scholarly journals Effective thermal conductivity of complicated hierarchic multilayer fabric

2014 ◽  
Vol 18 (5) ◽  
pp. 1613-1618 ◽  
Author(s):  
Jie Fan ◽  
Na Zhu ◽  
Zhi Liu ◽  
Qian Cheng ◽  
Yong Liu
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Geometric Feature ◽  
Retention Efficiency

Warm retention property of fabric is one of the most important factors for clothing comfortability. The worm retention efficiency of a multilayer fabric with hierarchic inner structure was investigated based on its geometric feature. The thermal resistance of the multilayer fabric increases as the layer of the fabric increases.

Determining the thermal resistance of a highly insulated wall containing vacuum insulation panels through experimental, calculation and numerical simulation methods

2020 ◽  
pp. 174425912098003
Author(s):  
Travis V Moore ◽  
Cynthia A. Cruickshank ◽  
Ian Beausoleil-Morrison ◽  
Michael Lacasse
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Edge Effect ◽  
3D Simulation ◽  
Simulation Methods ◽  
Zone Method ◽  
Vacuum Insulation ◽  
Thermal Bridges ◽  
Wall Assembly

The purpose of this paper is to investigate the potential for calculation methods to determine the thermal resistance of a wall system containing vacuum insulation panels (VIPs) that has been experimentally characterised using a guarded hot box (GHB) apparatus. The VIPs used in the wall assembly have not been characterised separately to the wall assembly, and therefore exact knowledge of the thermal performance of the VIP including edge effect is not known. The calculations and simulations are completed using methods found in literature as well as manufacturer published values for the VIPs to determine the potential for calculation and simulation methods to predict the thermal resistance of the wall assembly without the exact characterisation of the VIP edge effect. The results demonstrate that disregarding the effect of VIP thermal bridges results in overestimating the thermal resistance of the wall assembly in all calculation and simulation methods, ranging from overestimates of 21% to 58%. Accounting for the VIP thermal bridges using the manufacturer advertised effective thermal conductivity of the VIPs resulted in three methods predicting the thermal resistance of the wall assembly within the uncertainty of the GHB results: the isothermal planes method, modified zone method and the 3D simulation. Of these methods only the 3D simulation can be considered a potential valid method for energy code compliance, as the isothermal planes method requires too drastic an assumption to be valid and the modified zone method requires extrapolating the zone factor beyond values which have been validated. The results of this work demonstrate that 3D simulations do show potential for use in lieu of guarded hot box testing for predicting the thermal resistance of wall assemblies containing both VIPs and steel studs. However, knowledge of the VIP effective thermal conductivity is imperative to achieve reasonable results.

Effective Thermal Conductivity of Functionally Graded Particulate Nanocomposites With Interfacial Thermal Resistance

2008 ◽  
Vol 75 (5) ◽  
Author(s):  
H. M. Yin ◽  
G. H. Paulino ◽  
W. G. Buttlar ◽  
L. Z. Sun
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Functionally Graded ◽  
Interfacial Thermal Resistance ◽  
Conductivity Distribution ◽  
Consistent Model ◽  
The Matrix ◽  
Graded Material ◽  
Perfect Interface

By means of a fundamental solution for a single inhomogeneity embedded in a functionally graded material matrix, a self-consistent model is proposed to investigate the effective thermal conductivity distribution in a functionally graded particulate nanocomposite. The “Kapitza thermal resistance” along the interface between a particle and the matrix is simulated with a perfect interface but a lower thermal conductivity of the particle. The results indicate that the effective thermal conductivity distribution greatly depends on Kapitza thermal resistance, particle size, and degree of material gradient.

Effective Thermal Conductivity of Submicron Powders: A Numerical Study

2016 ◽  
Vol 846 ◽  
pp. 500-505
Author(s):  
Wei Jing Dai ◽  
Yi Xiang Gan ◽  
Dorian Hanaor
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Granular Materials ◽  
Gas Phase ◽  
Numerical Study ◽  
Transfer Model ◽  
Size Of Particles ◽  
Contact Unit

Effective thermal conductivity is an important property of granular materials in engineering applications and industrial processes, including the blending and mixing of powders, sintering of ceramics and refractory metals, and electrochemical interactions in fuel cells and Li-ion batteries. The thermo-mechanical properties of granular materials with macroscopic particle sizes (above 1 mm) have been investigated experimentally and theoretically, but knowledge remains limited for materials consisting of micro/nanosized grains. In this work we study the effective thermal conductivity of micro/nanopowders under varying conditions of mechanical stress and gas pressure via the discrete thermal resistance method. In this proposed method, a unit cell of contact structure is regarded as one thermal resistor. Thermal transport between two contacting particles and through the gas phase (including conduction in the gas phase and heat transfer of solid-gas interfaces) are the main mechanisms. Due to the small size of particles, the gas phase is limited to a small volume and a simplified gas heat transfer model is applied considering the Knudsen number. During loading, changes in the gas volume and the contact area between particles are simulated by the finite element method. The thermal resistance of one contact unit is calculated through the combination of the heat transfer mechanisms. A simplified relationship between effective thermal conductivity and loading pressure can be obtained by integrating the contact units of the compacted powders.

Effective Thermal Conductivity of Composites with Contact Thermal Resistance between the Inclusions and the Matrix

2020 ◽  
Vol 40 (8) ◽  
pp. 622-627
Author(s):  
I. V. Lavrov ◽  
A. A. Kochetygov ◽  
V. V. Bardushkin ◽  
A. P. Sychev ◽  
V. B. Yakovlev
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Contact Thermal Resistance ◽  
The Matrix

Study of Effective Thermal Conductivity of Glazed Hollow Bead Concrete

2016 ◽  
Vol 851 ◽  
pp. 823-828
Author(s):  
Bing Zhang ◽  
Zhong Qing Cheng
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Thermal Conductivity Coefficient ◽  
Interface Thermal Resistance

Based on analyzing the mechanism of thermal conductivity of glazed hollow bead concrete, this paper divides the channels of thermal conductivity in concrete, constructs the model of thermal conductivity coefficient based on the Theory of Minimum Thermal Resistance, and confirms the model by using the data of other related literatures and the data of our own experiment. The consequence indicates that this model can calculate the thermal conductivity coefficient under arid state exactly. In order to improve the accuracy of this model, we should take the shape of framework, the interface thermal resistance between concrete and framework into consideration

Multi-scale thermal modeling of glass interposer for mobile electronics application

2016 ◽  
Vol 26 (3/4) ◽  
pp. 1157-1171 ◽  
Author(s):  
Sangbeom Cho ◽  
Venky Sundaram ◽  
Rao Tummala ◽  
Yogendra Joshi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Thermal Performance ◽  
Memory Bandwidth ◽  
Vapor Chamber ◽  
Packaging Technology ◽  
Content Type ◽  
Low Thermal Conductivity ◽  
Multi Scale

Purpose – The functionality of personal mobile electronics continues to increase, in turn driving the demand for higher logic-to-memory bandwidth. However, the number of inputs/outputs supported by the current packaging technology is limited by the smallest achievable electrical line spacing, and the associated noise performance. Also, a growing trend in mobile systems is for the memory chips to be stacked to address the growing demand for memory bandwidth, which in turn gives rise to heat removal challenges. The glass interposer substrate is a promising packaging technology to address these emerging demands, because of its many advantages over the traditional organic substrate technology. However, glass has a fundamental limitation, namely low thermal conductivity (∼1 W/m K). The purpose of this paper is to quantify the thermal performance of glass interposer-based electronic packages by solving a multi-scale heat transfer problem for an interposer structure. Also, this paper studies the possible improvement in thermal performance by integrating a fluidic heat spreader or vapor chamber within the interposer. Design/methodology/approach – This paper illustrates the multi-scale modeling approach applied for different components of the interposer, including Through Package Vias (TPVs) and copper traces. For geometrically intricate and repeating structures, such as interconnects and TPVs, the unit cell effective thermal conductivity approach was used. For non-repeating patterns, such as copper traces in redistribution layer, CAD drawing-based thermal resistance network analysis was used. At the end, the thermal performance of vapor chamber integrated within a glass interposer was estimated by using an enhanced effective thermal conductivity, calculated from the published thermal resistance data, in conjunction with the analytical expression for thermal resistance for a given geometry of the vapor chamber. Findings – The limitations arising from the low thermal conductivity of glass can be addressed by using copper structures and vapor chamber technology. Originality/value – A few reports can be found on thermal performance of glass interposers. However thermal characteristics of glass interposer with advanced cooling technology have not been reported.

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