scholarly journals Laser Materials Development by Means of A Solid-State Bonding Method

2011 ◽  
Vol 39 (5) ◽  
pp. 326-331
Author(s):  
Akira SUGIYAMA
Keyword(s):  
Solid State ◽  
Laser Materials ◽  
Materials Development ◽  
Solid State Bonding ◽  
Bonding Method

Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

2014 ◽  
Vol 129 ◽  
pp. 43-45 ◽  
Author(s):  
Yunhua Deng ◽  
Qiao Guan ◽  
Bing Wu ◽  
Xichang Wang ◽  
Jun Tao
Keyword(s):  
Solid State ◽  
Solid State Bonding ◽  
Bonding Method

A low-temperature solid-state bonding method based on copper bump coated with nickel microcones and silver buffer

2016 ◽  
Vol 181 ◽  
pp. 165-168 ◽  
Author(s):  
Fengtian Hu ◽  
Penghui Xu ◽  
Wenqi Zhang ◽  
Anmin Hu ◽  
Ming Li
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Solid State Bonding ◽  
Bonding Method

A Study of Solid State Bonding Strength of Nonferrous Metals by Using Metal Salt Generation Bonding Method

2014 ◽  
Vol 783-786 ◽  
pp. 2450-2455
Author(s):  
Shinji Koyama
Keyword(s):  
Solid State ◽  
Formic Acid ◽  
Metal Salt ◽  
Bonding Temperature ◽  
Copper Surface ◽  
Solid State Bonding ◽  
Bonded Joint ◽  
Set Up ◽  
Bonding Method ◽  
Aluminum Surfaces

In recent years, an enormous pressure was put on the need to design and develop products that are compliant with the stringent environmental regulations set up various countries. Among the problems that need to be addressed is the need to design and develop environmentally friendly products that are energy efficient and easy to recycle. In this study, the effect of metal salt generation processing on the tensile strength of the bonded interface of Al/Al and Al/Cu was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 30 s and 98% formic acid for 60 s. Copper surface were modified by boiling 98% formic acid for 60 s. Solid-state bonding was performed at bonding temperature of 673 ~ 813 K and under a pressure of 6 MPa ( bonding time of 1.8 ks). Using metal salt generation bonding technique, the bonded joint is able to reach 0.2% proof stress at lower bonding temperature and with less deformation.

Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

2013 ◽  
Vol 268 ◽  
pp. 368-372 ◽  
Author(s):  
Qin Lu ◽  
Zhuo Chen ◽  
Wenjing Zhang ◽  
Anmin Hu ◽  
Ming Li
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Solid State Bonding ◽  
Bonding Method

Failure Behavior of Pressurized Spherical Tanks Depending on Manufacturing Method

2006 ◽  
Vol 324-325 ◽  
pp. 551-554 ◽  
Author(s):  
Ho Sung Lee ◽  
Jong Hoon Yoon ◽  
Yeong Moo Yi
Keyword(s):  
Acoustic Emission ◽  
Solid State ◽  
Failure Mode ◽  
Welding Process ◽  
Pressure Vessels ◽  
Failure Behavior ◽  
Homogeneous Microstructure ◽  
Solid State Bonding ◽  
Pressurization Rate ◽  
Bonding Method

There are numerous applications of pressure vessels in aerospace field for storing liquid or gaseous media. Generally the metallic vessels have been manufactured by welding two hemispheres, which are machined or spin-formed. In this study, the solid state bonding method was utilized with blow forming to manufacture aerospace titanium tanks. This solid state joining technology replaced the welding process and without any secondary material or liquid phases in bonding process, homogeneous microstructure was obtained at bonding interface. Using this method, a titanium tank of a space vehicle was manufactured and during a hydraulic pressurizing test, the strain and acoustic emission signals are observed to investigate the effect of solid state bonding method on the failure mode and performance of the tank.. This result was compared with the one made by conventional method of spin forming and welding. The result shows that the pressurization rate and the acoustic emission signal increasing rate provide a similar tendency for a vessel of integrity, while the signal increasing rate is much higher than the pressurization rate for a vessel with welding defects. It is clear that the failure mode of the solid state bonded tank is different from the welded tank due to the completely united interface by diffusion process.

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