Relevance ◽  
Preparation Method ◽  
Strength Performance ◽  
High Bond ◽  
High Bond Strength ◽  
Self Etch

Clinical Relevance A course cut carbide bur should be avoided prior to a mild self-etch adhesive, because it adversely affected bond strength. In contrast, a fine cut carbide bur provided the best combination: high bond strength with low variability, which suggests more reliable bond strength performance.

Effect of Chlorhexidine Application on Microtensile Bond Strength to Dentin

10.2341/07-69 ◽  
2008 ◽  
Vol 33 (2) ◽  
pp. 183-188 ◽  
Author(s):  
C. J. Soares ◽  
C. A. Pereira ◽  
J. C. Pereira ◽  
F. R. Santana ◽  
C. J. Prado
Keyword(s):  
Adverse Effect ◽  
Phosphoric Acid ◽  
Bond Strength ◽  
Clinical Relevance ◽  
Acid Etching ◽  
Microtensile Bond Strength ◽  
Phosphoric Acid Etching ◽  
Chlorhexidine Solution

Clinical Relevance Based on the results of this study, the application of chlorhexidine solution at a concentration of 0.12 and 2% before, after or associated with phosphoric acid etching, presented similar behavior with no adverse effect on 24-hour bond strength.

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

2005 ◽  
Author(s):  
J. Wei ◽  
S. S. Deng ◽  
C. M. Tan
Keyword(s):  
Low Temperature ◽  
Bond Strength ◽  
Wafer Bonding ◽  
Intermediate Layer ◽  
Bonding Temperature ◽  
Sol Gel ◽  
Bond Quality ◽  
Bubble Generation ◽  
High Bond ◽  
High Bond Strength

Silicon-to-silicon wafer bonding by sol-gel intermediate layer has been performed using acid-catalyzed tetraethylthosilicate-ethanol-water sol solution. High bond strength near to the fracture strength of bulk silicon is obtained at low temperature, for example 100°C. However, The bond efficiency and bond strength of this intermediate layer bonding sharply decrease when the bonding temperature increases to elevated temperature, such as 300 °C. The degradation of bond quality is found to be related to the decomposition of residual organic species at elevated bonding temperature. The bubble generation and the mechanism of the high bond strength at low temperature are exploited.

Influence of Er,Cr:YSGG Laser Treatment on Microtensile Bond Strength of Adhesives to Enamel

2008 ◽  
Vol 33 (4) ◽  
pp. 448-455 ◽  
Author(s):  
M. V. Cardoso ◽  
J. De Munck ◽  
E. Coutinho ◽  
R. B. Ermis ◽  
K. Van Landuyt ◽  
...  
Keyword(s):  
Bond Strength ◽  
Laser Irradiation ◽  
Laser Treatment ◽  
Clinical Relevance ◽  
Microtensile Bond Strength ◽  
Morphological Alterations

Clinical Relevance Er,Cr:YSGG laser irradiation produced morphological alterations on enamel, which may adversely influence the bond strength of certain adhesives, depending on their approach and composition.

Bonding of Polyethylene to Metals and Rubber with Hydrogenated Polybutadiene

1962 ◽  
Vol 35 (4) ◽  
pp. 1060-1062
Author(s):  
A. I. Yakubchik ◽  
S. Ya Grilikhes ◽  
B. I. Tikhomirov ◽  
V. S. Purlova
Keyword(s):  
Bond Strength ◽  
Adhesive Composition ◽  
High Bond ◽  
High Bond Strength ◽  
Hydrogenated Polybutadiene

Abstract The adhesive composition based on hydrogenated unbranched 1,4-polybutadiene gives a high bond strength between polyethylene and brass, and brass-plated metal, and rubber.

scholarly journals Numerical Analysis for the Progressive Failure of Binary-Medium Interface under Shearing

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Rihong Cao ◽  
Wenyu Tang ◽  
Hang Lin ◽  
Xiang Fan
Keyword(s):  
Shear Strength ◽  
Bond Strength ◽  
Normal Stress ◽  
Strength Ratio ◽  
Normal Stresses ◽  
Stress Increase ◽  
Tensile Cracks ◽  
Medium Interface ◽  
High Bond ◽  
High Bond Strength

Binary-medium specimens were fabricated using the particle flow code, and the shear strength, dilatancy, and failure behavior of the binary-medium specimens with different bond strength ratios (0.25, 0.5, 0.75, and 1.0) under different normal stresses were studied. Numerical results show that the bond strength ratio and normal stresses considerably influence the shear strengths of binary-medium interface. Shear strength increases as the bond strength ratio and normal stress increase. The dilation of interfaces with high bond strength ratios is more evident than those of interfaces with lower bond strength ratios, and the curves for the high bond strength ratio exhibit remarkable fluctuations during the residual stage. At increased normal stress and bond strength ratio, the peak dilation angle shows decreasing and increasing trends successively. In this study, the specimens exhibited three kinds of failure modes. In mode II, the sawtooth experienced shear failure, but some tensile cracks appeared on the interface of the binary-medium. In mode III, no sawtooth was cut off, indicating tensile failure on the interface. At a low bond strength ratio, damage or failure is mostly concentrated in the upper part of the model. Failure parts gradually transfer to the lower part of the model when the bond strength ratio and normal stress increase. Furthermore, evident tensile cracks occur on the interface. When the bond strength ratio reaches 1.0, the failure mode of the specimen gradually transforms from sheared-off failure to chip-off failure. The number of microcracks in the specimens indicates that the lower the bond strength ratio, the more severe the damage on the specimens.

scholarly journals Research on the Properties of High-strength Gypsum Based Tile Adhesive in Interior Decoration

2020 ◽  
Vol 165 ◽  
pp. 05015
Author(s):  
Ji Xiu Zhang ◽  
Ye Zhang ◽  
Ji Kang Liu ◽  
Yuan Chao Miao ◽  
Sai Hong Duan
Keyword(s):  
Bond Strength ◽  
Dimensional Stability ◽  
High Strength ◽  
High Dimensional ◽  
Strength Development ◽  
Interior Decoration ◽  
High Bond ◽  
High Bond Strength ◽  
Early Strength ◽  
Interface Treatment

In this paper, a new early strength tile adhesive is prepared by using α- high strength gypsum and its properties are discussed. The research methods refer to relevant Chinese standards. The results show that the tensile bond strength of the adhesive can reach 0.6 MPa in one day and 1.5 MPa in 7 days, which is close to 80% of 28-day strength. It is indicating that the adhesive has high bond strength, rapid strength development, and high dimensional stability. It effectively solves the problems that the traditional cement-based tile adhesive is prone to hollowing, falling off, and cracking. Additionally, no interface treatment is required during the using process of this gypsum-based adhesive.

The Effect of Energy Application Sequence on the Microtensile Bond Strength of Different C-factor Cavity Preparations

10.2341/06-30 ◽  
2007 ◽  
Vol 32 (2) ◽  
pp. 124-132 ◽  
Author(s):  
G. Maghaireh ◽  
M. R. Bouschlicher ◽  
F. Qian ◽  
S. R. Armstrong
Keyword(s):  
Bond Strength ◽  
Clinical Relevance ◽  
High Irradiance ◽  
Resin Composites ◽  
Microtensile Bond Strength ◽  
Light Curing ◽  
Bond Strengths ◽  
Energy Application

Clinical Relevance Light curing of resin composites in high C-factor cavity preparations using a high irradiance energy application sequence may lead to decreased bond strength. However, the high irradiance energy application sequence did not result in lower bond strengths in lower C-factor cavity preparations.

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